FR2196570A1 - - Google Patents

Info

Publication number
FR2196570A1
FR2196570A1 FR7315241A FR7315241A FR2196570A1 FR 2196570 A1 FR2196570 A1 FR 2196570A1 FR 7315241 A FR7315241 A FR 7315241A FR 7315241 A FR7315241 A FR 7315241A FR 2196570 A1 FR2196570 A1 FR 2196570A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7315241A
Other versions
FR2196570B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2196570A1 publication Critical patent/FR2196570A1/fr
Application granted granted Critical
Publication of FR2196570B1 publication Critical patent/FR2196570B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR7315241A 1972-06-14 1973-04-19 Expired FR2196570B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26284872A 1972-06-14 1972-06-14

Publications (2)

Publication Number Publication Date
FR2196570A1 true FR2196570A1 (fr) 1974-03-15
FR2196570B1 FR2196570B1 (fr) 1976-11-12

Family

ID=22999323

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7315241A Expired FR2196570B1 (fr) 1972-06-14 1973-04-19

Country Status (9)

Country Link
JP (1) JPS4944673A (fr)
AU (1) AU467287B2 (fr)
CA (1) CA974664A (fr)
CH (1) CH557128A (fr)
ES (1) ES415871A1 (fr)
FR (1) FR2196570B1 (fr)
GB (1) GB1416205A (fr)
IT (1) IT981607B (fr)
SE (1) SE401767B (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1414836A (fr) * 1963-08-08 1965-10-22 Ibm Composants fonctionnels
FR1532813A (fr) * 1966-07-29 1968-07-12 Texas Instruments Inc Procédé de conditionnement de dispositifs à semi-conducteurs à connexions multiples et produit résultant de ce procédé
FR1534329A (fr) * 1966-08-16 1968-07-26 Signetics Corp Procédé de montage de circuits intégrés

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1414836A (fr) * 1963-08-08 1965-10-22 Ibm Composants fonctionnels
FR1532813A (fr) * 1966-07-29 1968-07-12 Texas Instruments Inc Procédé de conditionnement de dispositifs à semi-conducteurs à connexions multiples et produit résultant de ce procédé
FR1534329A (fr) * 1966-08-16 1968-07-26 Signetics Corp Procédé de montage de circuits intégrés

Also Published As

Publication number Publication date
AU467287B2 (en) 1975-11-27
JPS4944673A (fr) 1974-04-26
ES415871A1 (es) 1976-02-01
IT981607B (it) 1974-10-10
CH557128A (de) 1974-12-13
FR2196570B1 (fr) 1976-11-12
AU5695073A (en) 1974-12-19
CA974664A (en) 1975-09-16
GB1416205A (en) 1975-12-03
SE401767B (sv) 1978-05-22
DE2329052B2 (de) 1977-02-17
DE2329052A1 (de) 1973-12-20

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Legal Events

Date Code Title Description
ST Notification of lapse