CH476400A - Halbleiter-Schaltungsvorrichtung - Google Patents

Halbleiter-Schaltungsvorrichtung

Info

Publication number
CH476400A
CH476400A CH1524067A CH1524067A CH476400A CH 476400 A CH476400 A CH 476400A CH 1524067 A CH1524067 A CH 1524067A CH 1524067 A CH1524067 A CH 1524067A CH 476400 A CH476400 A CH 476400A
Authority
CH
Switzerland
Prior art keywords
circuit device
semiconductor circuit
semiconductor
circuit
Prior art date
Application number
CH1524067A
Other languages
English (en)
Inventor
Conrad Rosvold Warren
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of CH476400A publication Critical patent/CH476400A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76297—Dielectric isolation using EPIC techniques, i.e. epitaxial passivated integrated circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/051—Etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/115—Orientation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/122—Polycrystalline

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Element Separation (AREA)
  • Bipolar Transistors (AREA)
CH1524067A 1966-10-31 1967-10-31 Halbleiter-Schaltungsvorrichtung CH476400A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59071966A 1966-10-31 1966-10-31

Publications (1)

Publication Number Publication Date
CH476400A true CH476400A (de) 1969-07-31

Family

ID=24363408

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1524067A CH476400A (de) 1966-10-31 1967-10-31 Halbleiter-Schaltungsvorrichtung

Country Status (5)

Country Link
US (1) US3454835A (de)
CH (1) CH476400A (de)
DE (1) DE1614391A1 (de)
GB (1) GB1154607A (de)
NL (1) NL6714784A (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3946270A (en) * 1966-02-19 1976-03-23 Semiconductor Research Foundation Signal collecting and distributing systems
US4180422A (en) * 1969-02-03 1979-12-25 Raytheon Company Method of making semiconductor diodes
US3648131A (en) * 1969-11-07 1972-03-07 Ibm Hourglass-shaped conductive connection through semiconductor structures
US3954522A (en) * 1973-06-28 1976-05-04 Motorola, Inc. Integrated circuit process
US3969749A (en) * 1974-04-01 1976-07-13 Texas Instruments Incorporated Substrate for dielectric isolated integrated circuit with V-etched depth grooves for lapping guide
GB2082836A (en) * 1980-08-20 1982-03-10 Philips Electronic Associated Corrugated semiconductor devices
US4784970A (en) * 1987-11-18 1988-11-15 Grumman Aerospace Corporation Process for making a double wafer moated signal processor
US5608264A (en) * 1995-06-05 1997-03-04 Harris Corporation Surface mountable integrated circuit with conductive vias
US5814889A (en) * 1995-06-05 1998-09-29 Harris Corporation Intergrated circuit with coaxial isolation and method
US5682062A (en) * 1995-06-05 1997-10-28 Harris Corporation System for interconnecting stacked integrated circuits
US5618752A (en) * 1995-06-05 1997-04-08 Harris Corporation Method of fabrication of surface mountable integrated circuits
US5668409A (en) * 1995-06-05 1997-09-16 Harris Corporation Integrated circuit with edge connections and method
US5646067A (en) * 1995-06-05 1997-07-08 Harris Corporation Method of bonding wafers having vias including conductive material
FR2793605B1 (fr) * 1999-05-12 2001-07-27 St Microelectronics Sa Procede de mise en boitier d'une puce semiconductrice

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3381182A (en) * 1964-10-19 1968-04-30 Philco Ford Corp Microcircuits having buried conductive layers

Also Published As

Publication number Publication date
NL6714784A (de) 1968-05-01
GB1154607A (en) 1969-06-11
US3454835A (en) 1969-07-08
DE1614391A1 (de) 1972-04-20

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Legal Events

Date Code Title Description
PL Patent ceased