1222839 玖、發明說明 (發明說明應敘明：發明所屬之技術領域、先前技術、內容、實施方式及圖式簡單說明) ㈠發明所屬之技術領域 本發明係關於有機發光二極體（OLED )裝置，更特別地 ，本發明係有關於有機發光二極體（OLED )之封裝方法。 ㈡先前技術 第1圖係顯示傳統之有機發光二極體（OLED)裝置100。 有機發光二極體（OLED )裝置可用來作爲各種消費性電子 產品中之顯示器，其中包括行動電話、行動智慧電話、個 人分類夾、電子呼叫器、廣告面板、觸控螢幕顯示器、電 傳視訊會議裝備及多媒體裝備、虛擬實境產品、及顯示器 廣告亭。 該傳統有機發光二極體（OLED)裝置包含一層以上位於透 明導電層1 05與導電層1 1 5間之有機功能層1 1 0的功能堆 疊。該功能堆疊形成於透明基板1 0 1上。該導電層可形成 圖案（patterned)以於該基板上形成一個以上之單元或像素 。搭接襯墊1 5 0與陽極和陰極接通來控制該有機發光二極 體（OLED)像素。於實際操作中，將電荷載體注射穿過各陽 極與陰極而在功能層中重新結合，該等帶電體之重新結合 引起該功能層發射可見光線。 將形成凹槽145於其與像素間之帽罩160安裝於基板上 。將密封劑1 87塗覆圍繞於帽罩之邊緣，其於該處與基板 接觸。然而，由於在帽罩與基板之間存在間隙G，故密封 寬度W需要足夠寬以避免氧氣與濕氣滲透穿過密封劑。通 常，該密封寬度約爲0 . 2-2mm而具有約0 . 01-0 . 5mm之間隙 。如此大之密封寬度導致晶片區域之使用效率不彰，限制 有機發光二極體（OLED )裝置之小型化。 一 6 - 1222839 如由以上所述所得知，希望提供具有改良後之密封且已 減小晶片尺寸之有機發光二極體（OLED )裝置，特別是提 供形成於薄的或可撓性基板上以避免作用裝置層損傷之該 等裝置。 ㈢發明內容 本發明係一般地關於有機發光二極體（OLED )裝置，特 別地，本發明係關於有機發光二極體（OLED )之封裝。具 體來說，提供一種圍繞基板之單元區域之密封閘。該密封 閘係於基板上支撐著帽罩並提供位於密封閘外側表面上的 密封區域。具體來說，該密封區域係位於帽罩邊緣與閘之 間，其中使用黏著劑來密封有機發光二極體（OLED )裝置 。該密封閘之使用決定位於帽罩與基板間之間隙（藉此於 該二極體與帽罩之間提供凹槽空間以用於機械保護）與密 封寬度。 此外，提供間隔粒子於裝置區域以避免帽罩接觸有機發 光二極體（OLED )單元。具體來說，以噴霧技術來隨機沈 積該間隔粒子於基板上。例如以乾式噴霧技術來沈積間隔 粒子。另外，利用一種濕式噴霧技術來沈積間隔粒子於基 板上，除去非裝置區域之間隔粒子，留下隨機散佈於裝置 區域中之間隔粒子。安裝帽罩於基板上來封裝該裝置，裝 置區域中之間隔粒子則避免帽罩接觸有機發光二極體（OLED )單元。 ㈣實施方式 第2圖係顯示根據本發明之一實例之有機發光二極體 (OLED)裝置200。該有機發光二極體（OLED)裝置包含有基 板201(其上形成有各像素）。具體來說，該基板包含一片 - 7 - 1222839 玻璃之透明基板。可使用作爲基板來支撐該有機發光二極 體（OLED)作用組成物之其他種類的透明材料。有機發光二 極體（OLED)像素包含一層以上在陽極105與陰極115之間 的有機層11〇。具體來說，形成陽極與陰極個別爲第一與 第二方向之條狀，通常，第一與第二方向互相垂直。有機 發光二極體（OLED )像素係形成於基板之單元區域。搭接襯 墊150係電氣地連接至陽極與陰極。一帽罩260係提供來 封裝該有機發光二極體（OLED)像素。該帽罩係提供凹槽145 而將帽罩與有機發光二極體（OLED)單元分離開來。於本發 明之一實例中，提供間隔粒子680於有機發光二極體（OLED) 單元與帽罩之間。該間隔粒子係避免帽罩接觸有機發光二 極體（OLED)單元。 根據本發明，提供密封閘280於有機發光二極體（OLED) 裝置之單元區域周圍來支撐帽罩。該密封閘之高度會界定 凹槽1 45。具體來說，該密封閘包含一層非導電性材料以 免造成該等電極短路。亦可使用其中至少接觸基板之層包 含非導電性材料之複層密封閘。該密封閘形成密封空間或 區域28 5，其係依附該密封閘之外側表面281。具體來說， 該密封閘位於距帽罩邊緣一段距離，並於帽罩之邊緣與該 閘之間留下密封空間28 5。密封劑287會充塡該密封空間 ’並密封該裝置。密封閘之使用有利地消除存在於傳統封 裝中之間隙（第1圖中之間隙G )，其使具有例如< 1 mm之 較窄密封寬度之裝置形成。具體來說，該密封寬度是從約 0 . 2至少於1 m ιώ。 此外，沈積間隔粒子680於裝置區域上以免帽罩接觸有 機發光二極體（OLED)單元。具體來說，該間隔粒子包含圓 一 8 一 1222839 形。亦可使用具有例如正方體、角柱體、角錐體、或其他 規則或非規則形狀之其他幾何形狀的間隔粒子。該間隔粒 子之平均中間直徑應足以維持凹槽之所希望之高度，其例 如爲約2 - 5 0 # m。該間隔粒子之尺寸及形狀分布亦應夠窄以 確保帽罩與有機發光二極體（OLED)單元間適當之分離。 第3〜8圖顯示根據本發明之一實例用來製作有機發光二 ^ 極體（OLED)之製程。參照第3圖，提供一種用作封裝帽罩 · 之基板3 60。該基板可包含例如金屬或聚合物之不同種類 的材料。該基板之厚度可例如爲〇 . 4 - 2mm。亦可提供使用 薄的基板（0 . 0 1 - 0 . 2mm )，特別是用於製作具撓折性裝置 〇 用來形成密封閘之裝置層3 80係沈積在帽罩之主要表面 上。具體來說，裝置層包含非導電性光感材料，例如光阻 劑。由於細微之幾何形狀，所以該閘之材料必須是直接地 或間接地可形成圖案的。亦可使用例如光可形成圖案之聚 亞醯胺、光可形成圖案之聚苯并噁唑、光可形成圖案之聚 戊二醯亞胺與其他樹脂之其他電絕緣性之光感材料。閘之 高度（例如1 // in )係大於裝置層之高度（約0 · 5 // m )。 鲁 參照第4圖，使裝置層形成圖案以形成一密封閘280。 該形成圖案製程包括例如選擇性地使阻劑層曝光並接著以 顯影製程來除去所選擇之部分（即除去曝光或未曝光部分 係端賴於正型或負型阻劑層之使用）。具體來說，距基板 3 60之邊緣一段距離形成密封閘並留下密封區域28 5。通常 該密封區域約爲0 . 2-2mm寬。該閘與基板形成帽罩260來 封裝有機發光二極體（OLED)裝置。 另外，可使用例如抽絲玻璃、聚亞醯胺、聚苯并噁唑、 一 9一 1222839 聚戊二醯亞胺、或苯并環丁烯之非導電性的非感光材料來 作爲密封閘層。亦可使用例如包括聚乙烯、聚苯乙烯、聚 丙烯之聚合物、或例如氧化矽、氮化矽、氧化鋁之無機材 料的非感光材料。對於非感光材料，係提供例如阻劑之蝕 刻遮罩來用於使裝置層形成圖案。 在另外之實例中，係使用複數層來形成密封閘堆疊。至 少在接觸有機發光二極體（OLED)基板之最上層包含一種非 導電性材料。使用例如蝕刻遮罩來使該層形成圖案而形成 密封閘。 參照第5圖，提供基板5 01，於其上係形成一個以上有 機發光二極體（OLED )單元。該基板可包含不同種類之材料 ’例如玻璃或聚合物。亦可使用能適當地支撐有機發光二 極體（OLED)單元之其他材料。 具體來說，該基板包含一層例如塑膠薄膜之可撓性材料 來用於形成可撓性裝置。該等薄膜包括例如透明聚對苯二 甲酸乙二醇酯（PET )、聚對苯二甲酸丁二醇酯（PBT )、 聚（乙烯萘酯）（PEN)、聚碳酸酯（PC)、聚亞醯胺（PI )、聚楓（PS0 )、及聚（對苯撐醚楓）(PES )。亦可使 用其他如聚乙烯（PE )、聚丙烯（PP )、聚氯乙烯（PVC ) 、聚苯乙烯（PS )及聚（甲基丙烯酸甲酯）（PMMA )來形 成基板。亦可使用一種包含薄玻璃或其他可撓性材料之可 撓性基板。 沈積導電層5 〇 5於基板上，該基板可具有例如二氧化矽 (S i 〇2 )之阻隔層，而該阻隔層係在沈積該導電層之前， 在基板表面上鄰接於該導電層之下。阻隔層特別可用於包 食鹼石灰玻璃之基板。該基板約爲例如20nm之厚度。具體 -10 - 1222839 來說，該導電層包含一種透明導電材料，例如銦錫氧化物 (I TO )。亦可使用其他種類之透明導電層，包括氧化鋅與 碘-鋅氧化物。