NL145718B - PROCEDURE FOR MANUFACTURING AN ELECTRICAL CIRCUIT ASSEMBLY, AND AN ELECTRICAL CIRCUIT ASSEMBLY, MANUFACTURED IN ACCORDANCE WITH THIS PROCESS. - Google Patents

PROCEDURE FOR MANUFACTURING AN ELECTRICAL CIRCUIT ASSEMBLY, AND AN ELECTRICAL CIRCUIT ASSEMBLY, MANUFACTURED IN ACCORDANCE WITH THIS PROCESS.

Info

Publication number
NL145718B
NL145718B NL707014581A NL7014581A NL145718B NL 145718 B NL145718 B NL 145718B NL 707014581 A NL707014581 A NL 707014581A NL 7014581 A NL7014581 A NL 7014581A NL 145718 B NL145718 B NL 145718B
Authority
NL
Netherlands
Prior art keywords
electrical circuit
circuit assembly
manufactured
procedure
accordance
Prior art date
Application number
NL707014581A
Other languages
Dutch (nl)
Other versions
NL7014581A (en
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of NL7014581A publication Critical patent/NL7014581A/xx
Publication of NL145718B publication Critical patent/NL145718B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5381—Crossover interconnections, e.g. bridge stepovers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Combinations Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
NL707014581A 1969-10-08 1970-10-05 PROCEDURE FOR MANUFACTURING AN ELECTRICAL CIRCUIT ASSEMBLY, AND AN ELECTRICAL CIRCUIT ASSEMBLY, MANUFACTURED IN ACCORDANCE WITH THIS PROCESS. NL145718B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86485669A 1969-10-08 1969-10-08

Publications (2)

Publication Number Publication Date
NL7014581A NL7014581A (en) 1971-04-14
NL145718B true NL145718B (en) 1975-04-15

Family

ID=25344227

Family Applications (1)

Application Number Title Priority Date Filing Date
NL707014581A NL145718B (en) 1969-10-08 1970-10-05 PROCEDURE FOR MANUFACTURING AN ELECTRICAL CIRCUIT ASSEMBLY, AND AN ELECTRICAL CIRCUIT ASSEMBLY, MANUFACTURED IN ACCORDANCE WITH THIS PROCESS.

Country Status (10)

Country Link
JP (1) JPS509342B1 (en)
BE (1) BE757162A (en)
CH (1) CH528148A (en)
DE (1) DE2049163C3 (en)
ES (1) ES384535A1 (en)
FR (1) FR2065090A5 (en)
GB (1) GB1315510A (en)
IE (1) IE34642B1 (en)
NL (1) NL145718B (en)
SE (1) SE365068B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5377737U (en) * 1976-11-26 1978-06-28
DE2823881C3 (en) * 1978-05-31 1982-03-18 Siemens AG, 1000 Berlin und 8000 München Process for the production of electrical thin-film circuits for the production of integrated conductor track crossings
DE3064555D1 (en) * 1979-02-26 1983-09-22 Nat Res Dev Method of incorporating a distributed microwave circuit element in a microwave integrated circuit
US5699224A (en) * 1995-10-25 1997-12-16 Rohm Co., Ltd. Thick-film capacitor and chip-type composite electronic component utilizing the same
CN107086095B (en) * 2017-06-22 2023-05-16 中国船舶重工集团公司第七0三研究所 Resistance load kuppe

Also Published As

Publication number Publication date
SE365068B (en) 1974-03-11
DE2049163C3 (en) 1978-07-06
JPS509342B1 (en) 1975-04-11
FR2065090A5 (en) 1971-07-23
DE2049163B2 (en) 1977-11-10
IE34642L (en) 1971-04-08
NL7014581A (en) 1971-04-14
GB1315510A (en) 1973-05-02
CH528148A (en) 1972-09-15
ES384535A1 (en) 1974-06-01
DE2049163A1 (en) 1971-04-22
BE757162A (en) 1971-03-16
IE34642B1 (en) 1975-07-09

