FR1534329A - Procédé de montage de circuits intégrés - Google Patents

Procédé de montage de circuits intégrés

Info

Publication number
FR1534329A
FR1534329A FR117930A FR117930A FR1534329A FR 1534329 A FR1534329 A FR 1534329A FR 117930 A FR117930 A FR 117930A FR 117930 A FR117930 A FR 117930A FR 1534329 A FR1534329 A FR 1534329A
Authority
FR
France
Prior art keywords
integrated circuit
assembly process
circuit assembly
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR117930A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Signetics Corp
Original Assignee
Signetics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Signetics Corp filed Critical Signetics Corp
Priority to FR117930A priority Critical patent/FR1534329A/fr
Application granted granted Critical
Publication of FR1534329A publication Critical patent/FR1534329A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
FR117930A 1966-08-16 1967-08-16 Procédé de montage de circuits intégrés Expired FR1534329A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR117930A FR1534329A (fr) 1966-08-16 1967-08-16 Procédé de montage de circuits intégrés

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US57272066A 1966-08-16 1966-08-16
US61897367A 1967-02-27 1967-02-27
FR117930A FR1534329A (fr) 1966-08-16 1967-08-16 Procédé de montage de circuits intégrés

Publications (1)

Publication Number Publication Date
FR1534329A true FR1534329A (fr) 1968-07-26

Family

ID=27244430

Family Applications (1)

Application Number Title Priority Date Filing Date
FR117930A Expired FR1534329A (fr) 1966-08-16 1967-08-16 Procédé de montage de circuits intégrés

Country Status (1)

Country Link
FR (1) FR1534329A (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2088564A1 (fr) * 1970-05-14 1972-01-07 Siemens Ag
FR2156343A1 (fr) * 1971-10-14 1973-05-25 Philips Nv
FR2196570A1 (fr) * 1972-06-14 1974-03-15 Ibm
DE2554965A1 (de) * 1974-12-20 1976-07-01 Ibm Elektrische kompaktschaltungsanordnung
FR2494908A1 (fr) * 1980-11-21 1982-05-28 Gao Ges Automation Org Element support pour modules de circuit integre
FR2535110A1 (fr) * 1982-10-20 1984-04-27 Radiotechnique Compelec Procede d'encapsulation d'un composant semi-conducteur dans un circuit electronique realise sur substrat et application aux circuits integres rapides
EP0148083A2 (fr) * 1983-12-23 1985-07-10 Fujitsu Limited Dispositif semi-conducteur à circuit intégré à vitesse ultra-rapide ayant un support de connexion à multi-couche
EP0526147A2 (fr) * 1991-07-25 1993-02-03 Nec Corporation Dispositif semi-conducteur du type à bande de support et procédé de sa fabrication

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2088564A1 (fr) * 1970-05-14 1972-01-07 Siemens Ag
FR2156343A1 (fr) * 1971-10-14 1973-05-25 Philips Nv
FR2196570A1 (fr) * 1972-06-14 1974-03-15 Ibm
DE2554965A1 (de) * 1974-12-20 1976-07-01 Ibm Elektrische kompaktschaltungsanordnung
FR2494908A1 (fr) * 1980-11-21 1982-05-28 Gao Ges Automation Org Element support pour modules de circuit integre
FR2535110A1 (fr) * 1982-10-20 1984-04-27 Radiotechnique Compelec Procede d'encapsulation d'un composant semi-conducteur dans un circuit electronique realise sur substrat et application aux circuits integres rapides
EP0148083A2 (fr) * 1983-12-23 1985-07-10 Fujitsu Limited Dispositif semi-conducteur à circuit intégré à vitesse ultra-rapide ayant un support de connexion à multi-couche
EP0148083A3 (en) * 1983-12-23 1986-10-08 Fujitsu Limited Ultra-high speed semiconductor integrated circuit device having a multi-layered wiring board
US4751482A (en) * 1983-12-23 1988-06-14 Fujitsu Limited Semiconductor integrated circuit device having a multi-layered wiring board for ultra high speed connection
EP0526147A2 (fr) * 1991-07-25 1993-02-03 Nec Corporation Dispositif semi-conducteur du type à bande de support et procédé de sa fabrication
EP0526147A3 (en) * 1991-07-25 1993-08-18 Nec Corporation Film-carrier type semiconductor device and process for fabricating the same

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