可使用例如化學氣相法（CVD )、物理氣相 法（PVC )、及電漿加強CVD ( PECVD )之不同技術來形成 裝置層。該導電層應儘量薄以降低光學吸收及對於接下來 之薄膜形成的負面衝擊來滿足電方面之要求。該導電層通 吊約爲0 · 0 2 - 1 // in厚。 - 使導電層505如所希望地形成圖案來選擇地除去該層之 部分，並使基板之部分556曝光。該已形成圖案之導電層 作爲用於有機發光二極體（0LED )單元之第一電極。具體來 說，使該導電層形成圖案成爲條狀以作爲例如已形成像素 之有機發光二極體（0LED)裝置的陰極。該形成圖案製程亦 可形成用於搭接腳位（pa d )之連結。可使用習知技術例如微 影成像術及蝕刻來使該導電層形成圖案。亦可用使用沖壓 之形成圖案之技術。該技術描述於標題爲”Mechanical Patterning of a Device Layer”之共同審理中之國際專利 應用PCT/SG99 / 00074，其係結合用於全部目的之參考於其 中。 φ 於基板上形成一層以上之有機功能層5 1 0，並覆蓋已曝 光之基板部分與導電層。該功能有機層包含例如共轭聚合 物或例如A 1 q3之低分子材料。亦可使用其他種類之有機功 能層。可藉由習知之技術來形成有機功能層，例如濕式製 程如旋轉塗佈或真空昇華（用於A 1 q3之有機層）。該有機 層之厚度通常約爲2 - 200nm。 參照第6圖，可選擇性地除去有機層之部份來使在區域 670中之底層曝光來用於黏結層連接。使用例如硏磨製程 - 11 - 1222839 可達成有機層之選擇性去除。亦可使用其他技術如蝕刻、 刮刻、或雷射削除。 具體來說，間隔粒子隨機地散佈於基板上，而以間隔粒 子隨機散佈於形成有機發光二極體（OLED)單元之單元區域 中爲佳。該間隔粒子會佔據裝置之作用與非作用部分（例 如’發射與非發射區）。該間隔粒子之分布與密度應足夠 來避免帽罩在有機械應力存在下接觸有機發光二極體（OLED) 單元’不論是因設計（可撓性裝置）或意外（裝置之處置 )。可改變該分布來適應設計需求，例如所需之帽罩之厚 度、基板之厚度、裝置可撓度量。 在較佳之實例中，間隔粒子分布足以在無明顯影響有機 發光二極體（OLED)單元之發射均勻度下維持凹槽之高度。 通常，具有約爲1 0 - 500 # m之間隔粒子間之平均距離之間 隔粒子分布適合於避免帽罩接觸有機發光二極體（OLED)單 兀。具體來說，間隔粒子分布之密度約爲1 〇 - 1 〇 〇 〇 N 〇 / m m2 。該等伴隨小尺寸間隔粒子之分布確保其對於發射均勻度 之影響基本上爲肉眼不可見。 爲了避免引起陰極和陽極間之短路，該間隔粒子以包含 非導電材料爲佳。具體來說，該間隔粒子係由玻璃所製造 。間隔粒子亦可由其他種類之非導電材料製造，例如矽石 、聚合物、或陶瓷。 具體來說，以噴霧技術來沈積間隔粒子。在較佳之實例 中，使用乾式噴霧技術來沈積間隔粒子。乾式噴霧技術係 描述於例如 Birenda Bahadur (Ed) ，Liquid Crystals: Applications and Uses, Vol. 1 ( ISEN 98 1 020 1 1 09 )， 其係結合用於全部目的之參考於其中。閘所在之區域係使 -12 - 1222839 用雷射淸除方法來淸除間隔粒子，或使用任何其他適當方 法來除去該粒子，如刮刻或以光阻劑來形成圖案。 乾式噴霧技術通常包以第一極（正極或負極）使其靜電 帶電之間隔粒子與以第二極（負極或正極）使其靜電帶電 之基板。以乾燥空氣噴霧器所提供之乾燥空氣將該間隔粒 子吹送至基板上。可使用如由尼辛工程公司製之DI SPA- // R 乾燥空氣噴霧器。靜電吸引導致間隔粒子附著於基板上， 而粒子間靜電排斥則避免粒子在基板上凝聚成塊。1222839 发明 Description of the invention (The description of the invention should state: the technical field to which the invention belongs, the prior art, the content, the embodiments, and the drawings are briefly explained) More particularly, the present invention relates to a packaging method for an organic light emitting diode (OLED). ㈡ Prior Art FIG. 1 shows a conventional organic light emitting diode (OLED) device 100. Organic light emitting diode (OLED) devices can be used as displays in various consumer electronics products, including mobile phones, mobile smart phones, personal folders, electronic pagers, advertising panels, touch screen displays, telex video conferences Equipment and multimedia equipment, virtual reality products, and display advertising kiosks. The conventional organic light emitting diode (OLED) device includes a functional stack of more than one organic functional layer 110 between the transparent conductive layer 105 and the conductive layer 115. The functional stack is formed on the transparent substrate 101. The conductive layer may be patterned to form more than one unit or pixel on the substrate. The lap pad 150 is connected to the anode and the cathode to control the organic light emitting diode (OLED) pixel. In actual operation, a charge carrier is injected through each anode and cathode to recombine in the functional layer. The recombination of these charged bodies causes the functional layer to emit visible light. A cap 160 forming a groove 145 between the pixel and the pixel is mounted on the substrate. A sealant 1 87 is applied around the edge of the cap, where it contacts the substrate. However, since there is a gap G between the cap and the substrate, the sealing width W needs to be wide enough to prevent oxygen and moisture from penetrating through the sealant. Usually, the seal width is about 0.2-2 mm with a gap of about 0.01-0.5 mm. Such a large sealing width results in inefficient use of the chip area, which limits the miniaturization of organic light emitting diode (OLED) devices. 