BE757162A - Procede de liaison d'un ou plusieurs elements a un substrat - Google Patents

Procede de liaison d'un ou plusieurs elements a un substrat

Info

Publication number
BE757162A
BE757162A BE757162DA BE757162A BE 757162 A BE757162 A BE 757162A BE 757162D A BE757162D A BE 757162DA BE 757162 A BE757162 A BE 757162A
Authority
BE
Belgium
Prior art keywords
binding
procedure
substrate
elements
Prior art date
Application number
Other languages
English (en)
Inventor
J A Burns Eta Coucoulas
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of BE757162A publication Critical patent/BE757162A/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5381—Crossover interconnections, e.g. bridge stepovers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Combinations Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
BE757162D 1969-10-08 Procede de liaison d'un ou plusieurs elements a un substrat BE757162A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86485669A 1969-10-08 1969-10-08

Publications (1)

Publication Number Publication Date
BE757162A true BE757162A (fr) 1971-03-16

Family

ID=25344227

Family Applications (1)

Application Number Title Priority Date Filing Date
BE757162D BE757162A (fr) 1969-10-08 Procede de liaison d'un ou plusieurs elements a un substrat

Country Status (10)

Country Link
JP (1) JPS509342B1 (fr)
BE (1) BE757162A (fr)
CH (1) CH528148A (fr)
DE (1) DE2049163C3 (fr)
ES (1) ES384535A1 (fr)
FR (1) FR2065090A5 (fr)
GB (1) GB1315510A (fr)
IE (1) IE34642B1 (fr)
NL (1) NL145718B (fr)
SE (1) SE365068B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107086095A (zh) * 2017-06-22 2017-08-22 中国船舶重工集团公司第七0三研究所 一种电阻负载导流罩

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5377737U (fr) * 1976-11-26 1978-06-28
DE2823881C3 (de) * 1978-05-31 1982-03-18 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von elektrischen Dünnschichtschaltungen für die Herstellung integrierter Leiterbahnüberkreuzungen
DE3064555D1 (en) * 1979-02-26 1983-09-22 Nat Res Dev Method of incorporating a distributed microwave circuit element in a microwave integrated circuit
US5699224A (en) * 1995-10-25 1997-12-16 Rohm Co., Ltd. Thick-film capacitor and chip-type composite electronic component utilizing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107086095A (zh) * 2017-06-22 2017-08-22 中国船舶重工集团公司第七0三研究所 一种电阻负载导流罩
CN107086095B (zh) * 2017-06-22 2023-05-16 中国船舶重工集团公司第七0三研究所 一种电阻负载导流罩

Also Published As

Publication number Publication date
DE2049163B2 (de) 1977-11-10
SE365068B (fr) 1974-03-11
IE34642L (en) 1971-04-08
DE2049163A1 (de) 1971-04-22
NL145718B (nl) 1975-04-15
IE34642B1 (en) 1975-07-09
GB1315510A (en) 1973-05-02
NL7014581A (fr) 1971-04-14
JPS509342B1 (fr) 1975-04-11
CH528148A (de) 1972-09-15
ES384535A1 (es) 1974-06-01
FR2065090A5 (fr) 1971-07-23
DE2049163C3 (de) 1978-07-06

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