SG45692G - Integrated circuit device having stacked conductive layers connecting circuit elements therethrough - Google Patents

Integrated circuit device having stacked conductive layers connecting circuit elements therethrough

Info

Publication number
SG45692G
SG45692G SG456/92A SG45692A SG45692G SG 45692 G SG45692 G SG 45692G SG 456/92 A SG456/92 A SG 456/92A SG 45692 A SG45692 A SG 45692A SG 45692 G SG45692 G SG 45692G
Authority
SG
Singapore
Prior art keywords
circuit elements
stacked
integrated circuit
conductive layers
signals
Prior art date
Application number
SG456/92A
Other languages
English (en)
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of SG45692G publication Critical patent/SG45692G/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Waveguide Connection Structure (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
SG456/92A 1985-04-13 1992-04-24 Integrated circuit device having stacked conductive layers connecting circuit elements therethrough SG45692G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60077549A JPS61239649A (ja) 1985-04-13 1985-04-13 高速集積回路パツケ−ジ

Publications (1)

Publication Number Publication Date
SG45692G true SG45692G (en) 1992-06-12

Family

ID=13637092

Family Applications (1)

Application Number Title Priority Date Filing Date
SG456/92A SG45692G (en) 1985-04-13 1992-04-24 Integrated circuit device having stacked conductive layers connecting circuit elements therethrough

Country Status (9)

Country Link
US (1) US4827327A (de)
EP (1) EP0199635B1 (de)
JP (1) JPS61239649A (de)
KR (1) KR900007299B1 (de)
AT (1) ATE61696T1 (de)
CA (1) CA1249379A (de)
DE (1) DE3678023D1 (de)
HK (1) HK46992A (de)
SG (1) SG45692G (de)

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Also Published As

Publication number Publication date
CA1249379A (en) 1989-01-24
JPH0325082B2 (de) 1991-04-05
KR860008600A (ko) 1986-11-17
EP0199635B1 (de) 1991-03-13
KR900007299B1 (ko) 1990-10-08
HK46992A (en) 1992-07-03
US4827327A (en) 1989-05-02
JPS61239649A (ja) 1986-10-24
EP0199635A3 (en) 1987-11-19
ATE61696T1 (de) 1991-03-15
EP0199635A2 (de) 1986-10-29
DE3678023D1 (de) 1991-04-18

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