6-1222839 As is known from the above, it is desirable to provide an organic light emitting diode (OLED) device having an improved seal and a reduced wafer size, and particularly to a thin or flexible substrate formed to Avoid damage to the devices of the active device layer. ㈢ SUMMARY OF THE INVENTION The present invention relates generally to organic light emitting diode (OLED) devices. In particular, the present invention relates to the packaging of organic light emitting diodes (OLEDs). In particular, a hermetic gate is provided that surrounds a cell area of a substrate. The sealing gate supports a cap on a base plate and provides a sealing area on an outer surface of the sealing gate. Specifically, the sealing area is located between the edge of the cap and the gate, and an adhesive is used to seal the organic light emitting diode (OLED) device. The use of the sealing gate determines the gap between the cap and the substrate (thereby providing a groove space between the diode and the cap for mechanical protection) and the width of the seal. In addition, spacer particles are provided in the device area to prevent the cap from contacting the organic light emitting diode (OLED) unit. Specifically, the spacer particles are randomly deposited on the substrate by a spray technique. Spacer particles are deposited, for example, by dry spray technology. In addition, a wet spray technique is used to deposit spacer particles on the substrate to remove spacer particles from non-device areas, leaving spacer particles randomly scattered in the device area. The cap is mounted on the substrate to package the device, and the spacer particles in the device area prevent the cap from contacting the organic light emitting diode (OLED) unit. ㈣Embodiment Figure 2 shows an organic light emitting diode (OLED) device 200 according to an example of the present invention. The organic light emitting diode (OLED) device includes a substrate 201 (on which pixels are formed). Specifically, the substrate includes a transparent substrate of 7-1222839 glass. Other types of transparent materials can be used as a substrate to support the organic light emitting diode (OLED) -acting composition. An organic light emitting diode (OLED) pixel includes one or more organic layers 110 between the anode 105 and the cathode 115. Specifically, the anode and the cathode are formed into strips in the first and second directions, respectively. Generally, the first and second directions are perpendicular to each other. Organic light emitting diode (OLED) pixels are formed in a unit region of the substrate. The lap pad 150 is electrically connected to the anode and the cathode. A cap 260 is provided to encapsulate the organic light emitting diode (OLED) pixels. The cap is provided with a groove 145 to separate the cap from an organic light emitting diode (OLED) unit. In one example of the present invention, spacer particles 680 are provided between an organic light emitting diode (OLED) unit and a cap. The spacer particles prevent the cap from contacting the organic light emitting diode (OLED) unit. According to the present invention, a sealed gate 280 is provided around a unit area of an organic light emitting diode (OLED) device to support a cap. The height of the seal will define the groove 145. Specifically, the seal includes a layer of non-conductive material to avoid