EP1955225A4 - Procedes et systemes permettant d'utiliser des donnees de conception en combinaison avec des donnees d'inspection - Google Patents

Procedes et systemes permettant d'utiliser des donnees de conception en combinaison avec des donnees d'inspection

Info

Publication number
EP1955225A4
EP1955225A4 EP06850792A EP06850792A EP1955225A4 EP 1955225 A4 EP1955225 A4 EP 1955225A4 EP 06850792 A EP06850792 A EP 06850792A EP 06850792 A EP06850792 A EP 06850792A EP 1955225 A4 EP1955225 A4 EP 1955225A4
Authority
EP
European Patent Office
Prior art keywords
data
systems
methods
combination
utilizing design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06850792A
Other languages
German (de)
English (en)
Other versions
EP1955225A2 (fr
Inventor
Ashok Kulkarni
Brian Duffy
Kais Maayah
Gordon Rouse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Tencor Technologies Corp
Original Assignee
KLA Tencor Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Tencor Technologies Corp filed Critical KLA Tencor Technologies Corp
Priority claimed from US11/561,735 external-priority patent/US7676077B2/en
Priority claimed from US11/561,659 external-priority patent/US7570796B2/en
Publication of EP1955225A2 publication Critical patent/EP1955225A2/fr
Publication of EP1955225A4 publication Critical patent/EP1955225A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Quality & Reliability (AREA)
  • Pathology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Data Mining & Analysis (AREA)
  • Databases & Information Systems (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Tests Of Electronic Circuits (AREA)
EP06850792A 2005-11-18 2006-11-20 Procedes et systemes permettant d'utiliser des donnees de conception en combinaison avec des donnees d'inspection Withdrawn EP1955225A4 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US73794705P 2005-11-18 2005-11-18
US73829005P 2005-11-18 2005-11-18
PCT/US2006/061113 WO2007120280A2 (fr) 2005-11-18 2006-11-20 Procedes et systemes permettant d'utiliser des donnees de conception en combinaison avec des donnees d'inspection
US11/561,735 US7676077B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
US11/561,659 US7570796B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data

Publications (2)

Publication Number Publication Date
EP1955225A2 EP1955225A2 (fr) 2008-08-13
EP1955225A4 true EP1955225A4 (fr) 2009-11-04

Family

ID=38610775

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06850792A Withdrawn EP1955225A4 (fr) 2005-11-18 2006-11-20 Procedes et systemes permettant d'utiliser des donnees de conception en combinaison avec des donnees d'inspection

Country Status (5)

Country Link
EP (1) EP1955225A4 (fr)
JP (12) JP5465880B2 (fr)
KR (11) KR20180088924A (fr)
IL (14) IL191527A (fr)
WO (2) WO2007120279A2 (fr)

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