DE3678023D1 - Integrierte schaltungsanordnung mit gestapelten leiterschichten zum verbinden von schaltungselementen. - Google Patents

Integrierte schaltungsanordnung mit gestapelten leiterschichten zum verbinden von schaltungselementen.

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Publication number
DE3678023D1
DE3678023D1 DE8686400782T DE3678023T DE3678023D1 DE 3678023 D1 DE3678023 D1 DE 3678023D1 DE 8686400782 T DE8686400782 T DE 8686400782T DE 3678023 T DE3678023 T DE 3678023T DE 3678023 D1 DE3678023 D1 DE 3678023D1
Authority
DE
Germany
Prior art keywords
circuit elements
stacked
integrated circuit
signals
conductor layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686400782T
Other languages
English (en)
Inventor
Akira Miyauchi
Hiroshi C O Suzuki Nishimoto
Tadashi Okiyama
Hiroo Kitasagami
Masahiro Sugimoto
Haruo Tamada
Shinji Emori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3678023D1 publication Critical patent/DE3678023D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
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    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
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    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Waveguide Connection Structure (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE8686400782T 1985-04-13 1986-04-11 Integrierte schaltungsanordnung mit gestapelten leiterschichten zum verbinden von schaltungselementen. Expired - Fee Related DE3678023D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60077549A JPS61239649A (ja) 1985-04-13 1985-04-13 高速集積回路パツケ−ジ

Publications (1)

Publication Number Publication Date
DE3678023D1 true DE3678023D1 (de) 1991-04-18

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Application Number Title Priority Date Filing Date
DE8686400782T Expired - Fee Related DE3678023D1 (de) 1985-04-13 1986-04-11 Integrierte schaltungsanordnung mit gestapelten leiterschichten zum verbinden von schaltungselementen.

Country Status (9)

Country Link
US (1) US4827327A (de)
EP (1) EP0199635B1 (de)
JP (1) JPS61239649A (de)
KR (1) KR900007299B1 (de)
AT (1) ATE61696T1 (de)
CA (1) CA1249379A (de)
DE (1) DE3678023D1 (de)
HK (1) HK46992A (de)
SG (1) SG45692G (de)

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Also Published As

Publication number Publication date
CA1249379A (en) 1989-01-24
JPH0325082B2 (de) 1991-04-05
KR860008600A (ko) 1986-11-17
EP0199635B1 (de) 1991-03-13
KR900007299B1 (ko) 1990-10-08
HK46992A (en) 1992-07-03
US4827327A (en) 1989-05-02
JPS61239649A (ja) 1986-10-24
EP0199635A3 (en) 1987-11-19
SG45692G (en) 1992-06-12
ATE61696T1 (de) 1991-03-15
EP0199635A2 (de) 1986-10-29

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