DK1933588T3 - Lydtransmitterende membran, elektronisk del med lydtransmitterende membran og fremgangsmåde til fremstilling af printkort, som har den elektroniske del monteret herpå - Google Patents
Lydtransmitterende membran, elektronisk del med lydtransmitterende membran og fremgangsmåde til fremstilling af printkort, som har den elektroniske del monteret herpåInfo
- Publication number
- DK1933588T3 DK1933588T3 DK06783260T DK06783260T DK1933588T3 DK 1933588 T3 DK1933588 T3 DK 1933588T3 DK 06783260 T DK06783260 T DK 06783260T DK 06783260 T DK06783260 T DK 06783260T DK 1933588 T3 DK1933588 T3 DK 1933588T3
- Authority
- DK
- Denmark
- Prior art keywords
- electronic part
- sound transmitting
- transmitting diaphragm
- printed circuit
- circuit boards
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/023—Screens for loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249982—With component specified as adhesive or bonding agent
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005267647A JP4708134B2 (ja) | 2005-09-14 | 2005-09-14 | 通音膜、通音膜付き電子部品及びその電子部品を実装した回路基板の製造方法 |
PCT/JP2006/317983 WO2007032312A1 (ja) | 2005-09-14 | 2006-09-11 | 通音膜、通音膜付き電子部品及びその電子部品を実装した回路基板の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DK1933588T3 true DK1933588T3 (da) | 2010-11-08 |
Family
ID=37864905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK06783260T DK1933588T3 (da) | 2005-09-14 | 2006-09-11 | Lydtransmitterende membran, elektronisk del med lydtransmitterende membran og fremgangsmåde til fremstilling af printkort, som har den elektroniske del monteret herpå |
Country Status (9)
Country | Link |
---|---|
US (1) | US8141678B2 (da) |
EP (1) | EP1933588B1 (da) |
JP (1) | JP4708134B2 (da) |
KR (1) | KR101204550B1 (da) |
CN (1) | CN101263733B (da) |
DE (1) | DE602006015981D1 (da) |
DK (1) | DK1933588T3 (da) |
TW (1) | TWI405471B (da) |
WO (1) | WO2007032312A1 (da) |
Families Citing this family (73)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4708134B2 (ja) * | 2005-09-14 | 2011-06-22 | 日東電工株式会社 | 通音膜、通音膜付き電子部品及びその電子部品を実装した回路基板の製造方法 |
JP2008271426A (ja) * | 2007-04-24 | 2008-11-06 | Matsushita Electric Works Ltd | 音響センサ |
US8695812B2 (en) * | 2007-07-18 | 2014-04-15 | Nitto Denko Corporation | Water-proof sound-transmitting membrane, method for producing water-proof sound-transmitting membrane, and electrical appliance using the membrane |
JP5356734B2 (ja) * | 2008-06-20 | 2013-12-04 | 日本ゴア株式会社 | 音響部品及びその製造方法 |
JP5286006B2 (ja) * | 2008-09-17 | 2013-09-11 | 日本ゴア株式会社 | 防水通音フード |
CN102123863B (zh) * | 2009-01-21 | 2013-08-21 | 日东电工株式会社 | 防水透声膜和其制造方法以及使用该防水透声膜的电器 |
US8157048B2 (en) * | 2009-04-22 | 2012-04-17 | Gore Enterprise Holdings, Inc. | Splash proof acoustically resistive color assembly |
US8811634B2 (en) | 2009-04-23 | 2014-08-19 | Audio Pixels Ltd. | Dust protection apparatus for flat loudspeakers |
WO2011027572A1 (ja) * | 2009-09-04 | 2011-03-10 | 日東電工株式会社 | マイクロフォン用通音膜とそれを備えるマイクロフォン用通音膜部材、マイクロフォンならびにマイクロフォンを備える電子機器 |
