AU2001252218A1 - Carrier substrate for electronic components - Google Patents
Carrier substrate for electronic componentsInfo
- Publication number
- AU2001252218A1 AU2001252218A1 AU2001252218A AU5221801A AU2001252218A1 AU 2001252218 A1 AU2001252218 A1 AU 2001252218A1 AU 2001252218 A AU2001252218 A AU 2001252218A AU 5221801 A AU5221801 A AU 5221801A AU 2001252218 A1 AU2001252218 A1 AU 2001252218A1
- Authority
- AU
- Australia
- Prior art keywords
- zno
- conducting layer
- carrier substrate
- transparent
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000758 substrate Substances 0.000 title abstract 5
- 229910052782 aluminium Inorganic materials 0.000 abstract 2
- 229910052709 silver Inorganic materials 0.000 abstract 2
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 229910044991 metal oxide Inorganic materials 0.000 abstract 1
- 150000004706 metal oxides Chemical group 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 238000005240 physical vapour deposition Methods 0.000 abstract 1
- 238000003980 solgel method Methods 0.000 abstract 1
- 238000005118 spray pyrolysis Methods 0.000 abstract 1
- 238000004544 sputter deposition Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/42—Transparent materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
- Ceramic Products (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Polyesters Or Polycarbonates (AREA)
- Surface Treatment Of Glass (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Carrier substrate comprises a conducting layer transparent or quasi-transparent in the visible wavelength region applied to a transparent substrate (1). An independent claim is also included for a process for the production of an electronic component with the carrier substrate. Preferred Features: The conducting layer is a metal oxide selected from InO x: Sn, SnO x: F, SnO x: Sb, ZnO x: Ga, ZnO x: B, ZnO x: F, ZnO x: Al or Ag/TiO x. The conducting layer is applied by CVD, PVD, spray pyrolysis, sputtering or by using a sol-gel process. The conducting layer may be made from a metal, preferably Al, Ag, Au, Ni or Cr. The substrate is made from glass or plastic.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10019888 | 2000-04-20 | ||
DE10019888A DE10019888B4 (en) | 2000-04-20 | 2000-04-20 | Transparent electronic component arrangement and method for its production |
PCT/EP2001/003080 WO2001082378A1 (en) | 2000-04-20 | 2001-03-17 | Carrier substrate for electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001252218A1 true AU2001252218A1 (en) | 2001-11-07 |
Family
ID=7639642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001252218A Abandoned AU2001252218A1 (en) | 2000-04-20 | 2001-03-17 | Carrier substrate for electronic components |
Country Status (8)
Country | Link |
---|---|
EP (4) | EP2009965A1 (en) |
AT (2) | ATE421168T1 (en) |
AU (1) | AU2001252218A1 (en) |
DE (5) | DE10019888B4 (en) |
ES (2) | ES2320096T5 (en) |
MY (1) | MY143357A (en) |
TW (1) | TWI284397B (en) |
WO (1) | WO2001082378A1 (en) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0216787D0 (en) | 2002-07-19 | 2002-08-28 | Pilkington Plc | Laminated glazing panel |
DE10249005A1 (en) * | 2002-10-21 | 2004-05-06 | Siemens Ag | Method for producing a circuit arrangement |
BE1015302A3 (en) | 2003-01-10 | 2005-01-11 | Glaverbel | Glass with electronic components. |
GB2406161B (en) * | 2003-08-20 | 2006-02-22 | Daimler Chrysler Ag | Vehicle-mounted infrared radiation source for an infrared night vision system |
DE10343529A1 (en) | 2003-09-19 | 2005-04-21 | Pepperl & Fuchs | Device for the optical transmission of information |
DE102004039883B3 (en) * | 2004-08-17 | 2006-06-14 | Schott Ag | Transparent element comprises primary and secondary transparent plates, and an intermediate electrical consumer |
DE102004039897A1 (en) * | 2004-08-17 | 2006-03-02 | Schott Ag | Element with a variety of light emitting diodes |
DE102005019375A1 (en) * | 2005-02-28 | 2006-09-07 | Osram Opto Semiconductors Gmbh | LED array |
EP1715521B1 (en) * | 2005-04-21 | 2012-02-22 | C.R.F. Società Consortile per Azioni | Use of a transparent display having light-emitting diodes (LED) in a motor vehicle |
ATE416480T1 (en) * | 2005-06-16 | 2008-12-15 | Asulab Sa | PRODUCTION METHOD FOR A TRANSPARENT ELEMENT WITH TRANSPARENT ELECTRODES AND CORRESPONDING ELEMENT |
