EP1955225A4 - METHOD AND SYSTEMS FOR USE OF DESIGN DATA IN COMBINATION WITH TEST DATA - Google Patents
METHOD AND SYSTEMS FOR USE OF DESIGN DATA IN COMBINATION WITH TEST DATAInfo
- Publication number
- EP1955225A4 EP1955225A4 EP06850792A EP06850792A EP1955225A4 EP 1955225 A4 EP1955225 A4 EP 1955225A4 EP 06850792 A EP06850792 A EP 06850792A EP 06850792 A EP06850792 A EP 06850792A EP 1955225 A4 EP1955225 A4 EP 1955225A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- data
- systems
- methods
- combination
- utilizing design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000007689 inspection Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Immunology (AREA)
- Quality & Reliability (AREA)
- Pathology (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Data Mining & Analysis (AREA)
- Databases & Information Systems (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US73794705P | 2005-11-18 | 2005-11-18 | |
US73829005P | 2005-11-18 | 2005-11-18 | |
PCT/US2006/061113 WO2007120280A2 (en) | 2005-11-18 | 2006-11-20 | Methods and systems for utilizing design data in combination with inspection data |
US11/561,735 US7676077B2 (en) | 2005-11-18 | 2006-11-20 | Methods and systems for utilizing design data in combination with inspection data |
US11/561,659 US7570796B2 (en) | 2005-11-18 | 2006-11-20 | Methods and systems for utilizing design data in combination with inspection data |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1955225A2 EP1955225A2 (en) | 2008-08-13 |
EP1955225A4 true EP1955225A4 (en) | 2009-11-04 |
Family
ID=38610775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06850792A Withdrawn EP1955225A4 (en) | 2005-11-18 | 2006-11-20 | METHOD AND SYSTEMS FOR USE OF DESIGN DATA IN COMBINATION WITH TEST DATA |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1955225A4 (es) |
JP (12) | JP5465880B2 (es) |
KR (11) | KR20180088924A (es) |
IL (14) | IL191527A (es) |
WO (2) | WO2007120279A2 (es) |
Families Citing this family (92)
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US9002497B2 (en) * | 2003-07-03 | 2015-04-07 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of wafers and reticles using designer intent data |
KR20180088924A (ko) * | 2005-11-18 | 2018-08-07 | 케이엘에이-텐코 코포레이션 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
CN101821635B (zh) * | 2007-08-03 | 2017-07-28 | 弗莱尔系统公司 | 无线远程检测器系统和方法 |
US9710903B2 (en) | 2008-06-11 | 2017-07-18 | Kla-Tencor Corp. | System and method for detecting design and process defects on a wafer using process monitoring features |
US9659670B2 (en) | 2008-07-28 | 2017-05-23 | Kla-Tencor Corp. | Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer |
JPWO2011004534A1 (ja) * | 2009-07-09 | 2012-12-13 | 株式会社日立ハイテクノロジーズ | 半導体欠陥分類方法,半導体欠陥分類装置,半導体欠陥分類プログラム |
JP5719843B2 (ja) * | 2009-07-17 | 2015-05-20 | ケーエルエー−テンカー・コーポレーションKla−Tencor Corporation | 設計データおよび欠陥データを使用したスキャナ性能の比較およびマッチング |
JP5603421B2 (ja) * | 2010-05-31 | 2014-10-08 | 株式会社日立ハイテクノロジーズ | 自動収差補正法を備えた荷電粒子線装置 |
EP2447889A1 (en) * | 2010-10-29 | 2012-05-02 | Siemens Aktiengesellschaft | Method for modeling a defect management in a manufacturing process and for handling the defect during the production process based on said modeled defect management |
TWI574136B (zh) * | 2012-02-03 | 2017-03-11 | 應用材料以色列公司 | 基於設計之缺陷分類之方法及系統 |
US8718353B2 (en) * | 2012-03-08 | 2014-05-06 | Kla-Tencor Corporation | Reticle defect inspection with systematic defect filter |
JP5943722B2 (ja) | 2012-06-08 | 2016-07-05 | 三菱重工業株式会社 | 欠陥判定装置、放射線撮像システム、及び欠陥判定方法 |
JP6092602B2 (ja) * | 2012-12-04 | 2017-03-08 | 株式会社安永 | 欠陥検査装置及び欠陥検査方法 |
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