SE365068B - - Google Patents

Info

Publication number
SE365068B
SE365068B SE13180/70A SE1318070A SE365068B SE 365068 B SE365068 B SE 365068B SE 13180/70 A SE13180/70 A SE 13180/70A SE 1318070 A SE1318070 A SE 1318070A SE 365068 B SE365068 B SE 365068B
Authority
SE
Sweden
Application number
SE13180/70A
Inventor
J Burns
A Coucoulas
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of SE365068B publication Critical patent/SE365068B/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/222Completing of printed circuits by adding non-printed jumper connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/14Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142Metallic substrates having insulating layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5381Crossover interconnections, e.g. bridge stepovers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Multi-Conductor Connections (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
SE13180/70A 1969-10-08 1970-09-29 SE365068B (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86485669A 1969-10-08 1969-10-08

Publications (1)

Publication Number Publication Date
SE365068B true SE365068B (xx) 1974-03-11

Family

ID=25344227

Family Applications (1)

Application Number Title Priority Date Filing Date
SE13180/70A SE365068B (xx) 1969-10-08 1970-09-29

Country Status (10)

Country Link
JP (1) JPS509342B1 (xx)
BE (1) BE757162A (xx)
CH (1) CH528148A (xx)
DE (1) DE2049163C3 (xx)
ES (1) ES384535A1 (xx)
FR (1) FR2065090A5 (xx)
GB (1) GB1315510A (xx)
IE (1) IE34642B1 (xx)
NL (1) NL145718B (xx)
SE (1) SE365068B (xx)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5377737U (xx) * 1976-11-26 1978-06-28
DE2823881C3 (de) * 1978-05-31 1982-03-18 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von elektrischen Dünnschichtschaltungen für die Herstellung integrierter Leiterbahnüberkreuzungen
DE3064555D1 (en) * 1979-02-26 1983-09-22 Nat Res Dev Method of incorporating a distributed microwave circuit element in a microwave integrated circuit
US5699224A (en) * 1995-10-25 1997-12-16 Rohm Co., Ltd. Thick-film capacitor and chip-type composite electronic component utilizing the same
CN107086095B (zh) * 2017-06-22 2023-05-16 中国船舶重工集团公司第七0三研究所 一种电阻负载导流罩

Also Published As

Publication number Publication date
NL145718B (nl) 1975-04-15
GB1315510A (en) 1973-05-02
BE757162A (fr) 1971-03-16
DE2049163C3 (de) 1978-07-06
JPS509342B1 (xx) 1975-04-11
FR2065090A5 (xx) 1971-07-23
NL7014581A (xx) 1971-04-14
IE34642B1 (en) 1975-07-09
DE2049163A1 (de) 1971-04-22
ES384535A1 (es) 1974-06-01
DE2049163B2 (de) 1977-11-10
CH528148A (de) 1972-09-15
IE34642L (en) 1971-04-08

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