FR2065090A5 - - Google Patents

Info

Publication number
FR2065090A5
FR2065090A5 FR7036094A FR7036094A FR2065090A5 FR 2065090 A5 FR2065090 A5 FR 2065090A5 FR 7036094 A FR7036094 A FR 7036094A FR 7036094 A FR7036094 A FR 7036094A FR 2065090 A5 FR2065090 A5 FR 2065090A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7036094A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Application granted granted Critical
Publication of FR2065090A5 publication Critical patent/FR2065090A5/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5381—Crossover interconnections, e.g. bridge stepovers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Multi-Conductor Connections (AREA)
FR7036094A 1969-10-08 1970-10-06 Expired FR2065090A5 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86485669A 1969-10-08 1969-10-08

Publications (1)

Publication Number Publication Date
FR2065090A5 true FR2065090A5 (fr) 1971-07-23

Family

ID=25344227

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7036094A Expired FR2065090A5 (fr) 1969-10-08 1970-10-06

Country Status (10)

Country Link
JP (1) JPS509342B1 (fr)
BE (1) BE757162A (fr)
CH (1) CH528148A (fr)
DE (1) DE2049163C3 (fr)
ES (1) ES384535A1 (fr)
FR (1) FR2065090A5 (fr)
GB (1) GB1315510A (fr)
IE (1) IE34642B1 (fr)
NL (1) NL145718B (fr)
SE (1) SE365068B (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0005739A1 (fr) * 1978-05-31 1979-12-12 Siemens Aktiengesellschaft Procédé de réalisation de câblages croisés pour circuits RC intégrés
EP0015100A1 (fr) * 1979-02-26 1980-09-03 National Research Development Corporation Procédé d'incorporation d'un élément de circuit distribué à micro-ondes dans un circuit intégré à micro-ondes

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5377737U (fr) * 1976-11-26 1978-06-28
US5699224A (en) * 1995-10-25 1997-12-16 Rohm Co., Ltd. Thick-film capacitor and chip-type composite electronic component utilizing the same
CN107086095B (zh) * 2017-06-22 2023-05-16 中国船舶重工集团公司第七0三研究所 一种电阻负载导流罩

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0005739A1 (fr) * 1978-05-31 1979-12-12 Siemens Aktiengesellschaft Procédé de réalisation de câblages croisés pour circuits RC intégrés
EP0015100A1 (fr) * 1979-02-26 1980-09-03 National Research Development Corporation Procédé d'incorporation d'un élément de circuit distribué à micro-ondes dans un circuit intégré à micro-ondes
US4329779A (en) * 1979-02-26 1982-05-18 National Research Development Corporation Methods of applying circuit elements to a substrate

Also Published As

Publication number Publication date
CH528148A (de) 1972-09-15
JPS509342B1 (fr) 1975-04-11
ES384535A1 (es) 1974-06-01
IE34642L (en) 1971-04-08
NL7014581A (fr) 1971-04-14
DE2049163C3 (de) 1978-07-06
GB1315510A (en) 1973-05-02
DE2049163B2 (de) 1977-11-10
DE2049163A1 (de) 1971-04-22
BE757162A (fr) 1971-03-16
SE365068B (fr) 1974-03-11
NL145718B (nl) 1975-04-15
IE34642B1 (en) 1975-07-09

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Legal Events

Date Code Title Description
ST Notification of lapse