shorting the electrodes. It is also possible to use a multi-layer sealed gate in which at least the layer contacting the substrate contains a non-conductive material. The sealing gate forms a sealed space or area 28 5 which is attached to the outer surface 281 of the sealing gate. Specifically, the sealing gate is located at a distance from the edge of the cap and leaves a sealing space 28 5 between the edge of the cap and the gate. The sealant 287 fills the sealed space and seals the device. The use of a seal gate advantageously eliminates the gaps (gap G in Fig. 1) that exist in conventional packages, which enables the formation of devices with a narrower seal width of < 1 mm, for example. Specifically, the seal width is from about 0.2 to less than 1 m. In addition, spacer particles 680 are deposited on the device area to prevent the cap from contacting the organic light emitting diode (OLED) unit. Specifically, the spacer particles include a circle-8-1222839 shape. Spacer particles having other geometric shapes such as cubes, corner cylinders, pyramids, or other regular or irregular shapes can also be used. The average median diameter of the spacer particles should be sufficient to maintain the desired height of the groove, for example, about 2-50 # m. The size and shape distribution of the spacer particles should also be narrow enough to ensure proper separation between the cap and the organic light emitting diode (OLED) unit. Figures 3 to 8 show a process for fabricating an organic light emitting diode (OLED) according to an example of the present invention. Referring to FIG. 3, a substrate 3 60 for use as a package cap is provided. The substrate may include different kinds of materials such as metals or polymers. The thickness of the substrate may be, for example, 0.4 to 2 mm. We can also provide the use of thin substrates (0.01-0.2mm), especially for the production of flexible devices 〇 The device layer 3 80 used to form the seal gate is deposited on the main surface of the cap. Specifically, the device layer contains a non-conductive photo-sensitive material, such as a photoresist. Due to the subtle geometry, the material of the gate must be patternable directly or indirectly. It is also possible to use other electrically insulating light-sensitive materials such as photo-patternable polyimide, photo-patternable polybenzoxazole, photo-patternable polypentadiimide and other resins. The height of the gate (for example, 1 // in) is greater than the height of the device layer (about 0 · 5 // m). Referring to FIG. 4, the device layer is patterned to form a sealing gate 280. The patterning process includes, for example, selectively exposing the resist layer and then developing the process to remove selected portions (i.e., removing exposed or unexposed portions depends on the use of a positive or negative resist layer). Specifically, a sealing gate is formed at a distance from the edge of the substrate 3 60 and a sealing area 28 5 is left. Usually the sealing area is about 0.2-2 mm wide. The gate and the substrate form a cap 260 to package an organic light emitting diode (OLED) device. In addition, non-conductive, non-photosensitive materials such as drawn glass, polyimide, polybenzoxazole, 9-1222839 polypentadiimide, or benzocyclobutene can be used as the sealing gate layer. . Non-photosensitive materials such as polymers including polyethylene, polystyrene, polypropylene, or inorganic materials such as silicon oxide, silicon nitride, and