FR2892594B1 (en) | 2005-10-21 | 2007-12-07 | Saint Gobain | LIGHT STRUCTURE COMPRISING AT LEAST ONE ELECTROLUMINESCENT DIODE, ITS MANUFACTURE AND ITS APPLICATIONS |
EP1954489A1 (en) * | 2005-11-21 | 2008-08-13 | AGC Flat Glass Europe SA | Laminated assembly provided with light-emitting diodes |
DE202005020315U1 (en) | 2005-12-15 | 2006-02-16 | Döppner Bauelemente GmbH & Co. KG | Electrical socket connection |
EP1956580A1 (en) * | 2006-12-18 | 2008-08-13 | AGC Flat Glass Europe SA | Display panel |
EP1935633A1 (en) * | 2006-12-21 | 2008-06-25 | AGC Flat Glass Europe SA | Translucent Panel for connecting components |
EP1947693B1 (en) * | 2007-01-18 | 2015-03-25 | Polytron Technologies, Inc. | Plane structure of light-emitting diode lighting apparatus |
TW200849160A (en) * | 2007-04-03 | 2008-12-16 | Koninkl Philips Electronics Nv | Light output device |
CN101687393B (en) | 2007-06-04 | 2013-07-17 | 皇家飞利浦电子股份有限公司 | Light output device |
DE102007031642A1 (en) | 2007-07-06 | 2009-01-08 | Döppner Bauelemente GmbH & Co. KG | Large-area display device i.e. transparent multimedia facade, for building, has transparent elements with substrate on which lighting elements i.e. LEDs, are arranged, where power supply of LEDs takes place over conducting paths |
EP2179632B1 (en) * | 2007-07-03 | 2010-11-17 | Schott AG | Substrate comprising a highly conductive layer |
DE102008009775A1 (en) | 2007-07-03 | 2009-01-08 | Döppner Bauelemente GmbH & Co. KG | Large-area display device i.e. transparent multimedia facade, for building, has transparent elements with substrate on which lighting elements i.e. LEDs, are arranged, where power supply of LEDs takes place over conducting paths |
CN101772798B (en) * | 2007-08-02 | 2012-10-31 | 皇家飞利浦电子股份有限公司 | Light output device |
DE102007039416B4 (en) | 2007-08-21 | 2018-03-29 | Diehl Aircabin Gmbh | Composite component with LEDs |
DE102008009774A1 (en) | 2008-02-19 | 2009-08-27 | Schott Ag | Element i.e. disk, for use in e.g. clinic, has film operated in two states, and laminated glass elements including surface, where glass elements provide protection against ionizing radiation and ultra-violet radiation |
DE102009008658A1 (en) | 2008-02-19 | 2009-09-10 | Glaswerke Arnold Gmbh & Co. Kg | Element i.e. disk, for use in e.g. clinic, has film operated in two states, and laminated glass elements including surface, where glass elements provide protection against ionizing radiation and ultra-violet radiation |
DE202008008695U1 (en) | 2008-06-28 | 2009-11-19 | Schott Ag | Modular lighting system |
DE102009017659A1 (en) | 2009-04-16 | 2010-10-28 | Schott Ag | Method for the conductive connection of a component on a transparent substrate |
DE202009010065U1 (en) | 2009-07-24 | 2010-12-23 | Schott Ag | Stele with a glass element |
BE1019185A3 (en) * | 2010-02-16 | 2012-04-03 | Agc Glass Europe | PANEL WITH IMPROVED CONDUCTIVE PATTERN. |
DE102012023932A1 (en) * | 2012-12-06 | 2014-06-12 | GM Global Technology Operations LLC (n. d. Gesetzen des Staates Delaware) | Method for manufacturing starlight and night sky ambience integrated headliner for passenger motor car, involves making source to be in contact with contacts with plus and minus regions, and manufacturing regions as vaporized film |
DE102015111573A1 (en) * | 2015-07-16 | 2017-01-19 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component |
EP3242536A1 (en) | 2016-05-03 | 2017-11-08 | Schott VTF (Societe Par Actions Simplifiee) | Panel comprising an electronic component |
DE102016221923A1 (en) * | 2016-11-09 | 2018-05-09 | Bayerische Motoren Werke Aktiengesellschaft | Lighting device for a motor vehicle |
DE102018107309B4 (en) | 2018-03-27 | 2019-10-10 | Symonics GmbH | Transparent display device |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4152712A (en) * | 1977-09-19 | 1979-05-01 | Texas Instruments Incorporated | Optoelectronic displays using uniformly spaced arrays of semisphere light emitting diodes and method of fabricating same |
JPS61290780A (en) * | 1985-06-19 | 1986-12-20 | Hitachi Vlsi Eng Corp | Photoelectric conversion device |
JP2554358B2 (en) * | 1988-05-25 | 1996-11-13 | 沖電気工業株式会社 | Wiring board and method for manufacturing wiring board |
