FR1474311A - Procédé de fabrication de circuits intégrés - Google Patents

Procédé de fabrication de circuits intégrés

Info

Publication number
FR1474311A
FR1474311A FR54614A FR54614A FR1474311A FR 1474311 A FR1474311 A FR 1474311A FR 54614 A FR54614 A FR 54614A FR 54614 A FR54614 A FR 54614A FR 1474311 A FR1474311 A FR 1474311A
Authority
FR
France
Prior art keywords
integrated circuit
manufacturing process
circuit manufacturing
integrated
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR54614A
Other languages
English (en)
Inventor
Hans-Juergen Schuetze
Klaus Hennings
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken Patentverwertungs GmbH
Original Assignee
Telefunken Patentverwertungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DET28418A external-priority patent/DE1289187B/de
Application filed by Telefunken Patentverwertungs GmbH filed Critical Telefunken Patentverwertungs GmbH
Priority to FR54614A priority Critical patent/FR1474311A/fr
Application granted granted Critical
Publication of FR1474311A publication Critical patent/FR1474311A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
FR54614A 1965-04-17 1966-03-23 Procédé de fabrication de circuits intégrés Expired FR1474311A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR54614A FR1474311A (fr) 1965-04-17 1966-03-23 Procédé de fabrication de circuits intégrés

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DET28418A DE1289187B (de) 1965-04-17 1965-04-17 Verfahren zum Herstellen einer mikroelektronischen Schaltungsanordnung
FR54614A FR1474311A (fr) 1965-04-17 1966-03-23 Procédé de fabrication de circuits intégrés

Publications (1)

Publication Number Publication Date
FR1474311A true FR1474311A (fr) 1967-03-24

Family

ID=26000023

Family Applications (1)

Application Number Title Priority Date Filing Date
FR54614A Expired FR1474311A (fr) 1965-04-17 1966-03-23 Procédé de fabrication de circuits intégrés

Country Status (1)

Country Link
FR (1) FR1474311A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0415795A2 (fr) * 1989-08-31 1991-03-06 Xerox Corporation Méthode de fabrication de matrices d'éléments de balayage ou capteurs d'images pleine largeur à partir de sous unités

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0415795A2 (fr) * 1989-08-31 1991-03-06 Xerox Corporation Méthode de fabrication de matrices d'éléments de balayage ou capteurs d'images pleine largeur à partir de sous unités
EP0415795A3 (en) * 1989-08-31 1991-06-26 Xerox Corporation Method of fabricating full width scanning or imaging arrays from subunits

Similar Documents

Publication Publication Date Title
FR1418731A (fr) Procédé de fabrication de circuits imprimés
FR1507802A (fr) Procédé de fabrication de circuits intégrés
FR1442703A (fr) Structures semiconductrices pour circuits intégrés et procédé de fabrication correspondant
FR1235596A (fr) Procédé de fabrication de circuits électriques
FR1339920A (fr) Fabrication de circuits
FR1389506A (fr) Fabrication de circuits
FR1506109A (fr) Procédé pour fabriquer des circuits intégrés
FR1522338A (fr) Procédé de fabrication de circuits imprimés
FR1385422A (fr) Procédé de fabrication de circuits imprimés
FR1534329A (fr) Procédé de montage de circuits intégrés
FR1458890A (fr) Module pour circuits électriques et son procédé de fabrication
CH449730A (fr) Procédé de fabrication de circuits imprimés
FR1535920A (fr) Procédé de fabrication de circuits intégrés
CH452709A (fr) Procédé de fabrication de circuits solides
FR1420044A (fr) Procédé de fabrication des circuits imprimés
FR1509644A (fr) Procédé de fabrication d'un circuit intégré
FR1463642A (fr) Fabrication de circuits imprimés
FR1474311A (fr) Procédé de fabrication de circuits intégrés
FR1504532A (fr) Procédé de fabrication de phtalazines substituées
FR1539042A (fr) Procédé de fabrication de transistors dans un circuit intégré
FR1469961A (fr) Procédés de fabrication de circuits intégrés
FR1405168A (fr) Procédé de fabrication de semi-conducteurs
FR1407752A (fr) Procédé de fabrication de circuits imprimés
FR1483890A (fr) Procédé de fabrication de circuits à semi-conducteurs
FR1481283A (fr) Procédé de fabrication de circuits semiconducteurs intégrés