aluminum oxide can also be used. For non-photosensitive materials, an etch mask such as a resist is provided for patterning the device layer. In another example, multiple layers are used to form a sealed gate stack. At least the uppermost layer in contact with the organic light emitting diode (OLED) substrate contains a non-conductive material. This layer is patterned using, for example, an etch mask to form a hermetic gate. Referring to FIG. 5, a substrate 501 is provided, and one or more organic light emitting diode (OLED) units are formed thereon. The substrate may include different kinds of materials, such as glass or polymers. Other materials that can properly support an organic light emitting diode (OLED) unit can also be used. Specifically, the substrate includes a layer of flexible material, such as a plastic film, for forming a flexible device. Such films include, for example, transparent polyethylene terephthalate (PET), polybutylene terephthalate (PBT), poly (vinylnaphthalate) (PEN), polycarbonate (PC), poly Imidine (PI), polymaple (PS0), and poly (p-phenylene ether maple) (PES). Other substrates such as polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), polystyrene (PS), and poly (methyl methacrylate) (PMMA) can also be used to form the substrate. A flexible substrate including thin glass or other flexible materials may also be used. A conductive layer 505 is deposited on the substrate. The substrate may have a barrier layer such as silicon dioxide (Si02), and the barrier layer is adjacent to the conductive layer on the substrate surface before the conductive layer is deposited. under. Barrier layers are particularly useful for substrates containing soda-lime glass. The substrate has a thickness of, for example, about 20 nm. Specifically, -10-1222839, the conductive layer includes a transparent conductive material, such as indium tin oxide (I TO). Other types of transparent conductive layers can also be used, including zinc oxide and iodine-zinc oxide. The device layers may be formed using different techniques such as chemical vapor phase (CVD), physical vapor phase (PVC), and plasma enhanced CVD (PECVD). The conductive layer should be as thin as possible to reduce optical absorption and negative impact on subsequent film formation to meet electrical requirements. The conductive layer is approximately 0 · 0 2-1 // in thick. -The conductive layer 505 is patterned as desired to selectively remove portions of the layer and expose portions 556 of the substrate. The patterned conductive layer serves as a first electrode for an organic light emitting diode (0LED) unit. Specifically, the conductive layer is patterned into a strip shape to serve as a cathode of an organic light emitting diode (OLED) device in which a pixel has been formed, for example. The patterning process can also form a connection for overlapping the feet (pa d). The conductive layer can be patterned using conventional techniques such as lithography and etching. Patterning techniques using stamping can also be used. This technology is described in the international patent application PCT / SG99 / 00074 under co-examination entitled "Mechanical Patterning of a Device Layer", which is incorporated herein by reference for all purposes. φ Form more than one organic functional layer 5 10 on the substrate, and cover the exposed part of the substrate and the conductive layer. The functional organic layer contains, for example, a conjugated polymer or a low molecular