Similar Documents

Publication Publication Date Title
NL161620C (en) METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT
NL7614145A (en) METHOD AND DEVICE FOR MANUFACTURING AN IDENTITY CARRIER AND AN IDENTITY CARRIER MANUFACTURED IN ACCORDANCE WITH THIS METHOD.
NL169018C (en) METHOD FOR MANUFACTURING AN ELECTRICALLY HEATABLE GLASS GLASS
NL160680C (en) SEMI-CONDUCTOR DEVICE PROVIDED WITH AN INSULATING ENCAPSULATION COATING AND METHOD FOR MANUFACTURING THE SEMI-CONDUCTOR DEVICE.
NL153709B (en) METHOD OF MANUFACTURING AN ELECTRICAL CONDUCTIVE OBJECT, AND AN OBJECT, MANUFACTURED IN ACCORDANCE WITH THIS PROCESS.
NL144764B (en) PROCEDURE FOR THE MANUFACTURE OF ARTICLES WITH TWO ELECTRICAL CONDUCTIVE LAYERS LOCATED AT A MINIMUM DISTANCE, AND ARTICLES, MANUFACTURED IN ACCORDANCE WITH THIS PROCESS.
NL169049C (en) METHOD FOR MANUFACTURING BIAXIA-STRETCHED POLYETHYLENE NAPHALENE-2,6-DICARBOXYLATE FOILS AND MAGNETIC BELTS THEREOF
NL161854B (en) PROCESS FOR THE MANUFACTURE OF A BALL HINGE AND BALL HINGE MADE IN ACCORDANCE WITH THIS PROCESS.
NL169120B (en) METHOD FOR MANUFACTURING AN ELECTRICAL ELEMENT AND ELEMENT OBTAINED ACCORDING TO THIS METHOD
NL154062B (en) PROCESS FOR THE MANUFACTURE OF AN INTEGRATED SEMICONDUCTOR CIRCUIT, AND AN INTEGRATED SEMICONDUCTOR CIRCUIT, MANUFACTURED WITH THIS PROCESS.
NL172608B (en) ELECTRICAL CONTACT AND METHOD FOR MAKING SUCH ELECTRICAL CONTACT.
NL156534B (en) ELECTRICAL SWITCH, IN PARTICULAR THERMOSTAT SWITCH, AND PROCESS FOR MANUFACTURING A RIVET CONNECTION THEREOF.
NL165335C (en) METHOD FOR MANUFACTURING ELECTROLYTE-TIGHT FEEDINGS AND CONNECTIONS AT AN ELECTRICAL ACCUMULATOR BATTERY
NL7414474A (en) ELECTRICAL CONNECTOR AND METHODS AND DEVICE FOR MANUFACTURING SUCH AN ELECTRICAL CONNECTOR.
NL145718B (en) PROCEDURE FOR MANUFACTURING AN ELECTRICAL CIRCUIT ASSEMBLY, AND AN ELECTRICAL CIRCUIT ASSEMBLY, MANUFACTURED IN ACCORDANCE WITH THIS PROCESS.
NL150147B (en) THERMO-HARDABLE, CARRIER-FREE FOELIE AND PROCESS FOR MANUFACTURING THIS.
NL172675C (en) METHOD FOR MANUFACTURING AN ARTICLE WITH MOLD MEMORY
NL144120B (en) METHOD FOR MANUFACTURING A THIN-LAYER CIRCUIT, AND THE CIRCUIT OBTAINED ACCORDING TO THIS METHOD.
NL7415764A (en) PROCEDURE FOR CLOSING AN ELECTRICAL COMPONENT, AND AN ELECTRICAL COMPONENT, COMPLETED ACCORDING TO THE PROCEDURE.
NL145098B (en) METHOD OF MANUFACTURE OF AN ELECTRODE FOR ELECTROCHEMIC CELLS AND ELECTRODE THEREFORE MANUFACTURED.
NL161613C (en) PHOTO-ELECTRICAL CONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
NL149981C (en) PROCEDURE FOR MANUFACTURING AN ELECTROLUMINESCENT ELEMENT AND AN ELEMENT THEREFORE OBTAINED.
NL7509703A (en) PROCESS OF MANUFACTURING A MICROPHONE OF THE TYPE SPECIFIED AS ELECTRICAL, AND A MICROPHONE MANUFACTURED IN ACCORDANCE WITH SUCH PROCESS.
NL162231B (en) METHOD FOR MANUFACTURING ELECTRICAL INSULATING ELEMENTS SUITABLE FOR THE MANUFACTURE OF PRINTED CIRCUITS.
NL147280B (en) ELECTROMAGNETIC ELECTRONIC LENS, PARTICULARLY FOR AN ELECTRON MICROSCOPE.

Legal Events

Date Code Title Description
V1 Lapsed because of non-payment of the annual fee
NL80 Information provided on patent owner name for an already discontinued patent

Owner name: WESTERN ELECTRI