MY148590A - Method of forming cutting start point region and method of cutting object to be processed - Google Patents

Method of forming cutting start point region and method of cutting object to be processed

Info

Publication number
MY148590A
MY148590A MYPI20030866A MY148590A MY 148590 A MY148590 A MY 148590A MY PI20030866 A MYPI20030866 A MY PI20030866A MY 148590 A MY148590 A MY 148590A
Authority
MY
Malaysia
Prior art keywords
cut
line
start point
cutting
forming
Prior art date
Application number
Inventor
Fumitsugu Fukuyo
Kenshi Fukumitsu
Original Assignee
Hamamatsu Photonics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002067406A external-priority patent/JP4050534B2/en
Application filed by Hamamatsu Photonics Kk filed Critical Hamamatsu Photonics Kk
Publication of MY148590A publication Critical patent/MY148590A/en

Links

Landscapes

  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)

Abstract

TO PROVIDE METHODS OF FORMING A CUTTING START POINT REGION AND CUTTING AN OBJECT TO BE PROCESSED WITHOUT GENERATING MELT OR FRACTURES DEVIATING FROM A LINE TO BE CUT IN THE SURFACE OF THE OBJECT. A LINE TO BE CUT 5 IN A SURFACE 3 OF AN OBJECT TO BE PROCESSES 1 IS IRRADIATED WITH PULSE LASER LIGHT L WHILE LOCATING A LIGHT-COVERGING POINT P WITHIN THE OBJEC 1 UNDER A CONDITION CAUSING MULTIPHOTON ABSORPTION. BY MOVING THE LIGHT-CONVERGING POINT P ALONG THE LINE TO BE CUT 5, A MODIFIED REGION IS FORMED WITHIN THE OBJECT 1 ALONG THE LINE TO BE CUT 5. WHEN THE OBJECT 1 IS BROKEN ALONG THE LINE TO BE CUT 5 BY USING THE MODIFIED REGION AS A START POINT, THE OBJECT 1 CAN BE CUT WITH A RELATIVELY SMALL FORCE. UPON IRRADIATION WITH THE LASER LIGHT L, THE SURFACE 3 OF THE OBJECT 1 HARDLY ABSORBS THE PULSE LASER LIGHT L, WHEREBY THE SURFACE 3 WILL NOT MELT BECAUSE OF THE FORMING OF THE MODIFIED REGION.
MYPI20030866 2002-03-12 2003-03-12 Method of forming cutting start point region and method of cutting object to be processed MY148590A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002067348 2002-03-12
JP2002067372 2002-03-12
JP2002067406A JP4050534B2 (en) 2002-03-12 2002-03-12 Laser processing method

Publications (1)

Publication Number Publication Date
MY148590A true MY148590A (en) 2013-05-15

Family

ID=50276850

Family Applications (6)

Application Number Title Priority Date Filing Date
MYPI2012003182A MY185427A (en) 2002-03-12 2003-03-12 Method of forming cutting start point region and method of cutting object to be processed
MYPI20030866 MY148590A (en) 2002-03-12 2003-03-12 Method of forming cutting start point region and method of cutting object to be processed
MYPI2012003174A MY185431A (en) 2002-03-12 2003-03-12 Method of forming cutting start point region and method of cutting object to be processed
MYPI20051371A MY172630A (en) 2002-03-12 2003-03-12 Method of forming cutting start point region and method of cutting object to be processed
MYPI20090803A MY173375A (en) 2002-03-12 2003-03-12 Method of forming cutting start point region and method of cutting object to be processed
MYPI2012003181A MY184996A (en) 2002-03-12 2003-03-12 Method of forming cutting start point region and method of cutting object to be processed

Family Applications Before (1)

Application Number Title Priority Date Filing Date
MYPI2012003182A MY185427A (en) 2002-03-12 2003-03-12 Method of forming cutting start point region and method of cutting object to be processed

Family Applications After (4)

Application Number Title Priority Date Filing Date
MYPI2012003174A MY185431A (en) 2002-03-12 2003-03-12 Method of forming cutting start point region and method of cutting object to be processed
MYPI20051371A MY172630A (en) 2002-03-12 2003-03-12 Method of forming cutting start point region and method of cutting object to be processed
MYPI20090803A MY173375A (en) 2002-03-12 2003-03-12 Method of forming cutting start point region and method of cutting object to be processed
MYPI2012003181A MY184996A (en) 2002-03-12 2003-03-12 Method of forming cutting start point region and method of cutting object to be processed

Country Status (1)

Country Link
MY (6) MY185427A (en)

Also Published As

Publication number Publication date
MY185431A (en) 2021-05-19
MY173375A (en) 2020-01-21
MY184996A (en) 2021-04-30
MY172630A (en) 2019-12-06
MY185427A (en) 2021-05-19

Similar Documents

Publication Publication Date Title
EP1498215A4 (en) Laser processing method
SG146432A1 (en) Laser processing method and laser processing apparatus
ATE346828T1 (en) METHOD AND DEVICE FOR CUTTING A FLAT WORKPIECE MADE OF A BRITTLE MATERIAL
ATE302099T1 (en) METHOD AND DEVICE FOR CUTTING PRE-IMPREGNATURE
TW200631718A (en) Division starting point forming method in body to be divided, dividing method for body to be divided, and method of processing work by pulse laser beam
EP1649965A4 (en) Laser beam machining method, laser beam machining apparatus, and laser machined product
MY172847A (en) Laser processing method and semiconductor apparatus
IL216690A0 (en) Semiconductor substrate cutting method
MY137997A (en) Manufacturing method of laser processed parts, and pressure-sensitive adhesive sheet for laser processing used for the same
MY141077A (en) Laser processing method
TW200615070A (en) Method and apparatus for cutting substrate using femtosecond laser
JP2003088976A5 (en)
ATA217899A (en) METHOD AND DEVICE FOR CUTTING GLASS PANES
MXPA05008050A (en) A method of forming an earplug by laser ablation and an earplug formed thereby.
MY148590A (en) Method of forming cutting start point region and method of cutting object to be processed
ATE267674T1 (en) METHOD AND DEVICE FOR PRODUCING WOODEN OBJECTS WITH COMPLEX SHAPES
DE59901379D1 (en) Y-chamfer cutting process