MY143357A - A carrier substrate for electronic components - Google Patents

A carrier substrate for electronic components

Info

Publication number
MY143357A
MY143357A MYPI20011836A MYPI20011836A MY143357A MY 143357 A MY143357 A MY 143357A MY PI20011836 A MYPI20011836 A MY PI20011836A MY PI20011836 A MYPI20011836 A MY PI20011836A MY 143357 A MY143357 A MY 143357A
Authority
MY
Malaysia
Prior art keywords
carrier substrate
electronic components
transparent
substrate
conductive layer
Prior art date
Application number
MYPI20011836A
Inventor
Thomas Dr Zenker
Christian Thiemann
Original Assignee
Schott Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7639642&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY143357(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Schott Ag filed Critical Schott Ag
Publication of MY143357A publication Critical patent/MY143357A/en

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H01L33/42—Transparent materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Abstract

THE INVENTION RELATES TO A CARRIER SUBSTRATE FOR ELECTRONIC COMPONENTS, IN PARTICULAR A LIGHTING MEANS, WHICH ARE APPLIED TO A SURFACE OF THE CARRIER SUBSTRATE WITH@A TRANSPARENT SUBSTRATE@A CONDUCTIVE LAYER APPLIED ON THE TRANSPARENT SUBSTRATE.THE INVENTION IS CHARACTERIZED BY THE FOLLOWING FEATURE:THE CONDUCTIVE LAYER IS TRANSPARENT OR QUASI-TRANSPARENT IN THE VISIBLE WAVELENGTH RANGE AND CAN BE STRUCTURED AT WILL .FIGURE 1
MYPI20011836A 2000-04-20 2001-04-18 A carrier substrate for electronic components MY143357A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10019888A DE10019888B4 (en) 2000-04-20 2000-04-20 Transparent electronic component arrangement and method for its production

Publications (1)

Publication Number Publication Date
MY143357A true MY143357A (en) 2011-04-29

Family

ID=7639642

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20011836A MY143357A (en) 2000-04-20 2001-04-18 A carrier substrate for electronic components

Country Status (8)

