GB1197407A - Improvements in or relating to Methods of Producing External Connections on Electrical Component Assemblies - Google Patents

Improvements in or relating to Methods of Producing External Connections on Electrical Component Assemblies

Info

Publication number
GB1197407A
GB1197407A GB2933668A GB2933668A GB1197407A GB 1197407 A GB1197407 A GB 1197407A GB 2933668 A GB2933668 A GB 2933668A GB 2933668 A GB2933668 A GB 2933668A GB 1197407 A GB1197407 A GB 1197407A
Authority
GB
United Kingdom
Prior art keywords
conductors
connections
energizing
june
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2933668A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB1197407A publication Critical patent/GB1197407A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Conductors (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

1,197,407. Circuit assemblies. SIEMENS A.G. 20 June, 1968 [21 June, 1967], No. 29336/68. Heading H1R. [Also in Division B3] In a method of producing external connections on a sub-assembly as described in Specification 1,124,376 connections between conductors separated by a layer of insulating material are effected by energizing two welding electrodes and applying them under pressure to those points where connections are to be made. Electrical components and/or functional electric circuits embedded in a plastics material block 1 have their connecting wires terminating in connection points at one lateral surface of the block. Conductive paths 2 in a first layer of conductors are applied to the surface 7 to make connections with the connection points. A foil of thermoplastic material 3 provided on one with an adhesive and on the other side with a metal foil is placed over the conductors 2 and surface 7 and after hardening of the adhesive circuits 4 are formed by etching in the metal foil. In accordance with the invention connections between the conductors 2 and conductors 4 are made by positioning split welding electrodes 5, 6 at the place of interconnection, energizing them and applying pressure. The heat produced in conductor 4 first softens the insulating material 3 which is moved aside by the conductor 4 as it is pressed down and then when the conductors 4, 2 come into contact a weld is made. The conductors 4 may be applied chemically and reinforced by electroplating or by vaporizing or atomizing on metal. The conductors may be preformed. A plurality of insulating foils each carrying a printed circuit may be used.
GB2933668A 1967-06-21 1968-06-20 Improvements in or relating to Methods of Producing External Connections on Electrical Component Assemblies Expired GB1197407A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1967S0110433 DE1282757B (en) 1967-06-21 1967-06-21 Process for the production of electrical assemblies

Publications (1)

Publication Number Publication Date
GB1197407A true GB1197407A (en) 1970-07-01

Family

ID=7530227

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2933668A Expired GB1197407A (en) 1967-06-21 1968-06-20 Improvements in or relating to Methods of Producing External Connections on Electrical Component Assemblies

Country Status (5)

Country Link
AT (1) AT277409B (en)
DE (1) DE1282757B (en)
FR (1) FR1585614A (en)
GB (1) GB1197407A (en)
NL (1) NL6804765A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997008925A1 (en) * 1995-08-30 1997-03-06 Siemens Aktiengesellschaft Method of establishing a connection between at least two electrical conductors, one of which is mounted on a supporting substrate
WO1997042727A1 (en) * 1996-05-06 1997-11-13 Siemens Aktiengesellschaft Process for producing a multilayered composite structure with electroconductive connections
WO1999049708A1 (en) * 1998-03-27 1999-09-30 Minnesota Mining And Manufacturing Company Method for making electrical connections between conductors separated by a dielectric
WO2007059797A1 (en) * 2005-11-25 2007-05-31 Fci Method to weld conductive tracks together

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997008925A1 (en) * 1995-08-30 1997-03-06 Siemens Aktiengesellschaft Method of establishing a connection between at least two electrical conductors, one of which is mounted on a supporting substrate
WO1997042727A1 (en) * 1996-05-06 1997-11-13 Siemens Aktiengesellschaft Process for producing a multilayered composite structure with electroconductive connections
WO1999049708A1 (en) * 1998-03-27 1999-09-30 Minnesota Mining And Manufacturing Company Method for making electrical connections between conductors separated by a dielectric
WO2007059797A1 (en) * 2005-11-25 2007-05-31 Fci Method to weld conductive tracks together

Also Published As

Publication number Publication date
AT277409B (en) 1969-12-29
FR1585614A (en) 1970-01-30
NL6804765A (en) 1968-12-23
DE1282757B (en) 1968-11-14

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees