ATE254830T1 - Elektrisches modul mit wärmeschrumpfbarem polymer - Google Patents

Elektrisches modul mit wärmeschrumpfbarem polymer

Info

Publication number
ATE254830T1
ATE254830T1 AT00963424T AT00963424T ATE254830T1 AT E254830 T1 ATE254830 T1 AT E254830T1 AT 00963424 T AT00963424 T AT 00963424T AT 00963424 T AT00963424 T AT 00963424T AT E254830 T1 ATE254830 T1 AT E254830T1
Authority
AT
Austria
Prior art keywords
covers
circuit substrate
electromagnetic shields
heat shrinkable
heat
Prior art date
Application number
AT00963424T
Other languages
English (en)
Inventor
James D Macdonald
Walter Marcinkiewicz
Gregory S Mendolia
Original Assignee
Ericsson Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Inc filed Critical Ericsson Inc
Application granted granted Critical
Publication of ATE254830T1 publication Critical patent/ATE254830T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Thermistors And Varistors (AREA)
  • Insulators (AREA)
AT00963424T 1999-10-28 2000-09-14 Elektrisches modul mit wärmeschrumpfbarem polymer ATE254830T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/429,333 US6538196B1 (en) 1999-10-28 1999-10-28 Electric module structure formed with a polymer shrunk material
PCT/US2000/025139 WO2001031986A1 (en) 1999-10-28 2000-09-14 Electric module structure formed with a polymer shrunk material

Publications (1)

Publication Number Publication Date
ATE254830T1 true ATE254830T1 (de) 2003-12-15

Family

ID=23702795

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00963424T ATE254830T1 (de) 1999-10-28 2000-09-14 Elektrisches modul mit wärmeschrumpfbarem polymer

Country Status (8)

Country Link
US (1) US6538196B1 (de)
EP (1) EP1224849B1 (de)
JP (1) JP2003515247A (de)
CN (1) CN1385054A (de)
AT (1) ATE254830T1 (de)
AU (1) AU7483900A (de)
DE (1) DE60006709D1 (de)
WO (1) WO2001031986A1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3876109B2 (ja) * 2000-03-29 2007-01-31 松下電器産業株式会社 電子回路形成品の製造方法
US6747876B1 (en) * 2001-12-28 2004-06-08 Geo-X Systems, Ltd. Seismic data acquisition module
US6891733B2 (en) * 2002-01-03 2005-05-10 Geo-X Systems, Ltd. Seismic data acquisition module
JP2005116762A (ja) * 2003-10-07 2005-04-28 Fujitsu Ltd 半導体装置の保護方法及び半導体装置用カバー及び半導体装置ユニット及び半導体装置の梱包構造
JP2005316475A (ja) * 2004-04-29 2005-11-10 Sumitomo Electric Ind Ltd 光トランシーバ
JP4454388B2 (ja) * 2004-05-20 2010-04-21 日本電気株式会社 半導体モジュール
CN1707698A (zh) * 2004-06-12 2005-12-14 鸿富锦精密工业（深圳）有限公司 可屏蔽电磁干扰的电子装置
CN100340962C (zh) * 2004-06-15 2007-10-03 日月光半导体制造股份有限公司 触摸传感封装构造
DE102005015768A1 (de) * 2005-03-29 2006-10-05 Robert Bosch Gmbh Steuervorrichtung
US20090002969A1 (en) * 2007-06-27 2009-01-01 Rf Micro Devices, Inc. Field barrier structures within a conformal shield
US8062930B1 (en) 2005-08-08 2011-11-22 Rf Micro Devices, Inc. Sub-module conformal electromagnetic interference shield
US8053872B1 (en) 2007-06-25 2011-11-08 Rf Micro Devices, Inc. Integrated shield for a no-lead semiconductor device package
US8959762B2 (en) 2005-08-08 2015-02-24 Rf Micro Devices, Inc. Method of manufacturing an electronic module
JP2009054093A (ja) * 2007-08-29 2009-03-12 Toshiba Corp コンデンサ配置支援システム、コンデンサ配置方法、及びプログラム
JP2010135639A (ja) * 2008-12-05 2010-06-17 Sanyo Electric Co Ltd プリント配線板の支持構造
TWM367571U (en) * 2009-06-26 2009-10-21 Quanta Comp Inc Electro-magnetic interference preventing module
US9137934B2 (en) 2010-08-18 2015-09-15 Rf Micro Devices, Inc. Compartmentalized shielding of selected components
US8835226B2 (en) 2011-02-25 2014-09-16 Rf Micro Devices, Inc. Connection using conductive vias
US9627230B2 (en) 2011-02-28 2017-04-18 Qorvo Us, Inc. Methods of forming a microshield on standard QFN package
JP5668627B2 (ja) * 2011-07-19 2015-02-12 株式会社村田製作所 回路モジュール
EP2820929A4 (de) * 2012-03-01 2015-09-30 Autoliv Dev Elektronische einheit mit einer leiterplatte und zwei gehäuseteilen
US9807890B2 (en) 2013-05-31 2017-10-31 Qorvo Us, Inc. Electronic modules having grounded electromagnetic shields
JP6427550B2 (ja) * 2016-12-27 2018-11-21 本田技研工業株式会社 電子装置
US11127689B2 (en) 2018-06-01 2021-09-21 Qorvo Us, Inc. Segmented shielding using wirebonds
US11219144B2 (en) 2018-06-28 2022-01-04 Qorvo Us, Inc. Electromagnetic shields for sub-modules
KR102553021B1 (ko) * 2018-12-18 2023-07-07 삼성전자주식회사 전자장치 하우징 및 이를 구비하는 전자 시스템
US11114363B2 (en) 2018-12-20 2021-09-07 Qorvo Us, Inc. Electronic package arrangements and related methods
US11515282B2 (en) 2019-05-21 2022-11-29 Qorvo Us, Inc. Electromagnetic shields with bonding wires for sub-modules