material such as A 1 q3. Other types of organic functional layers can also be used. Organic functional layers can be formed by conventional techniques, such as wet processes such as spin coating or vacuum sublimation (for organic layers of A 1 q3). The thickness of the organic layer is usually about 2-200 nm. Referring to FIG. 6, a portion of the organic layer may be selectively removed to expose the bottom layer in the region 670 for the bonding layer connection. Selective removal of the organic layer can be achieved using, for example, a honing process-11-1222839. Other techniques such as etching, scratching, or laser ablation can also be used. Specifically, the spacer particles are randomly dispersed on the substrate, and the spacer particles are preferably randomly dispersed in the unit region forming the organic light emitting diode (OLED) unit. The spacer particles occupy active and non-active portions of the device (e.g., the 'emission and non-emission regions]. The distribution and density of the spacer particles should be sufficient to prevent the cap from contacting the organic light emitting diode (OLED) unit in the presence of mechanical stress, whether by design (flexible device) or accidental (device disposal). This distribution can be changed to meet design requirements, such as the thickness of the required cap, the thickness of the substrate, and the flexibility of the device. In a preferred embodiment, the spacer particle distribution is sufficient to maintain the height of the groove without significantly affecting the uniformity of the emission of the organic light emitting diode (OLED) unit. In general, the distance between particles with an average distance between particles of about 10-500 # m is suitable for preventing the cap from contacting the organic light emitting diode (OLED) unit. Specifically, the density of the spaced particle distribution is about 10-1 000 N 0 / m 2. The distribution of these particles with small spacings ensures that their effect on emission uniformity is essentially invisible to the naked eye. In order to avoid causing a short circuit between the cathode and the anode, the spacer particles preferably include a non-conductive material. Specifically, the spacer particles are made of glass. Spacer particles can also be made from other types of non-conductive materials, such as silica, polymers, or ceramics. Specifically, the spacer particles are deposited using a spray technique. In the preferred embodiment, dry spray techniques are used to deposit the spacer particles. Dry spray technology is described, for example, in Birenda Bahadur (Ed), Liquid Crystals: Applications and Uses, Vol. 1 (ISEN 98 1 020 1 1 09), which is incorporated herein by reference for all purposes. The area where the gate is located is -12-1222839 to remove spacer particles by laser erasing, or use any other appropriate method to remove the particles, such as scratching or patterning with photoresist. Dry spray technology usually consists of spacer particles that are electrostatically charged with a first electrode (positive or negative electrode) and a substrate that is electrostatically charged with a second electrode (negative or positive electrode). The spacer particles were blown onto the substrate with dry air provided by a dry air sprayer. A dry air sprayer such as DI SPA- // R made by Nising Engineering can be used. The electrostatic attraction causes the spacer particles to adhere to the substrate, and the electrostatic repulsion between the particles prevents the particles from agglomerating on the substrate.
