DE69908194D1 - Kapselung für organische leds - Google Patents
Kapselung für organische ledsInfo
- Publication number
- DE69908194D1 DE69908194D1 DE69908194T DE69908194T DE69908194D1 DE 69908194 D1 DE69908194 D1 DE 69908194D1 DE 69908194 T DE69908194 T DE 69908194T DE 69908194 T DE69908194 T DE 69908194T DE 69908194 D1 DE69908194 D1 DE 69908194D1
- Authority
- DE
- Germany
- Prior art keywords
- sealing
- cap
- dam
- oled
- enclosure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007789 sealing Methods 0.000 abstract 5
- 238000005538 encapsulation Methods 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 125000006850 spacer group Chemical group 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/SG1999/000143 WO2001045140A2 (en) | 1999-12-17 | 1999-12-17 | Encapsulation for organic led device |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69908194D1 true DE69908194D1 (de) | 2003-06-26 |
DE69908194T2 DE69908194T2 (de) | 2004-02-05 |
Family
ID=20430264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69908194T Expired - Lifetime DE69908194T2 (de) | 1999-12-17 | 1999-12-17 | Kapselung für organische leds |
Country Status (8)
Country | Link |
---|---|
US (2) | US6949880B1 (de) |
EP (1) | EP1240808B1 (de) |
JP (1) | JP2003517182A (de) |
AT (1) | ATE241253T1 (de) |
AU (1) | AU1904000A (de) |
DE (1) | DE69908194T2 (de) |
TW (1) | TW492166B (de) |
WO (1) | WO2001045140A2 (de) |
Families Citing this family (57)
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TWI222839B (en) * | 1999-12-17 | 2004-10-21 | Osram Opto Semiconductors Gmbh | Method for encapsulation of electronic devices |
EP1240808B1 (de) | 1999-12-17 | 2003-05-21 | Osram Opto Semiconductors GmbH | Kapselung für organische leds |
US7394153B2 (en) * | 1999-12-17 | 2008-07-01 | Osram Opto Semiconductors Gmbh | Encapsulation of electronic devices |
WO2001044865A1 (en) | 1999-12-17 | 2001-06-21 | Osram Opto Semiconductors Gmbh | Improved encapsulation for organic led device |
DE69936072T2 (de) | 1999-12-17 | 2008-01-10 | Osram Opto Semiconductors Gmbh | Verbesserte organische led-vorrichtung |
US6692610B2 (en) * | 2001-07-26 | 2004-02-17 | Osram Opto Semiconductors Gmbh | Oled packaging |
GB2378564A (en) * | 2001-08-07 | 2003-02-12 | Cambridge Display Tech Ltd | Flexible light emitting device with incompressible spacers |
US6936856B2 (en) | 2002-01-15 | 2005-08-30 | Osram Opto Semiconductors Gmbh | Multi substrate organic light emitting devices |
JP4651916B2 (ja) * | 2002-03-07 | 2011-03-16 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
EP1343206B1 (de) | 2002-03-07 | 2016-10-26 | Semiconductor Energy Laboratory Co., Ltd. | Lichtemittierende Vorrichtung, elektronische Vorrichtung, Beleuchtungsvorrichtung und Herstellungsverfahren der lichtemittierenden Vorrichtung |
JP4545385B2 (ja) * | 2002-03-26 | 2010-09-15 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
KR100941129B1 (ko) | 2002-03-26 | 2010-02-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광장치 및 그의 제조방법 |
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US7148624B2 (en) | 2002-05-07 | 2006-12-12 | Osram Opto Semiconductors (Malaysia) Sdn. Bhd | Uniform deposition of organic layer |
US7221093B2 (en) * | 2002-06-10 | 2007-05-22 | Institute Of Materials Research And Engineering | Patterning of electrodes in OLED devices |
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US7026660B2 (en) | 2003-04-25 | 2006-04-11 | Osram Opto Semiconductors (Malaysia) Sdn. Bhd | Interconnection for organic devices |
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US6995035B2 (en) * | 2003-06-16 | 2006-02-07 | Eastman Kodak Company | Method of making a top-emitting OLED device having improved power distribution |
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US20060283546A1 (en) * | 2003-11-12 | 2006-12-21 | Tremel James D | Method for encapsulating electronic devices and a sealing assembly for the electronic devices |
DE102004004311A1 (de) * | 2004-01-28 | 2005-08-18 | Fer Fahrzeugelektrik Gmbh | Herstellungsverfahren für eine El-Lampe |