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587672Y2 (ja) 1977-08-11 1983-02-10 株式会社村田製作所 圧電振動子の密閉構造
EP0063913B1 (de) * 1981-04-21 1986-08-13 Sumitomo Electric Industries Limited Wärmeschrumpfbare Rohre
US4658334A (en) * 1986-03-19 1987-04-14 Rca Corporation RF signal shielding enclosure of electronic systems
US4858075A (en) 1987-01-30 1989-08-15 Bell Of Pennsylvania RF shielded and electrically insulated circuit board structure and method of making same
JPH0278372U (de) 1988-12-06 1990-06-15
CA2067331A1 (en) 1989-10-03 1991-04-04 Joseph Unsworth Electro-active cradle circuits for the detection of access or penetration
TW311267B (de) 1994-04-11 1997-07-21 Raychem Ltd
US5597979A (en) 1995-05-12 1997-01-28 Schlegel Corporation EMI shielding having flexible condustive sheet and I/O Gasket
US5717577A (en) * 1996-10-30 1998-02-10 Ericsson, Inc. Gasketed shield can for shielding emissions of electromagnetic energy
WO1998037742A1 (en) 1997-02-18 1998-08-27 Koninklijke Philips Electronics N.V. Method of providing a synthetic resin capping layer on a printed circuit
SE511926C2 (sv) * 1997-04-16 1999-12-20 Ericsson Telefon Ab L M Skärmningshölje jämte förfarande för framställning och användning av ett skärmningshölje samt mobiltelefon med skärmningshölje
US6134121A (en) * 1998-02-02 2000-10-17 Motorola, Inc. Housing assembly utilizing a heat shrinkable composite laminate

Also Published As

Publication number Publication date
CN1385054A (zh) 2002-12-11
EP1224849A1 (de) 2002-07-24
EP1224849B1 (de) 2003-11-19
DE60006709D1 (de) 2003-12-24
WO2001031986A1 (en) 2001-05-03
US6538196B1 (en) 2003-03-25
JP2003515247A (ja) 2003-04-22
AU7483900A (en) 2001-05-08

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Legal Events

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