EP1649965A4 - Lasterstrahlbearbeitungsverfahren, laserstrahlbearbeitungsvorrichtung und durch laser maschinell bearbeitetes produkt - Google Patents

Lasterstrahlbearbeitungsverfahren, laserstrahlbearbeitungsvorrichtung und durch laser maschinell bearbeitetes produkt

Info

Publication number
EP1649965A4
EP1649965A4 EP04747689A EP04747689A EP1649965A4 EP 1649965 A4 EP1649965 A4 EP 1649965A4 EP 04747689 A EP04747689 A EP 04747689A EP 04747689 A EP04747689 A EP 04747689A EP 1649965 A4 EP1649965 A4 EP 1649965A4
Authority
EP
European Patent Office
Prior art keywords
laser beam
beam machining
laser
machined product
machining apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP04747689A
Other languages
English (en)
French (fr)
Other versions
EP1649965B1 (de
EP1649965A1 (de
Inventor
Kenshi Fukumitsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34074622&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP1649965(A4) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Priority to EP11001001.4A priority Critical patent/EP2324950B1/de
Priority to EP11001000.6A priority patent/EP2332687B1/de
Priority to EP10009404.4A priority patent/EP2269765B1/de
Publication of EP1649965A1 publication Critical patent/EP1649965A1/de
Publication of EP1649965A4 publication Critical patent/EP1649965A4/de
Application granted granted Critical
Publication of EP1649965B1 publication Critical patent/EP1649965B1/de
Anticipated expiration legal-status Critical
Active legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Mining & Mineral Resources (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
EP04747689A 2003-07-18 2004-07-16 Verfahren zur laserstrahlbearbeitung eines zu bearbeitenden zieles Active EP1649965B1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP11001001.4A EP2324950B1 (de) 2003-07-18 2004-07-16 Zu schneidende Halbleitersubstrate mit behandelter Region und Loch-Region, und Verfahren zum Schneiden dieser Substrate
EP11001000.6A EP2332687B1 (de) 2003-07-18 2004-07-16 Verfahren zur Laserstrahlbearbeitung eines Bearbeitungswerkstückes unter Verwendung eines gepulsten Laserstrahles und eines expandierten Klebstoffsbleches zum Schneiden eines zum bearbeitenden Objektes
EP10009404.4A EP2269765B1 (de) 2003-07-18 2004-07-16 Geschnittener Halbleiterchip

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003277039 2003-07-18
PCT/JP2004/010224 WO2005007335A1 (ja) 2003-07-18 2004-07-16 レーザ加工方法、レーザ加工装置、及び加工生産物

Related Child Applications (5)

Application Number Title Priority Date Filing Date
EP10009404.4A Division-Into EP2269765B1 (de) 2003-07-18 2004-07-16 Geschnittener Halbleiterchip
EP10009404.4A Division EP2269765B1 (de) 2003-07-18 2004-07-16 Geschnittener Halbleiterchip
EP11001001.4A Division-Into EP2324950B1 (de) 2003-07-18 2004-07-16 Zu schneidende Halbleitersubstrate mit behandelter Region und Loch-Region, und Verfahren zum Schneiden dieser Substrate
EP11001000.6A Division-Into EP2332687B1 (de) 2003-07-18 2004-07-16 Verfahren zur Laserstrahlbearbeitung eines Bearbeitungswerkstückes unter Verwendung eines gepulsten Laserstrahles und eines expandierten Klebstoffsbleches zum Schneiden eines zum bearbeitenden Objektes
EP11001000.6A Division EP2332687B1 (de) 2003-07-18 2004-07-16 Verfahren zur Laserstrahlbearbeitung eines Bearbeitungswerkstückes unter Verwendung eines gepulsten Laserstrahles und eines expandierten Klebstoffsbleches zum Schneiden eines zum bearbeitenden Objektes

Publications (3)

Publication Number Publication Date
EP1649965A1 EP1649965A1 (de) 2006-04-26
EP1649965A4 true EP1649965A4 (de) 2008-10-29
EP1649965B1 EP1649965B1 (de) 2012-10-24

Family

ID=34074622

Family Applications (4)