Country Link
EP (4) EP1275153B2 (en)
AT (2) ATE421168T1 (en)
AU (1) AU2001252218A1 (en)
DE (5) DE10019888B4 (en)
ES (2) ES2282758T3 (en)
MY (1) MY143357A (en)
TW (1) TWI284397B (en)
WO (1) WO2001082378A1 (en)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0216787D0 (en) 2002-07-19 2002-08-28 Pilkington Plc Laminated glazing panel
DE10249005A1 (en) * 2002-10-21 2004-05-06 Siemens Ag Method for producing a circuit arrangement
BE1015302A3 (en) 2003-01-10 2005-01-11 Glaverbel Glass with electronic components.
GB2406161B (en) * 2003-08-20 2006-02-22 Daimler Chrysler Ag Vehicle-mounted infrared radiation source for an infrared night vision system
DE10343529A1 (en) 2003-09-19 2005-04-21 Pepperl & Fuchs Device for the optical transmission of information
DE102004039883B3 (en) * 2004-08-17 2006-06-14 Schott Ag Transparent element comprises primary and secondary transparent plates, and an intermediate electrical consumer
DE102004039897A1 (en) * 2004-08-17 2006-03-02 Schott Ag Element with a variety of light emitting diodes
DE102005019375A1 (en) * 2005-02-28 2006-09-07 Osram Opto Semiconductors Gmbh LED array
ATE546836T1 (en) 2005-04-21 2012-03-15 Fiat Ricerche USE OF A TRANSPARENT LED DISPLAY DEVICE IN A MOTOR VEHICLE
ES2318382T3 (en) * 2005-06-16 2009-05-01 Asulab S.A. MANUFACTURING PROCEDURE OF A TRANSPARENT ELEMENT THAT INCLUDES TRANSPARENT ELECTRODES AND CORRESPONDING ELEMENT.
FR2892594B1 (en) * 2005-10-21 2007-12-07 Saint Gobain LIGHT STRUCTURE COMPRISING AT LEAST ONE ELECTROLUMINESCENT DIODE, ITS MANUFACTURE AND ITS APPLICATIONS
KR20080079655A (en) * 2005-11-21 2008-09-01 에이쥐씨 플랫 글래스 유럽 에스에이 Laminated assembly provided with light-emitting diodes
DE202005020315U1 (en) 2005-12-15 2006-02-16 Döppner Bauelemente GmbH & Co. KG Electrical socket connection
EP1956580A1 (en) * 2006-12-18 2008-08-13 AGC Flat Glass Europe SA Display panel
EP1935633A1 (en) * 2006-12-21 2008-06-25 AGC Flat Glass Europe SA Translucent Panel for connecting components
EP1947693B1 (en) * 2007-01-18 2015-03-25 Polytron Technologies, Inc. Plane structure of light-emitting diode lighting apparatus
TW200849160A (en) * 2007-04-03 2008-12-16 Koninkl Philips Electronics Nv Light output device
CN101687393B (en) 2007-06-04 2013-07-17 皇家飞利浦电子股份有限公司 Light output device
DE102008009775A1 (en) 2007-07-03 2009-01-08 Döppner Bauelemente GmbH & Co. KG Large-area display device i.e. transparent multimedia facade, for building, has transparent elements with substrate on which lighting elements i.e. LEDs, are arranged, where power supply of LEDs takes place over conducting paths
DE102007031642A1 (en) 2007-07-06 2009-01-08 Döppner Bauelemente GmbH & Co. KG Large-area display device i.e. transparent multimedia facade, for building, has transparent elements with substrate on which lighting elements i.e. LEDs, are arranged, where power supply of LEDs takes place over conducting paths
EP2172087A2 (en) * 2007-07-03 2010-04-07 Schott AG Display device, in particular transparent multimedia façade
CN101772798B (en) * 2007-08-02 2012-10-31 皇家飞利浦电子股份有限公司 Light output device
DE102007039416B4 (en) 2007-08-21 2018-03-29 Diehl Aircabin Gmbh Composite component with LEDs
DE102008009774A1 (en) 2008-02-19 2009-08-27 Schott Ag Element i.e. disk, for use in e.g. clinic, has film operated in two states, and laminated glass elements including surface, where glass elements provide protection against ionizing radiation and ultra-violet radiation
DE102009008658A1 (en) 2008-02-19 2009-09-10 Glaswerke Arnold Gmbh & Co. Kg Element i.e. disk, for use in e.g. clinic, has film operated in two states, and laminated glass elements including surface, where glass elements provide protection against ionizing radiation and ultra-violet radiation
DE202008008695U1 (en) 2008-06-28 2009-11-19 Schott Ag Modular lighting system
DE102009017659A1 (en) 2009-04-16 2010-10-28 Schott Ag Method for the conductive connection of a component on a transparent substrate
DE202009010065U1 (en) 2009-07-24 2010-12-23 Schott Ag Stele with a glass element
BE1019185A3 (en) * 2010-02-16 2012-04-03 Agc Glass Europe PANEL WITH IMPROVED CONDUCTIVE PATTERN.
DE102012023932A1 (en) * 2012-12-06 2014-06-12 GM Global Technology Operations LLC (n. d. Gesetzen des Staates Delaware) Method for manufacturing starlight and night sky ambience integrated headliner for passenger motor car, involves making source to be in contact with contacts with plus and minus regions, and manufacturing regions as vaporized film
DE102015111573A1 (en) 2015-07-16 2017-01-19 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
EP3242536A1 (en) 2016-05-03 2017-11-08 Schott VTF (Societe Par Actions Simplifiee) Panel comprising an electronic component
DE102016221923A1 (en) * 2016-11-09 2018-05-09 Bayerische Motoren Werke Aktiengesellschaft Lighting device for a motor vehicle
DE102018107309B4 (en) * 2018-03-27 2019-10-10 Symonics GmbH Transparent display device

