WO2007120280A3 - Procedes et systemes permettant d'utiliser des donnees de conception en combinaison avec des donnees d'inspection - Google Patents

Procedes et systemes permettant d'utiliser des donnees de conception en combinaison avec des donnees d'inspection Download PDF

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Publication number
WO2007120280A3
WO2007120280A3 PCT/US2006/061113 US2006061113W WO2007120280A3 WO 2007120280 A3 WO2007120280 A3 WO 2007120280A3 US 2006061113 W US2006061113 W US 2006061113W WO 2007120280 A3 WO2007120280 A3 WO 2007120280A3
Authority
WO
WIPO (PCT)
Prior art keywords
data
design data
inspection
wafer
alignment sites
Prior art date
Application number
PCT/US2006/061113
Other languages
English (en)
Other versions
WO2007120280A2 (fr
Inventor
Ashok Kulkarni
Brian Duffy
Kais Maayah
Gordon Rouse
Original Assignee
Kla Tencor Tech Corp
Ashok Kulkarni
Brian Duffy
Kais Maayah
Gordon Rouse
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR1020167033159A priority Critical patent/KR101789004B1/ko
Priority claimed from US11/561,735 external-priority patent/US7676077B2/en
Priority to KR1020157030359A priority patent/KR101672157B1/ko
Priority to KR1020137009234A priority patent/KR101530456B1/ko
Priority to KR1020137009231A priority patent/KR101370154B1/ko
Priority to KR1020157002473A priority patent/KR101682838B1/ko
Priority to KR1020147015035A priority patent/KR101565071B1/ko
Priority to JP2008541507A priority patent/JP5465880B2/ja
Priority claimed from US11/561,659 external-priority patent/US7570796B2/en
Priority to KR1020157000055A priority patent/KR101613048B1/ko
Priority to KR1020177029140A priority patent/KR101885585B1/ko
Priority to KR1020187021977A priority patent/KR20180088924A/ko
Priority to KR1020137006368A priority patent/KR101665168B1/ko
Priority to KR1020087014775A priority patent/KR101285967B1/ko
Priority to EP06850792A priority patent/EP1955225A4/fr
Application filed by Kla Tencor Tech Corp, Ashok Kulkarni, Brian Duffy, Kais Maayah, Gordon Rouse filed Critical Kla Tencor Tech Corp
Publication of WO2007120280A2 publication Critical patent/WO2007120280A2/fr
Priority to IL191527A priority patent/IL191527A/en
Publication of WO2007120280A3 publication Critical patent/WO2007120280A3/fr
Priority to IL230235A priority patent/IL230235A/en
Priority to IL230260A priority patent/IL230260A/en
Priority to IL234289A priority patent/IL234289A/en
Priority to IL234290A priority patent/IL234290A/en
Priority to IL234316A priority patent/IL234316A/en
Priority to IL234318A priority patent/IL234318A/en
Priority to IL234317A priority patent/IL234317A/en
Priority to IL234319A priority patent/IL234319A/en
Priority to IL234345A priority patent/IL234345A/en
Priority to IL234344A priority patent/IL234344A/en
Priority to IL234343A priority patent/IL234343A/en
Priority to IL234346A priority patent/IL234346A/en
Priority to IL253189A priority patent/IL253189B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Quality & Reliability (AREA)
  • Pathology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Data Mining & Analysis (AREA)
  • Databases & Information Systems (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)

Abstract

L'invention concerne divers procédés et systèmes permettant d'utiliser des données de conception en combinaison avec des données d'inspection. Un procédé mis en œuvre par ordinateur pour déterminer la position de données d'inspection dans un espace de données de conception comprend des données d'alignement acquises par un système d'inspection pour des sites d'alignement sur une plaquette avec des données sur des sites d'alignement prédéterminés. Le procédé comprend également la détermination de positions de sites d'alignement sur la plaquette dans un espace de données de conception sur la base des positions des sites d'alignement prédéterminés dans l'espace de données de conception. De plus, le procédé comprend la détermination d'une position de données d'inspections acquises pour la plaquette par le système d'inspection dans l'espace de données de conception sur la base des positions des sites d'alignement sur la plaquette dans l'espace de données de conception. Dans un mode de réalisation, la position des données d'inspections est déterminée avec une précision inférieure au pixel.
PCT/US2006/061113 2005-11-18 2006-11-20 Procedes et systemes permettant d'utiliser des donnees de conception en combinaison avec des donnees d'inspection WO2007120280A2 (fr)