Application Number Title Priority Date Filing Date
EP04747689A Active EP1649965B1 (de) 2003-07-18 2004-07-16 Verfahren zur laserstrahlbearbeitung eines zu bearbeitenden zieles
EP10009404.4A Active EP2269765B1 (de) 2003-07-18 2004-07-16 Geschnittener Halbleiterchip
EP11001000.6A Active EP2332687B1 (de) 2003-07-18 2004-07-16 Verfahren zur Laserstrahlbearbeitung eines Bearbeitungswerkstückes unter Verwendung eines gepulsten Laserstrahles und eines expandierten Klebstoffsbleches zum Schneiden eines zum bearbeitenden Objektes
EP11001001.4A Active EP2324950B1 (de) 2003-07-18 2004-07-16 Zu schneidende Halbleitersubstrate mit behandelter Region und Loch-Region, und Verfahren zum Schneiden dieser Substrate

Family Applications After (3)

Application Number Title Priority Date Filing Date
EP10009404.4A Active EP2269765B1 (de) 2003-07-18 2004-07-16 Geschnittener Halbleiterchip
EP11001000.6A Active EP2332687B1 (de) 2003-07-18 2004-07-16 Verfahren zur Laserstrahlbearbeitung eines Bearbeitungswerkstückes unter Verwendung eines gepulsten Laserstrahles und eines expandierten Klebstoffsbleches zum Schneiden eines zum bearbeitenden Objektes
EP11001001.4A Active EP2324950B1 (de) 2003-07-18 2004-07-16 Zu schneidende Halbleitersubstrate mit behandelter Region und Loch-Region, und Verfahren zum Schneiden dieser Substrate

Country Status (9)

Country Link
US (3) US7605344B2 (de)
EP (4) EP1649965B1 (de)
JP (3) JP5015294B2 (de)
KR (3) KR101119387B1 (de)
CN (3) CN1826207B (de)
ES (1) ES2523432T3 (de)
MY (1) MY157824A (de)
TW (4) TWI590902B (de)
WO (1) WO2005007335A1 (de)

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ATE493226T1 (de) 2002-03-12 2011-01-15 Hamamatsu Photonics Kk Verfahren zum schneiden eines bearbeiteten objekts
US8268704B2 (en) 2002-03-12 2012-09-18 Hamamatsu Photonics K.K. Method for dicing substrate
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
TWI520269B (zh) 2002-12-03 2016-02-01 Hamamatsu Photonics Kk Cutting method of semiconductor substrate
FR2852250B1 (fr) 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
DE60315515T2 (de) 2003-03-12 2007-12-13 Hamamatsu Photonics K.K., Hamamatsu Laserstrahlbearbeitungsverfahren
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EP2332687A1 (de) 2011-06-15
CN101862906A (zh) 2010-10-20
US20100327416A1 (en) 2010-12-30
MY157824A (en) 2016-07-29
KR20110063871A (ko) 2011-06-14
JP2012192459A (ja) 2012-10-11
EP2324950B1 (de) 2013-11-06
CN1826207B (zh) 2010-06-16
WO2005007335A1 (ja) 2005-01-27
TW201041680A (en) 2010-12-01
KR101119387B1 (ko) 2012-03-07
EP2324950A1 (de) 2011-05-25
US20100151202A1 (en) 2010-06-17
EP2269765A1 (de) 2011-01-05
KR101193723B1 (ko) 2012-10-22
EP1649965A1 (de) 2006-04-26
JP5122611B2 (ja) 2013-01-16
JP2010267995A (ja) 2010-11-25
JP5554378B2 (ja) 2014-07-23
TW201121690A (en) 2011-07-01
US8852698B2 (en) 2014-10-07
KR20060054322A (ko) 2006-05-22
TW201249577A (en) 2012-12-16
TWI376284B (en) 2012-11-11
TWI406726B (zh) 2013-09-01
TW200515966A (en) 2005-05-16
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US20070170159A1 (en) 2007-07-26
CN101862907B (zh) 2014-01-22
TWI590902B (zh) 2017-07-11
JP5015294B2 (ja) 2012-08-29
CN101862906B (zh) 2014-01-15
CN1826207A (zh) 2006-08-30
TWI340676B (en) 2011-04-21
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CN101862907A (zh) 2010-10-20
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US7605344B2 (en) 2009-10-20
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ES2523432T3 (es) 2014-11-25
KR101119289B1 (ko) 2012-03-15

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