FR1469961A - Procédés de fabrication de circuits intégrés - Google Patents

Procédés de fabrication de circuits intégrés

Info

Publication number
FR1469961A
FR1469961A FR50878A FR50878A FR1469961A FR 1469961 A FR1469961 A FR 1469961A FR 50878 A FR50878 A FR 50878A FR 50878 A FR50878 A FR 50878A FR 1469961 A FR1469961 A FR 1469961A
Authority
FR
France
Prior art keywords
integrated circuit
manufacturing processes
circuit manufacturing
processes
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR50878A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Priority to FR50878A priority Critical patent/FR1469961A/fr
Application granted granted Critical
Publication of FR1469961A publication Critical patent/FR1469961A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76297—Dielectric isolation using EPIC techniques, i.e. epitaxial passivated integrated circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02381—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/02428—Structure
    • H01L21/0243—Surface structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02639—Preparation of substrate for selective deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
FR50878A 1965-02-26 1966-02-24 Procédés de fabrication de circuits intégrés Expired FR1469961A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR50878A FR1469961A (fr) 1965-02-26 1966-02-24 Procédés de fabrication de circuits intégrés

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US43563365A 1965-02-26 1965-02-26
FR50878A FR1469961A (fr) 1965-02-26 1966-02-24 Procédés de fabrication de circuits intégrés

Publications (1)

Publication Number Publication Date
FR1469961A true FR1469961A (fr) 1967-02-17

Family

ID=26168793

Family Applications (1)

Application Number Title Priority Date Filing Date
FR50878A Expired FR1469961A (fr) 1965-02-26 1966-02-24 Procédés de fabrication de circuits intégrés

Country Status (1)

Country Link
FR (1) FR1469961A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2028462A1 (fr) * 1969-01-16 1970-10-09 Signetics Corp
EP0311309A2 (fr) * 1987-10-09 1989-04-12 AT&T Corp. Procédé de fabrication de dispositifs semi-conducteurs comportant des régions diélectriquement isolées

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2028462A1 (fr) * 1969-01-16 1970-10-09 Signetics Corp
EP0311309A2 (fr) * 1987-10-09 1989-04-12 AT&T Corp. Procédé de fabrication de dispositifs semi-conducteurs comportant des régions diélectriquement isolées
EP0311309A3 (fr) * 1987-10-09 1991-02-06 AT&T Corp. Procédé de fabrication de dispositifs semi-conducteurs comportant des régions diélectriquement isolées

Similar Documents

Publication Publication Date Title
FR1454464A (fr) Circuits intégrés tridimensionnels et procédés de fabrication de ces circuits
FR1511986A (fr) Circuits intégrés à semi-conducteurs
FR1418731A (fr) Procédé de fabrication de circuits imprimés
AT324424B (de) Integrierte halbleiterschaltung
GB1121334A (en) Fabrication of semiconductor integrated circuits
AT308241B (de) Integrierte Halbleiterschaltung
FR1507802A (fr) Procédé de fabrication de circuits intégrés
FR1339920A (fr) Fabrication de circuits
CH500594A (de) Integrierte Halbleiterschaltung
FR1389506A (fr) Fabrication de circuits
FR1437276A (fr) Circuit semi-conducteur intégré
FR1506152A (fr) Perfectionnement aux procédés de fabrication de circuits intégrés
FR1522338A (fr) Procédé de fabrication de circuits imprimés
FR1385422A (fr) Procédé de fabrication de circuits imprimés
NL169803C (nl) Geintegreerde halfgeleiderschakeling.
CH449730A (fr) Procédé de fabrication de circuits imprimés
FR1469961A (fr) Procédés de fabrication de circuits intégrés
FR1463642A (fr) Fabrication de circuits imprimés
FR1535920A (fr) Procédé de fabrication de circuits intégrés
FR1474311A (fr) Procédé de fabrication de circuits intégrés
FR1407752A (fr) Procédé de fabrication de circuits imprimés
FR1483890A (fr) Procédé de fabrication de circuits à semi-conducteurs
FR1471003A (fr) Procédé de fabrication de circuits imprimés
FR1532425A (fr) Circuits intégrés et leurs procédés de fabrication
FR1450874A (fr) Procédé de fabrication de circuits imprimés