KR102241666B1 (ko) | 2010-06-16 | 2021-04-16 | 닛토덴코 가부시키가이샤 | 방수 통기 필터 및 그의 용도 |
KR101967934B1 (ko) | 2010-06-16 | 2019-04-10 | 닛토덴코 가부시키가이샤 | 방수 통기 필터 및 그의 용도 |
CN102547497A (zh) * | 2010-12-14 | 2012-07-04 | 富泰华工业(深圳)有限公司 | 喇叭孔防尘网及其固定方法与采用其的电子装置 |
US9171535B2 (en) * | 2011-03-03 | 2015-10-27 | Nitto Denko Corporation | Waterproof sound-transmitting membrane and electrical product |
ITMI20111579A1 (it) * | 2011-09-02 | 2013-03-03 | Saati Spa | Microfono mems con schermo tessile integrato di protezione. |
DE102011086722A1 (de) * | 2011-11-21 | 2013-05-23 | Robert Bosch Gmbh | Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren |
JP6068886B2 (ja) * | 2012-03-30 | 2017-01-25 | 日東電工株式会社 | 換気システム |
KR20150021960A (ko) * | 2012-05-31 | 2015-03-03 | 닛토덴코 가부시키가이샤 | 음향 부품용 보호 부재 및 방수 케이스 |
JP2015528756A (ja) | 2012-06-28 | 2015-10-01 | スリーエム イノベイティブ プロパティズ カンパニー | 熱伝導性基板物品 |
JP5947655B2 (ja) * | 2012-08-02 | 2016-07-06 | 日東電工株式会社 | ポリテトラフルオロエチレン多孔質膜、並びに、それを用いた通気膜および通気部材 |
KR101948969B1 (ko) * | 2012-11-21 | 2019-02-15 | 닛토덴코 가부시키가이샤 | 통음막, 및 통음막을 구비한 전자 기기 |
WO2014092462A1 (ko) * | 2012-12-11 | 2014-06-19 | 주식회사 아모그린텍 | 방수통음시트 및 이의 제조 방법 |
CN104159742B (zh) * | 2012-12-11 | 2016-03-16 | 阿莫绿色技术有限公司 | 防水传声片材及其生产方法 |
CN104159743B (zh) * | 2012-12-11 | 2016-03-30 | 阿莫绿色技术有限公司 | 防水传声片材及其生产方法 |
JP6118131B2 (ja) * | 2013-02-25 | 2017-04-19 | 日東電工株式会社 | 防水通音膜、通音部材、及び電気機器 |
JP6069078B2 (ja) * | 2013-04-15 | 2017-01-25 | 日東電工株式会社 | 防水通音膜およびその製造方法、ならびに防水通音部材 |
US20140374608A1 (en) * | 2013-06-19 | 2014-12-25 | Canon Kabushiki Kaisha | Radiation detection apparatus and method of manufacturing the same |
JP6687516B2 (ja) * | 2013-10-15 | 2020-04-22 | ドナルドソン カンパニー,インコーポレイティド | 音響ベント用の微孔質膜積層体 |
US9264832B2 (en) * | 2013-10-30 | 2016-02-16 | Solid State System Co., Ltd. | Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level |
KR102173571B1 (ko) * | 2013-11-07 | 2020-11-03 | 닛토덴코 가부시키가이샤 | 방수 통음막 및 전자 기기 |
US11627419B2 (en) | 2014-01-06 | 2023-04-11 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11304011B2 (en) | 2014-01-06 | 2022-04-12 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11582563B2 (en) | 2014-01-06 | 2023-02-14 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11570556B2 (en) | 2014-01-06 | 2023-01-31 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11582565B2 (en) * | 2014-01-06 | 2023-02-14 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11297446B2 (en) | 2014-01-06 | 2022-04-05 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11974097B2 (en) | 2014-01-06 | 2024-04-30 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11950055B2 (en) | 2014-01-06 | 2024-04-02 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11582564B2 (en) | 2014-01-06 | 2023-02-14 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11363392B2 (en) | 2014-01-06 | 2022-06-14 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11375324B2 (en) | 2014-01-06 | 2022-06-28 