KR850005158A - 반도체 집적회로 장치 - Google Patents

반도체 집적회로 장치 Download PDF

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KR850005158A
KR850005158A KR1019840007835A KR840007835A KR850005158A KR 850005158 A KR850005158 A KR 850005158A KR 1019840007835 A KR1019840007835 A KR 1019840007835A KR 840007835 A KR840007835 A KR 840007835A KR 850005158 A KR850005158 A KR 850005158A
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South Korea
Prior art keywords
integrated circuit
circuit device
semiconductor integrated
signal line
wiring board
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KR1019840007835A
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English (en)
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KR900001273B1 (ko
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마스미 후꾸다 (외 1)
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야마모도 다꾸마
후지쑤 가부시끼가이샤
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Priority claimed from JP58243410A external-priority patent/JPS60136232A/ja
Priority claimed from JP58249336A external-priority patent/JPS60140727A/ja
Application filed by 야마모도 다꾸마, 후지쑤 가부시끼가이샤 filed Critical 야마모도 다꾸마
Publication of KR850005158A publication Critical patent/KR850005158A/ko
Application granted granted Critical
Publication of KR900001273B1 publication Critical patent/KR900001273B1/ko

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    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

내용 없음

Description

반도체 집적회로 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 본 발명의 첫번째 예의 개선된 초고속 반도체 IC의 도식적인 횡단면도.
제5도A는 제4도에 대한 배선판의 개선된 구조의 도식적인 횡단면도.
제6도A는 제4도에 대한 배선판의 개선된 다른 구조의 도식적인 횡단면도.
제9도는 본 발명의 두번째 예의 개선된 초고속 반도체 IC의 도식적인 횡단면도.

Claims (7)

  1. 출력단자를 갖는 반도체 칩으로서 패키이지 안에 장탁되었으며, 상기 패키이지 위에 외부 도선이 위치하고 상기 반도체 칩과 상기 외부도선 사이를 상호 연결한 배선판과 상기 배선판이 졀연판 위에 제조된 전송선로를 포함하고 상기 전송선로가 간격을 갖는 접지도체판과 신호선로 도체의 배열에 의하여 예정된 전손특성을 가지며, 상기 신호선로 도체는 상기 반도체 칩과 상기 외부 도선 사이를 상호연결시키는 반도체 직접회로장치.
  2. 청구범위 제1항에 있어서 상기 전송선로는 신호선로 도체와 상기 절연판의 공통 표면위에 형성된 접지 도체를 포함하는 공면(Coplanar) 가이드의 형태 안에 있는 반도체 직접회로 장치.
  3. 청구범위 제1항에 있어서, 상기 전송선로가 상기 절연판의 저면에 형성된 신호선로 도체와 상기 절연판의 윗면에 형성된 접지 도체를 포함하는 스트립 선의 형태안에 있는 반도체 직집회로 장치.
  4. 청구범위 제3항에 있어서 상기 전송선로가 절연판 위에 장착된 임피이던스 결합 저항을 갖는 반도체 직접회로 장치.
  5. 청구범위 제3항에 있어서 상기 전송선로는 절연판 위에 놓여진 파동발생회로를 가지며, 상기 신호선로도체와 결합되는 반도체 직접회로장치.
  6. 청구범위 제1항에 있어서 상기 배선판은 다층으로 된 배선판을 포함하는 반도체 직접회로장치.
  7. 청구범위 제6항에 있어서 상기 다층배선판은 복수의 절연판과 신호선로도체의 복수의 레벨을 갖되 상기 신호선로도체는 각각의 절연판에 형성된 관통구멍과 서로 상호 연결되어 있으며, 상기 절연판은 서로 적층되어 있는 반도체 직접회로장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019840007835A 1983-12-23 1984-12-11 반도체 집적회로 장치 KR900001273B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP58-243410 1983-12-23
JP???58-243410 1983-12-23
JP58243410A JPS60136232A (ja) 1983-12-23 1983-12-23 半導体集積回路装置
JP58249336A JPS60140727A (ja) 1983-12-27 1983-12-27 半導体集積回路装置
JP58-249336 1983-12-27

Publications (2)

Publication Number Publication Date
KR850005158A true KR850005158A (ko) 1985-08-21
KR900001273B1 KR900001273B1 (ko) 1990-03-05

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KR1019840007835A KR900001273B1 (ko) 1983-12-23 1984-12-11 반도체 집적회로 장치

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US (1) US4751482A (ko)
EP (1) EP0148083B1 (ko)
KR (1) KR900001273B1 (ko)
DE (1) DE3482353D1 (ko)

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KR900001273B1 (ko) 1990-03-05
EP0148083A2 (en) 1985-07-10
DE3482353D1 (de) 1990-06-28
US4751482A (en) 1988-06-14
EP0148083B1 (en) 1990-05-23
EP0148083A3 (en) 1986-10-08

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