JPH02181304A (en) * | 1988-09-22 | 1990-07-16 | Nippon Soken Inc | Zinc oxide transparent conductive film and manufacture thereof |
EP0386341B1 (en) * | 1989-03-07 | 1995-03-15 | Asahi Glass Company Ltd. | Laminated glass structure |
US4952783A (en) * | 1989-03-20 | 1990-08-28 | W. H. Brady Co. | Light transmitting flexible film electrical heater panels |
GB8909011D0 (en) * | 1989-04-20 | 1989-06-07 | Friend Richard H | Electroluminescent devices |
JPH0321983A (en) * | 1989-06-19 | 1991-01-30 | Kyoto Semiconductor Kk | Light emitting diode display device |
JP3068176B2 (en) * | 1990-11-29 | 2000-07-24 | スタンレー電気株式会社 | Method of manufacturing LED display device |
JPH05181149A (en) * | 1991-12-27 | 1993-07-23 | Rohm Co Ltd | Electrode structure of liquid crystal display element |
JPH06250591A (en) * | 1993-02-24 | 1994-09-09 | Matsushita Electric Ind Co Ltd | Led display device |
FR2704545B1 (en) * | 1993-04-29 | 1995-06-09 | Saint Gobain Vitrage Int | Glazing provided with a functional conductive and / or low-emissive layer. |
JP2918423B2 (en) * | 1993-06-25 | 1999-07-12 | 京セラ株式会社 | Imaging device |
US5469020A (en) * | 1994-03-14 | 1995-11-21 | Massachusetts Institute Of Technology | Flexible large screen display having multiple light emitting elements sandwiched between crossed electrodes |
JPH07253594A (en) * | 1994-03-15 | 1995-10-03 | Fujitsu Ltd | Display device |
JPH0876697A (en) * | 1994-09-02 | 1996-03-22 | Sharp Corp | Light emitting display device |
JPH08271874A (en) * | 1995-03-31 | 1996-10-18 | Sony Corp | Liquid crystal display device and its production |
DE19627069A1 (en) * | 1996-07-05 | 1998-01-08 | Bayer Ag | Electroluminescent devices using lamellar electrodes |
CA2239626C (en) * | 1996-10-09 | 2003-09-02 | Josuke Nakata | Semiconductor device |
US5943802A (en) * | 1997-04-07 | 1999-08-31 | Mark Iv Industries Limited | Reflective display with front lighting |
JPH1120233A (en) * | 1997-06-30 | 1999-01-26 | Kyocera Corp | Optical printer head |
ATE239190T1 (en) * | 1997-09-09 | 2003-05-15 | Hahn Glasbau | LIGHTING DEVICE WITH GLASS PLATE HAVING LEDS AND COMBINATION OF A DISPLAY CASE WITH SUCH A LIGHTING DEVICE |
DE19854899C1 (en) * | 1998-11-27 | 1999-12-30 | Siemens Ag | Lighting unit for automobile |
-
2000
- 2000-04-20 DE DE10019888A patent/DE10019888B4/en not_active Expired - Fee Related
-
2001
- 2001-03-17 EP EP08016741A patent/EP2009965A1/en not_active Withdrawn
- 2001-03-17 AT AT01925483T patent/ATE421168T1/en active
- 2001-03-17 ES ES01925483T patent/ES2320096T5/en not_active Expired - Lifetime
- 2001-03-17 WO PCT/EP2001/003080 patent/WO2001082378A1/en active Application Filing
- 2001-03-17 DE DE50112414T patent/DE50112414D1/en not_active Expired - Lifetime
- 2001-03-17 EP EP08007823A patent/EP1947694A1/en not_active Withdrawn
- 2001-03-17 DE DE20122195U patent/DE20122195U1/en not_active Expired - Lifetime
- 2001-03-17 DE DE20122323U patent/DE20122323U1/en not_active Expired - Lifetime
- 2001-03-17 AT AT04012665T patent/ATE360891T1/en active
- 2001-03-17 ES ES04012665T patent/ES2282758T3/en not_active Expired - Lifetime
- 2001-03-17 EP EP01925483A patent/EP1275153B2/en not_active Expired - Lifetime
- 2001-03-17 DE DE50114659T patent/DE50114659D1/en not_active Expired - Lifetime
- 2001-03-17 EP EP04012665A patent/EP1450416B1/en not_active Revoked
- 2001-03-17 AU AU2001252218A patent/AU2001252218A1/en not_active Abandoned
- 2001-04-18 MY MYPI20011836A patent/MY143357A/en unknown
- 2001-04-19 TW TW090109376A patent/TWI284397B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE50112414D1 (en) | 2007-06-06 |
EP1450416A1 (en) | 2004-08-25 |
TWI284397B (en) | 2007-07-21 |
DE20122323U1 (en) | 2005-04-14 |
ES2320096T3 (en) | 2009-05-19 |
EP1947694A1 (en) | 2008-07-23 |
ES2282758T3 (en) | 2007-10-16 |
EP1450416B1 (en) | 2007-04-25 |
DE20122195U1 (en) | 2004-09-23 |
DE10019888B4 (en) | 2011-06-16 |
EP1275153B1 (en) | 2009-01-14 |
WO2001082378A1 (en) | 2001-11-01 |
ATE421168T1 (en) | 2009-01-15 |
MY143357A (en) | 2011-04-29 |
EP2009965A1 (en) | 2008-12-31 |
ATE360891T1 (en) | 2007-05-15 |
DE10019888A1 (en) | 2001-10-31 |
ES2320096T5 (en) | 2012-04-24 |
EP1275153B2 (en) | 2012-02-08 |
EP1275153A1 (en) | 2003-01-15 |
DE50114659D1 (en) | 2009-03-05 |
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