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US7459850B2 (en) * | 2005-06-22 | 2008-12-02 | Eastman Kodak Company | OLED device having spacers |
US7531955B2 (en) | 2005-07-12 | 2009-05-12 | Eastman Kodak Company | OLED device with improved efficiency and robustness |
TWI331479B (en) * | 2005-12-02 | 2010-10-01 | Au Optronics Corp | Dual emission display |
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TWI331885B (en) * | 2006-01-12 | 2010-10-11 | Ind Tech Res Inst | Fabricating method of organic electronic device |
US7667383B2 (en) | 2006-02-15 | 2010-02-23 | Osram Opto Semiconductors Gmbh | Light source comprising a common substrate, a first led device and a second led device |
DE102006033713A1 (de) | 2006-05-30 | 2007-12-06 | Osram Opto Semiconductors Gmbh | Organisches lichtemittierendes Bauelement, Vorrichtung mit einem organischen lichtemittierenden Bauelement und Beleuchtungseinrichtung sowie Verfahren zur Herstellung eines organischen lichtemittierenden Bauelements |
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DE102006061943B4 (de) * | 2006-12-29 | 2023-03-30 | Pictiva Displays International Limited | Lichtemittierende Vorrichtung |
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US8830695B2 (en) * | 2007-01-25 | 2014-09-09 | Osram Opto Semiconductors Gmbh | Encapsulated electronic device |
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JP5625340B2 (ja) * | 2009-12-07 | 2014-11-19 | 富士通セミコンダクター株式会社 | 半導体装置とその製造方法 |
EP2693841B1 (de) | 2011-03-29 | 2021-08-18 | HotaluX, Ltd | Organische elektrolumineszente lichtemittierende vorrichtung, herstellungsverfahren dafür und organische elektrolumineszente beleuchtungsvorrichtung |
DE102011112476A1 (de) * | 2011-09-05 | 2013-03-07 | Epcos Ag | Bauelement und Verfahren zum Herstellen eines Bauelements |
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DE102012203637B4 (de) | 2012-03-08 | 2020-06-04 | Osram Oled Gmbh | Organisches optoelektronisches Bauelement und Verfahren zur Herstellung eines organischen optoelektronischen Bauelements |
JP6366100B2 (ja) * | 2012-03-30 | 2018-08-01 | Necライティング株式会社 | 有機エレクトロルミネッセンス照明パネル、その製造方法及び有機エレクトロルミネッセンス照明装置 |
KR102283856B1 (ko) * | 2013-11-22 | 2021-08-03 | 삼성디스플레이 주식회사 | 유기 발광 표시장치 및 그의 제조방법 |
CN103794637B (zh) * | 2014-02-24 | 2016-08-24 | 上海和辉光电有限公司 | 一种有源矩阵有机发光二极体面板及其封装方法 |
KR102393369B1 (ko) | 2014-10-14 | 2022-05-03 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
CN105655498B (zh) * | 2014-11-28 | 2017-11-17 | 上海和辉光电有限公司 | 一种oled显示装置及封装方法 |
KR102466959B1 (ko) | 2015-12-31 | 2022-11-11 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
US10756298B2 (en) * | 2017-11-03 | 2020-08-25 | OLEDWorks LLC | Solder hermetic sealing for OLEDs |
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US10600937B1 (en) * | 2018-09-17 | 2020-03-24 | Lumileds Holding B.V. | Precise bondline control between LED components |
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-
1999
- 1999-12-17 EP EP99962636A patent/EP1240808B1/de not_active Expired - Lifetime
- 1999-12-17 US US10/168,058 patent/US6949880B1/en not_active Expired - Lifetime
- 1999-12-17 WO PCT/SG1999/000143 patent/WO2001045140A2/en active IP Right Grant
- 1999-12-17 AU AU19040/00A patent/AU1904000A/en not_active Abandoned
- 1999-12-17 US US09/968,167 patent/US8344360B2/en not_active Expired - Lifetime
- 1999-12-17 AT AT99962636T patent/ATE241253T1/de not_active IP Right Cessation
- 1999-12-17 DE DE69908194T patent/DE69908194T2/de not_active Expired - Lifetime
- 1999-12-17 JP JP2001545343A patent/JP2003517182A/ja active Pending
-
2001
- 2001-01-12 TW TW090100690A patent/TW492166B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6949880B1 (en) | 2005-09-27 |
JP2003517182A (ja) | 2003-05-20 |
TW492166B (en) | 2002-06-21 |
US20030062518A1 (en) | 2003-04-03 |
EP1240808A2 (de) | 2002-09-18 |
DE69908194T2 (de) | 2004-02-05 |
EP1240808B1 (de) | 2003-05-21 |
ATE241253T1 (de) | 2003-06-15 |
AU1904000A (en) | 2001-06-25 |
US8344360B2 (en) | 2013-01-01 |
WO2001045140A2 (en) | 2001-06-21 |
WO2001045140A3 (en) | 2002-01-03 |
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