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11805375B2 (en) | 2014-01-06 | 2023-10-31 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11589172B2 (en) | 2014-01-06 | 2023-02-21 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11368800B2 (en) | 2014-01-06 | 2022-06-21 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11558698B2 (en) | 2014-01-06 | 2023-01-17 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11622209B2 (en) | 2014-01-06 | 2023-04-04 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11197106B2 (en) | 2014-01-06 | 2021-12-07 | Shenzhen Voxtech Co., Ltd. | Systems and methods for suppressing sound leakage |
US11832060B2 (en) | 2014-01-06 | 2023-11-28 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11706574B2 (en) | 2014-01-06 | 2023-07-18 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11617045B2 (en) | 2014-01-06 | 2023-03-28 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
US11589171B2 (en) | 2014-01-06 | 2023-02-21 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
JP6324109B2 (ja) * | 2014-02-26 | 2018-05-16 | 日東電工株式会社 | 防水通音膜の製造方法、防水通音膜及び電子機器 |
JP2016022415A (ja) * | 2014-07-18 | 2016-02-08 | 日本バルカー工業株式会社 | ポリテトラフルオロエチレンファイバを含む不織布層からなる防水通気膜と接着層とを有する防水通気部材およびその用途 |
US9538272B2 (en) * | 2014-09-08 | 2017-01-03 | Apple Inc. | Acoustic mesh and methods of use for electronic devices |
WO2016059804A1 (ja) | 2014-10-16 | 2016-04-21 | 日東電工株式会社 | 通音膜とそれを備える通音膜部材、ならびにマイクロフォンおよび電子機器 |
CN104853294B (zh) * | 2015-04-23 | 2019-05-24 | 歌尔股份有限公司 | 一种硅胶振膜、扬声器模组和再加工硅胶振膜的方法 |
CN104853304A (zh) * | 2015-04-23 | 2015-08-19 | 歌尔声学股份有限公司 | 一种硅胶振膜、受话器模组和加工硅胶振膜的方法 |
CN108141652A (zh) | 2015-11-24 | 2018-06-08 | 日东电工株式会社 | 防水透声膜、防水透声构件以及电子设备 |
CN108290730A (zh) * | 2015-11-30 | 2018-07-17 | W.L.戈尔及同仁股份有限公司 | 用于裸芯片的保护环境阻隔件 |
ITUB20160059A1 (it) | 2016-02-04 | 2017-08-04 | Saati Spa | Struttura composita filtrante multistrato, in particolare per l'uso come subcomponente all'interno di prodotti acustici ed elettronici in generale |
EP3219837B1 (de) | 2016-03-15 | 2019-08-14 | Sefar AG | Elektrisches gerät mit einer akustikkomponente und einem textilelement |
WO2018096858A1 (ja) * | 2016-11-24 | 2018-05-31 | リンテック株式会社 | 両面シリコーン粘着シート及び両面シリコーン粘着シートの製造方法 |
KR102520977B1 (ko) * | 2017-04-18 | 2023-04-11 | 닛토덴코 가부시키가이샤 | 적층체 및 권회체 |
KR20190137143A (ko) * | 2017-04-18 | 2019-12-10 | 닛토덴코 가부시키가이샤 | 적층체 및 권회체 |
CN110024415B (zh) | 2017-11-09 | 2020-12-22 | 日东电工株式会社 | 防水透声构件和具有该防水透声构件的电子设备 |
KR20200103766A (ko) * | 2017-12-28 | 2020-09-02 | 닛토덴코 가부시키가이샤 | 방수 부재 및 전자 기기 |
CN108430015A (zh) * | 2018-03-28 | 2018-08-21 | 努比亚技术有限公司 | 一种扬声结构及扬声器和听筒 |
JP6724231B2 (ja) | 2018-12-28 | 2020-07-15 | 日東電工株式会社 | 防水部材及び電子機器 |
KR20220032060A (ko) | 2019-07-12 | 2022-03-15 | 닛토덴코 가부시키가이샤 | 보호 커버 부재 및 이것을 구비하는 부재 공급용 시트 |
US20230108896A1 (en) * | 2020-03-18 | 2023-04-06 | Nitto Denko Corporation | Protective cover member and member supplying sheet |