亦可使用濕式噴霧技術來沈積間隔粒子於基板上。濕式 噴霧技術係描述於例如 Birenda Bahadur ( Ed) ，Liquid Crystals : Applications and Uses, V o 1 . 1 ( I SEN 98 1 020 1 1 09 )，其係已結合用於全部目的之參考於其中。 通常，將間隔粒子懸浮於醇類或水性液體中，例如乙醇、 異丙醇、或包含醇與水之混合物。間隔粒子之濃度例如約 爲0 · 1 - 0 · 5重量％。可使用超音波來分散粒子以避免凝聚 成塊。例如，在沈積粒子之前可用超音波來對間隔粒子發 射數分鐘，藉由空氣經由噴嘴將已準備好之懸浮液噴霧至 基板之上而於其上沈積積間隔粒子。 參照第7圖，在基板上沈積第二導電層715，並覆蓋間 隔粒子與形成於其上之其他層。該導電層包含例如金屬材 料’如鈣、鎂、鋇、銀或該等之混合物或合金。亦可使用 其他導電材料，特別是包含低工作功能之材料來形成第二 導電層。具體來說’使第二導電層形成圖案來形成電極條 7其作爲用於已形成像素之有機發光二極體（0LED )裝置之 極，而且可在形成圖案期間形成用於搭接襯墊之連結。 jt外，可選擇性地沈積該導電層來形成陽極條與搭接襯墊 - 1 3 - 1222839 連結。該導電層之選擇性沈積可藉由例如遮罩層達成。陽 極條通常正交於陰極條，亦可用對角於陰極來形成陽極， 頂部與底部電極條之交會部分形成有機LED像素。 參照第8圖，將帽罩260安裝於具有有機發光二極體（OLED) 像素之基板上，並與密封閘形成一條線來圍繞有機發光二 極體（OLED )裝置之單元區域。應用壓力於帽罩及/或基板來 將其壓在一起以避免密封劑移動進入密封閘與基板間之間 隙。於基板上應用密封劑287來圍繞帽罩，該密封劑包含 例如紫外線可硬化之環氧樹脂。亦可使用其他種類之密封 劑，例如熱可硬化之環氧樹脂或丙烯酸酯。該密封劑移動 進入而塡滿帽罩與基板間之密封區域2 8 5。例如使密封劑 硬化（例如，紫外線或熱），因而密封有機發光二極體（OLED) 單元200。 帽罩產生凹槽845並使其與有機發光二極體（OLED)單元 分開。在安裝製程期間，可將間隔粒子押入有機發光二極 體（OLED)早兀層’該間子提供用於在有機發光二極體 (OLED)單元區域上之帽罩的支撐，並且當應用壓力於帽罩 時防止帽罩接觸該裝置之主動構件。 如所述’在有機層形成之後進行沈積間隔粒子之製程。 該間隔粒子可另外在製程流程中之其他時點進行沈積。例 如’可在第一導電層之形成前或有機層之形成前沈積間隔 粒子。在效果上’可在第二導電層之形成前之製成的任一 時點沈積間隔粒子。 如第3-4圖所述，該製程形成密封閘於帽罩上。另外， 可形成密封閘於基板上。在第一導電層之形成後但在有機 功能層之形成與間隔粒子沈積前形成該閘。 - 1 4 一 1222839 雖然特別地藉由參考各實例來顯示與描述本發明，但是 各位精通本工藝者將了解可在不悖離其中之精神與範圍下 來對於本發明進行改良與改變。因此本發明之範圍不應僅 參照上述來決定’而且要參照所附屬之遵照其相對全部範 圍之申請專利範圍來決定。 ㈤圖式簡單說明 第1圖係顯示傳統之有機發光二極體（OLED)裝置； 第2圖係顯示根據本發明實例；以及 第3〜8圖係顯不根據本發明之一實例用來製作有機發光 二極體（OLED)之製程。 元件符號說明 100 有機發光二極體裝置 101 透明基板 105 透明導電層 110 有機功能層 115 導電層 145 凹槽 150 搭接襯墊 160 帽罩 187 密封劑 200 有機發光二極體裝置 201 基板 2 60 帽罩 280 密封閘 2 3 1 外側表面Wet spray technology can also be used to deposit spacer particles on a substrate. Wet spray technology is described in, for example, Birenda Bahadur (Ed), Liquid Crystals: Applications and Uses, Vo 1.1 (I SEN 98 1 020 1 1 09), which is incorporated herein by reference for all purposes. Generally, the spacer particles are suspended in an alcohol or an aqueous liquid, such as ethanol, isopropanol, or a mixture comprising an alcohol and water. The concentration of the spacer particles is, for example, about 0. 1 to 0. 5 wt%. Ultrasound can be used to disperse particles to avoid agglomeration. For example, ultrasonic waves can be used to emit spacer particles for several minutes before depositing the particles, and the prepared suspension is sprayed onto the substrate by air through a nozzle to deposit the spacer particles thereon. Referring to FIG. 7, a second conductive layer 715 is deposited on the substrate, and covers the spacer particles and other layers formed thereon. The conductive layer comprises, for example, a metal material 'such as calcium, magnesium, barium, silver, or a mixture or alloy thereof. Other conductive materials may be used to form the second conductive layer, especially materials containing a low work function. Specifically, 'the second conductive layer is patterned to form the electrode strip 7 which serves as a pole for an organic light emitting diode (0LED) device for which a pixel has been formed, and can be used to form a bonding pad during patterning. link. Outside jt, the conductive layer can be selectively deposited to form the anode strip and the bonding pad-1 3-1222839. The selective deposition of the conductive layer can be achieved by, for example, a mask layer. The anode strip is usually orthogonal to the cathode strip, and the anode can also be formed diagonally to the cathode. The intersection