MXPA05009404A - Sistema y metodo para dispositivo de despliegue con desecante integrado. - Google Patents

Sistema y metodo para dispositivo de despliegue con desecante integrado.

Info

Publication number
MXPA05009404A
MXPA05009404A MXPA05009404A MXPA05009404A MXPA05009404A MX PA05009404 A MXPA05009404 A MX PA05009404A MX PA05009404 A MXPA05009404 A MX PA05009404A MX PA05009404 A MXPA05009404 A MX PA05009404A MX PA05009404 A MXPA05009404 A MX PA05009404A
Authority
MX
Mexico
Prior art keywords
display device
desiccant
integrated
transparent substrate
integrated desiccant
Prior art date
Application number
MXPA05009404A
Other languages
English (en)
Inventor
Lauren Palmateer
Original Assignee
Idc Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idc Llc filed Critical Idc Llc
Publication of MXPA05009404A publication Critical patent/MXPA05009404A/es

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032Packages or encapsulation
    • B81B7/0035Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/04Optical MEMS
    • B81B2201/047Optical MEMS not provided for in B81B2201/042 - B81B2201/045
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00Forming microstructural systems
    • B81C2203/01Packaging MEMS
    • B81C2203/0109Bonding an individual cap on the substrate
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Packages (AREA)
  • Micromachines (AREA)
  • Electroluminescent Light Sources (AREA)
  • Drying Of Gases (AREA)

Abstract

Una estructura de empaque 210 y metodo para empacar un modulador interferometrico con un desecante integrado; un modulador interferometrico 400 esta formado de un substrato transparente 250; una tarjeta base 310 esta unida al substrato transparente para formar una estructura de empaque 210 y para encapsular el modulador interferometrico; se provee un desecante 500 integrado dentro de la tarjeta base o el substrato transparente para absorber la humedad dentro del empaque.
MXPA05009404A 2004-09-27 2005-09-02 Sistema y metodo para dispositivo de despliegue con desecante integrado. MXPA05009404A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61330004P 2004-09-27 2004-09-27
US11/107,518 US7551246B2 (en) 2004-09-27 2005-04-15 System and method for display device with integrated desiccant

Publications (1)

Publication Number Publication Date
MXPA05009404A true MXPA05009404A (es) 2006-03-29

Family

ID=35462141

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA05009404A MXPA05009404A (es) 2004-09-27 2005-09-02 Sistema y metodo para dispositivo de despliegue con desecante integrado.

Country Status (12)

Country Link
US (1) US7551246B2 (es)
EP (1) EP1640324A3 (es)
JP (1) JP2006099065A (es)
KR (1) KR101199903B1 (es)
CN (1) CN102358609A (es)
AU (1) AU2005203379A1 (es)
BR (1) BRPI0503936A (es)
CA (1) CA2516912A1 (es)
MX (1) MXPA05009404A (es)
RU (1) RU2005129924A (es)
SG (1) SG121055A1 (es)
TW (1) TW200626473A (es)

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TWI815428B (zh) * 2022-05-04 2023-09-11 友達光電股份有限公司 發光二極體顯示面板的製造方法

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Also Published As

Publication number Publication date
AU2005203379A1 (en) 2006-04-13
TW200626473A (en) 2006-08-01
EP1640324A3 (en) 2008-04-09
KR101199903B1 (ko) 2012-11-12
EP1640324A2 (en) 2006-03-29
BRPI0503936A (pt) 2006-05-09
US20060077146A1 (en) 2006-04-13
KR20060092874A (ko) 2006-08-23
RU2005129924A (ru) 2007-04-10
CN102358609A (zh) 2012-02-22
US7551246B2 (en) 2009-06-23
CA2516912A1 (en) 2006-03-27
SG121055A1 (en) 2006-04-26
JP2006099065A (ja) 2006-04-13

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