DE112021004204T5 (de) | 2020-08-07 | 2023-06-01 | Nitto Denko Corporation | Schutzabdeckungselement und Elementzuführungslage |
CN112929798B (zh) * | 2021-01-29 | 2022-11-01 | 杭州安普鲁薄膜科技有限公司 | 一种防水透声膜组件及其装有防水透声膜组件的mems |
DE112022003389T5 (de) | 2021-07-02 | 2024-04-18 | Nitto Denko Corporation | Schutzabdeckungselement, elementzuführungslage und mikroelektromechanisches system |
CN113573220B (zh) * | 2021-07-28 | 2023-01-03 | 杭州安普鲁薄膜科技有限公司 | 一种带有防尘透声膜组件的mems复合件 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH098446A (ja) * | 1995-06-26 | 1997-01-10 | Matsushita Electric Ind Co Ltd | プリント基板の高密度実装方法 |
JP2834039B2 (ja) * | 1995-07-26 | 1998-12-09 | 埼玉日本電気株式会社 | 携帯無線電話 |
JPH09199631A (ja) * | 1996-01-23 | 1997-07-31 | Seiko Epson Corp | 半導体装置の構造と製造方法 |
US5828012A (en) * | 1996-05-31 | 1998-10-27 | W. L. Gore & Associates, Inc. | Protective cover assembly having enhanced acoustical characteristics |
JPH10150259A (ja) * | 1996-11-20 | 1998-06-02 | Matsushita Electric Works Ltd | 部品付きプリント配線板およびその製造方法 |
JPH10176150A (ja) * | 1996-12-20 | 1998-06-30 | Hitachi Chem Co Ltd | 耐熱性接着剤層付きフィルム及びこれを用いた半導体装置 |
DE19927145A1 (de) * | 1999-06-15 | 2000-12-28 | Bosch Gmbh Robert | Hochdruckanschluß für ein Kraftstoffeinspritzsystem für Brennkraftmaschinen |
US6512834B1 (en) * | 1999-07-07 | 2003-01-28 | Gore Enterprise Holdings, Inc. | Acoustic protective cover assembly |
JP2001244598A (ja) * | 2000-02-25 | 2001-09-07 | Sony Corp | チップ部品実装方法 |
US7434305B2 (en) | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
JP4380115B2 (ja) * | 2001-07-04 | 2009-12-09 | 東レ株式会社 | 耐熱性接着剤、耐熱性積層フィルム、金属箔付き積層フィルム及びこれを用いた半導体装置 |
JP2003053872A (ja) | 2001-08-13 | 2003-02-26 | Nitto Denko Corp | 通気性通音膜 |
JP3775329B2 (ja) * | 2002-03-27 | 2006-05-17 | 三井金属鉱業株式会社 | 電子部品実装用フィルムキャリアテープの製造方法、その製造装置およびその方法に用いられる保護テープ |
JP4213488B2 (ja) * | 2002-05-15 | 2009-01-21 | 日東電工株式会社 | 通気部材、これを用いた通気筐体、通気部材の抜け防止具および通気構造形成キット |
JP3974834B2 (ja) * | 2002-08-26 | 2007-09-12 | 松下電器産業株式会社 | 電子部品の装着方法 |
JP4204835B2 (ja) * | 2002-09-30 | 2009-01-07 | 日東電工株式会社 | 粘着テープ及び粘着テープの使用方法 |
JP4484478B2 (ja) * | 2003-09-19 | 2010-06-16 | 日東電工株式会社 | 接着機能付き回路基板 |
JP4459111B2 (ja) * | 2005-05-24 | 2010-04-28 | 信越ポリマー株式会社 | 電子部品保持具の製造方法 |
JP4708134B2 (ja) * | 2005-09-14 | 2011-06-22 | 日東電工株式会社 | 通音膜、通音膜付き電子部品及びその電子部品を実装した回路基板の製造方法 |
US7561704B2 (en) * | 2005-12-07 | 2009-07-14 | Yen-Chen Chan | Structure of speaker |
US8290179B2 (en) * | 2008-08-21 | 2012-10-16 | Apple Inc. | Multiple-use acoustic port |
TW201026097A (en) * | 2008-12-30 | 2010-07-01 | Ind Tech Res Inst | Solar flexpeaker structure and speaker therewith |
CN102123863B (zh) * | 2009-01-21 | 2013-08-21 | 日东电工株式会社 | 防水透声膜和其制造方法以及使用该防水透声膜的电器 |
-
2005
- 2005-09-14 JP JP2005267647A patent/JP4708134B2/ja active Active
-
2006
- 2006-09-11 CN CN2006800335757A patent/CN101263733B/zh active Active
- 2006-09-11 KR KR1020087008626A patent/KR101204550B1/ko active IP Right Grant
- 2006-09-11 DK DK06783260T patent/DK1933588T3/da active
- 2006-09-11 EP EP20060783260 patent/EP1933588B1/en active Active