of the top and bottom electrode strips forms an organic LED pixel. Referring to FIG. 8, the cap 260 is mounted on a substrate having organic light emitting diode (OLED) pixels, and forms a line with the sealing gate to surround a unit area of the organic light emitting diode (OLED) device. Apply pressure to the cap and / or substrate to press them together to prevent the sealant from moving into the gap between the seal and the substrate. A cap 287 is applied to the substrate to surround the cap, the sealant comprising, for example, a UV-curable epoxy resin. Other types of sealants can also be used, such as heat-curable epoxy or acrylate. The sealant moves into and fills the sealing area 2 8 5 between the cap and the substrate. For example, the sealant is hardened (for example, ultraviolet rays or heat), thereby sealing the organic light emitting diode (OLED) unit 200. The cap creates a recess 845 and separates it from the organic light emitting diode (OLED) unit. During the installation process, spacer particles can be pushed into the early layer of the organic light-emitting diode (OLED). Prevent the cap from contacting the active components of the device when the cap is in place. The process of depositing spacer particles is performed as described after the formation of the organic layer. The spacer particles may additionally be deposited at other points in the process flow. For example, 'the spacer particles may be deposited before the formation of the first conductive layer or before the formation of the organic layer. In effect ', the spacer particles can be deposited at any point before the second conductive layer is formed. As shown in Figures 3-4, this process forms a sealed gate on the cap. In addition, a sealing gate can be formed on the substrate. The gate is formed after the formation of the first conductive layer but before the formation of the organic functional layer and the deposition of the spacer particles. -1 4 1222839 Although the present invention is specifically shown and described with reference to examples, those skilled in the art will understand that the present invention can be improved and changed without departing from the spirit and scope thereof. Therefore, the scope of the present invention should not be determined by referring only to the above-mentioned, but also by the scope of the patent application attached to it that complies with its relatively full scope. ㈤Schematic illustrations. Figure 1 shows a conventional organic light-emitting diode (OLED) device; Figure 2 shows an example according to the invention; and Figures 3 to 8 show a method used to make an example according to the invention. Process of organic light emitting diode (OLED). Description of component symbols 100 Organic light emitting diode device 101 Transparent substrate 105 Transparent conductive layer 110 Organic functional layer 115 Conductive layer 145 Groove 150 Lapping gasket 160 Cap 187 Sealant 200 Organic light emitting diode device 201 Substrate 2 60 Cap Cover 280 Seal gate 2 3 1 Outer surface
- 15 - 1222839 28 5 密封空間 28 7 密封劑 3 60 基板 3 80 裝置層 501 基板 5 0 5 導電層 510 有機功能層 5 5 6 基板之部分 670 用於搭接腳位連結之區域 φ 680 間隔粒子 715 第二導電層 84 5 凹槽-15-1222839 28 5 Sealed space 28 7 Sealant 3 60 Substrate 3 80 Device layer 501 Substrate 5 0 5 Conductive layer 510 Organic functional layer 5 5 6 Part of the substrate 670 Area for lap connection φ 680 Spacer particles 715 second conductive layer 84 5 groove
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