Priority Applications (27)

Application Number Priority Date Filing Date Title
KR1020157000055A KR101613048B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020157030359A KR101672157B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020137009234A KR101530456B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020137009231A KR101370154B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020157002473A KR101682838B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020147015035A KR101565071B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020177029140A KR101885585B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
JP2008541507A JP5465880B2 (ja) 2005-11-18 2006-11-20 検査データと組み合わせて設計データを使用するための方法及びシステム
EP06850792A EP1955225A4 (fr) 2005-11-18 2006-11-20 Procedes et systemes permettant d'utiliser des donnees de conception en combinaison avec des donnees d'inspection
KR1020167033159A KR101789004B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020187021977A KR20180088924A (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020137006368A KR101665168B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020087014775A KR101285967B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및시스템
IL191527A IL191527A (en) 2005-11-18 2008-05-18 Systems and methods for using planning information together with test information
IL230235A IL230235A (en) 2005-11-18 2013-12-29 Systems and methods for using planning information together with test information
IL230260A IL230260A (en) 2005-11-18 2013-12-31 Systems and methods for using planning information together with test information
IL234290A IL234290A (en) 2005-11-18 2014-08-25 Systems and methods for using planning information together with test information
IL234289A IL234289A (en) 2005-11-18 2014-08-25 Systems and methods for using planning information together with test information
IL234319A IL234319A (en) 2005-11-18 2014-08-26 Systems and methods for using planning information together with test information
IL234317A IL234317A (en) 2005-11-18 2014-08-26 Systems and methods for using planning information together with test information
IL234316A IL234316A (en) 2005-11-18 2014-08-26 Systems and methods for using planning information together with test information
IL234318A IL234318A (en) 2005-11-18 2014-08-26 Systems and methods for using planning information together with test information
IL234345A IL234345A (en) 2005-11-18 2014-08-27 Systems and methods for using planning information together with test information
IL234344A IL234344A (en) 2005-11-18 2014-08-27 Systems and methods for using planning information together with test information
IL234343A IL234343A (en) 2005-11-18 2014-08-27 Systems and methods for using planning information together with test information
IL234346A IL234346A (en) 2005-11-18 2014-08-27 Systems and methods for using planning information together with test information
IL253189A IL253189B (en) 2005-11-18 2017-06-27 A system and method for assigning a rating to defects found in a chip manufacturing substrate

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US73794705P 2005-11-18 2005-11-18
US73829005P 2005-11-18 2005-11-18
US60/737,947 2005-11-18
US60/738,290 2005-11-18
US11/561,735 2006-11-20
US11/561,659 US7570796B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
US11/561,659 2006-11-20
US11/561,735 US7676077B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data

Publications (2)

Publication Number Publication Date
WO2007120280A2 WO2007120280A2 (fr) 2007-10-25
WO2007120280A3 true WO2007120280A3 (fr) 2008-09-18

Family

ID=38610775

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/US2006/061113 WO2007120280A2 (fr) 2005-11-18 2006-11-20 Procedes et systemes permettant d'utiliser des donnees de conception en combinaison avec des donnees d'inspection
PCT/US2006/061112 WO2007120279A2 (fr) 2005-11-18 2006-11-20 Procédés et systèmes d'utilisation de données de conception en combinaison avec des données d'inspection

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/US2006/061112 WO2007120279A2 (fr) 2005-11-18 2006-11-20 Procédés et systèmes d'utilisation de données de conception en combinaison avec des données d'inspection

Country Status (5)

Country Link
EP (1) EP1955225A4 (fr)
JP (12) JP5465880B2 (fr)
KR (11) KR101613048B1 (fr)
IL (14) IL191527A (fr)
WO (2) WO2007120280A2 (fr)

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