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4152712A (en) * 1977-09-19 1979-05-01 Texas Instruments Incorporated Optoelectronic displays using uniformly spaced arrays of semisphere light emitting diodes and method of fabricating same
JPS61290780A (en) * 1985-06-19 1986-12-20 Hitachi Vlsi Eng Corp Photoelectric conversion device
JP2554358B2 (en) * 1988-05-25 1996-11-13 沖電気工業株式会社 Wiring board and method for manufacturing wiring board
JPH02181304A (en) * 1988-09-22 1990-07-16 Nippon Soken Inc Zinc oxide transparent conductive film and manufacture thereof
DE68921737T2 (en) * 1989-03-07 1995-11-09 Asahi Glass Co Ltd Laminated glass construction.
US4952783A (en) * 1989-03-20 1990-08-28 W. H. Brady Co. Light transmitting flexible film electrical heater panels
GB8909011D0 (en) * 1989-04-20 1989-06-07 Friend Richard H Electroluminescent devices
JPH0321983A (en) * 1989-06-19 1991-01-30 Kyoto Semiconductor Kk Light emitting diode display device
JP3068176B2 (en) * 1990-11-29 2000-07-24 スタンレー電気株式会社 Method of manufacturing LED display device
JPH05181149A (en) * 1991-12-27 1993-07-23 Rohm Co Ltd Electrode structure of liquid crystal display element
JPH06250591A (en) * 1993-02-24 1994-09-09 Matsushita Electric Ind Co Ltd Led display device
FR2704545B1 (en) * 1993-04-29 1995-06-09 Saint Gobain Vitrage Int Glazing provided with a functional conductive and / or low-emissive layer.
JP2918423B2 (en) * 1993-06-25 1999-07-12 京セラ株式会社 Imaging device
US5469020A (en) * 1994-03-14 1995-11-21 Massachusetts Institute Of Technology Flexible large screen display having multiple light emitting elements sandwiched between crossed electrodes
JPH07253594A (en) * 1994-03-15 1995-10-03 Fujitsu Ltd Display device
JPH0876697A (en) * 1994-09-02 1996-03-22 Sharp Corp Light emitting display device
JPH08271874A (en) * 1995-03-31 1996-10-18 Sony Corp Liquid crystal display device and its production
DE19627069A1 (en) * 1996-07-05 1998-01-08 Bayer Ag Electroluminescent devices using lamellar electrodes
CA2239626C (en) * 1996-10-09 2003-09-02 Josuke Nakata Semiconductor device
US5943802A (en) * 1997-04-07 1999-08-31 Mark Iv Industries Limited Reflective display with front lighting
JPH1120233A (en) * 1997-06-30 1999-01-26 Kyocera Corp Optical printer head
ATE239190T1 (en) * 1997-09-09 2003-05-15 Hahn Glasbau LIGHTING DEVICE WITH GLASS PLATE HAVING LEDS AND COMBINATION OF A DISPLAY CASE WITH SUCH A LIGHTING DEVICE
DE19854899C1 (en) * 1998-11-27 1999-12-30 Siemens Ag Lighting unit for automobile

Also Published As

Publication number Publication date
EP1947694A1 (en) 2008-07-23
DE10019888A1 (en) 2001-10-31
ES2320096T3 (en) 2009-05-19
EP2009965A1 (en) 2008-12-31
WO2001082378A1 (en) 2001-11-01
EP1275153B1 (en) 2009-01-14
ES2282758T3 (en) 2007-10-16
DE20122323U1 (en) 2005-04-14
ATE360891T1 (en) 2007-05-15
DE10019888B4 (en) 2011-06-16
EP1275153A1 (en) 2003-01-15
ES2320096T5 (en) 2012-04-24
EP1450416B1 (en) 2007-04-25
TWI284397B (en) 2007-07-21
ATE421168T1 (en) 2009-01-15
DE50114659D1 (en) 2009-03-05
EP1450416A1 (en) 2004-08-25
DE20122195U1 (en) 2004-09-23
EP1275153B2 (en) 2012-02-08
DE50112414D1 (en) 2007-06-06
AU2001252218A1 (en) 2001-11-07

Similar Documents

Publication Publication Date Title
MY143357A (en) A carrier substrate for electronic components
TW200705247A (en) Transparent planar body and transparent touch switch
TW430959B (en) Thermal enhanced structure of printed circuit board
MXPA04005088A (en) Transparent substrate comprising an electrode.
EP1445095A4 (en) Composite thin film holding substrate, transparent conductive film holding substrate, and panel light emitting body
AU2002233459A1 (en) Transparent substrate equipped with an electrode
WO2003019693A3 (en) Solutions of organic semiconductors
UA83797C2 (en) security document and security element for it
EP1435762A4 (en) Organic electroluminescence element-use transparent substrate and organic electroluminescence element
GB9712483D0 (en) Fabrication of light emitting devices from chelates of transition metals, lanthanides and actinides
TW200729543A (en) Light emitting device and method of forming the same
WO2002047310A3 (en) Display tile structure using organic light emitting materials
AUPQ653700A0 (en) Surface treated electrically conductive metal element and method of forming same
WO2004069736A3 (en) Articles with protruding conductive coatings
TW200717843A (en) Light-emitting element with high-light-extracting-efficiency
TW200610458A (en) Circuit board and method for the production of such a circuit board
TW200717880A (en) Opto-electronic semiconductor component with current expansion layer
EP1435761A4 (en) Organic electroluminescence element-use transparent substrate and element
TW200717012A (en) Visible light reflector having high reflectance, LCD backlight unit using the same, and method of producing visible light reflector having high reflectance
WO2000070690A3 (en) Organic light emitting devices
TW200612453A (en) Fuse for a chip
DE60211949D1 (en) DEPOSITION OF COPPER WITH COPPER FORMAT COMPLEXES
WO2001064131A3 (en) Luminescent medical bandage
TW200708214A (en) Key pad assembly and fabricating method thereof
TW200624263A (en) Substrates with multiple images