- 2006-09-11 WO PCT/JP2006/317983 patent/WO2007032312A1/ja active Application Filing
- 2006-09-11 US US11/991,977 patent/US8141678B2/en active Active
- 2006-09-11 DE DE200660015981 patent/DE602006015981D1/de active Active
- 2006-09-13 TW TW95133852A patent/TWI405471B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP4708134B2 (ja) | 2011-06-22 |
US20090268928A1 (en) | 2009-10-29 |
EP1933588A1 (en) | 2008-06-18 |
CN101263733A (zh) | 2008-09-10 |
JP2007081881A (ja) | 2007-03-29 |
TW200729992A (en) | 2007-08-01 |
KR20080064832A (ko) | 2008-07-09 |
DE602006015981D1 (de) | 2010-09-16 |
WO2007032312A1 (ja) | 2007-03-22 |
EP1933588A4 (en) | 2009-03-18 |
US8141678B2 (en) | 2012-03-27 |
CN101263733B (zh) | 2011-11-30 |
KR101204550B1 (ko) | 2012-11-26 |
EP1933588B1 (en) | 2010-08-04 |
TWI405471B (zh) | 2013-08-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DK1933588T3 (da) | Lydtransmitterende membran, elektronisk del med lydtransmitterende membran og fremgangsmåde til fremstilling af printkort, som har den elektroniske del monteret herpå | |
DE602006017908D1 (de) | Leiterplatte | |
EP2517481A4 (en) | SURFACE MOUNTED MICROPHONE ARRAYS ON FLEXIBLE PRINTED CIRCUIT BOARDS | |
DE602006014844D1 (de) | Schaltung zur erzeugung von pwm-signalen | |
DE602006003378D1 (de) | Elektroakustischer Wandler | |
DE602005021305D1 (de) | Leiterplatte | |
JP2011134884A5 (da) | ||
DE602005024783D1 (de) | Verbinder für Leiterplatte | |
DE602006006228D1 (de) | Kommunikationseinrichtung, elektronische Vorrichtung, Bildaufnahmevorrichtung | |
DE602007001847D1 (de) | Flexible Leiterplatte | |
EP1921675A4 (en) | PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MODULE USING THE SAME, MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD | |
DK2057153T3 (da) | (3-aryl-piperazin-1-yl)-derivater af 6,7 dialkoxyquinazolin, 6,7- dialkoxyphtalazin og 6,7-dialkoxyisoquinolin | |
DE602007011692D1 (de) | Leiterplatte | |
DE602007000582D1 (de) | Leiterplatte | |
NO20054151D0 (no) | Hoyttaler, hoyttalermodul, elektronisk apparat og utstyr | |
DE602005017293D1 (de) | Vernetzte fluorocopolymerformen | |
DE602006019994D1 (de) | Leiterplatte | |
DK2263021T3 (da) | Elastomerkomponenter der kan forspændes af trykorgan og fremgangsmåde til fremstilling deraf | |
EP1837669A4 (en) | SIGNAL TRANSMISSION SYSTEM, SIGNAL OUTPUT CIRCUIT BOARD, SIGNAL RECEIVING CIRCUIT BOARD, SIGNAL OUTPUT METHOD AND SIGNAL RECEPTION PROCEDURE | |
TW200708472A (en) | Assembling structure by itself of polyimide film | |
FR2867937B1 (fr) | Monture de module de haut parleur, module de haut-parleur associe et dispositif electronique avec un module de haut-parleur | |
DE502006009152D1 (de) | Leiterplatte | |
EP1944634A4 (en) | FIXING MEMBER FOR FIXING MULTIPLE PCB AND MODULE WITH SUCH A FIXING MEMBER | |
NL2001706A1 (nl) | Printed circuit board assembly and manufacturing method for the same. | |
ATE462574T1 (de) | Abbildungskopfhalterung |