AU2002237682A1 - Wafer eutectic bonding of mems gyros - Google Patents

Wafer eutectic bonding of mems gyros

Info

Publication number
AU2002237682A1
AU2002237682A1 AU2002237682A AU3768202A AU2002237682A1 AU 2002237682 A1 AU2002237682 A1 AU 2002237682A1 AU 2002237682 A AU2002237682 A AU 2002237682A AU 3768202 A AU3768202 A AU 3768202A AU 2002237682 A1 AU2002237682 A1 AU 2002237682A1
Authority
AU
Australia
Prior art keywords
eutectic bonding
mems gyros
wafer eutectic
wafer
gyros
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002237682A
Inventor
Floyd K. Eide
Andy A. Nguyen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microsensors Inc
Original Assignee
Microsensors Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microsensors Inc filed Critical Microsensors Inc
Publication of AU2002237682A1 publication Critical patent/AU2002237682A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Gyroscopes (AREA)
  • Micromachines (AREA)
AU2002237682A 2000-11-27 2001-11-27 Wafer eutectic bonding of mems gyros Abandoned AU2002237682A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25320600P 2000-11-27 2000-11-27
US60/253,206 2000-11-27
PCT/US2001/044329 WO2002042716A2 (en) 2000-11-27 2001-11-27 Wafer eutectic bonding of mems gyros

Publications (1)

Publication Number Publication Date
AU2002237682A1 true AU2002237682A1 (en) 2002-06-03

Family

ID=22959320

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002237682A Abandoned AU2002237682A1 (en) 2000-11-27 2001-11-27 Wafer eutectic bonding of mems gyros

Country Status (2)

Country Link
AU (1) AU2002237682A1 (en)
WO (1) WO2002042716A2 (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
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US7138293B2 (en) 2002-10-04 2006-11-21 Dalsa Semiconductor Inc. Wafer level packaging technique for microdevices
KR100474455B1 (en) 2002-11-08 2005-03-11 삼성전자주식회사 Method and device for mounting vacumm of micro electro mechanical system at wafer level
US6914323B2 (en) * 2003-03-20 2005-07-05 Honeywell International Inc. Methods and apparatus for attaching getters to MEMS device housings
US7045868B2 (en) 2003-07-31 2006-05-16 Motorola, Inc. Wafer-level sealed microdevice having trench isolation and methods for making the same
TWI251712B (en) 2003-08-15 2006-03-21 Prime View Int Corp Ltd Interference display plate
US7291513B2 (en) * 2003-12-15 2007-11-06 Dalsa Semiconductor Inc. Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy
KR100501723B1 (en) * 2003-12-17 2005-07-18 삼성전자주식회사 METHOD FOR FABRICATING GYROSCOPE USING Si-METAL-Si WAFER AND GYROSCOPE FABRICATED BY THE METHOD
US7042076B2 (en) 2004-03-09 2006-05-09 Northrop Grumman Corporation Vacuum sealed microdevice packaging with getters
US7164520B2 (en) 2004-05-12 2007-01-16 Idc, Llc Packaging for an interferometric modulator
US7668415B2 (en) 2004-09-27 2010-02-23 Qualcomm Mems Technologies, Inc. Method and device for providing electronic circuitry on a backplate
US7551246B2 (en) 2004-09-27 2009-06-23 Idc, Llc. System and method for display device with integrated desiccant
US7710629B2 (en) 2004-09-27 2010-05-04 Qualcomm Mems Technologies, Inc. System and method for display device with reinforcing substance
FR2883099B1 (en) * 2005-03-14 2007-04-13 Commissariat Energie Atomique PROTECTION OF A THIN LAYER GETTER
US7442570B2 (en) 2005-03-18 2008-10-28 Invensence Inc. Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom
US20100139373A1 (en) * 2005-08-19 2010-06-10 Honeywell Internationa Inc. Mems sensor package
US7746537B2 (en) 2006-04-13 2010-06-29 Qualcomm Mems Technologies, Inc. MEMS devices and processes for packaging such devices
US8040587B2 (en) 2006-05-17 2011-10-18 Qualcomm Mems Technologies, Inc. Desiccant in a MEMS device
WO2007149475A2 (en) 2006-06-21 2007-12-27 Qualcomm Mems Technologies, Inc. Method for packaging an optical mems device
CN101490955A (en) * 2006-07-20 2009-07-22 Nxp股份有限公司 Frame and method of manufacturing assembly
US7816164B2 (en) 2006-12-01 2010-10-19 Qualcomm Mems Technologies, Inc. MEMS processing
WO2009041951A1 (en) 2007-09-28 2009-04-02 Qualcomm Mems Technologies, Inc. Optimization of desiccant usage in a mems package
DE102007048332A1 (en) * 2007-10-09 2009-04-16 Robert Bosch Gmbh Composite of at least two semiconductor substrates and manufacturing method
DE102007048604A1 (en) 2007-10-10 2009-04-16 Robert Bosch Gmbh Composite of at least two semiconductor substrates and manufacturing method
DE102008016004A1 (en) 2008-03-27 2009-10-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Microelectromechanical inertial sensor with atmospheric damping
US8956904B2 (en) 2008-09-10 2015-02-17 Analog Devices, Inc. Apparatus and method of wafer bonding using compatible alloy
US7943411B2 (en) 2008-09-10 2011-05-17 Analog Devices, Inc. Apparatus and method of wafer bonding using compatible alloy
DE102009026628A1 (en) 2009-06-02 2010-12-09 Robert Bosch Gmbh Micromechanical component and method for producing a micromechanical component
US8507913B2 (en) 2010-09-29 2013-08-13 Analog Devices, Inc. Method of bonding wafers
US8567246B2 (en) 2010-10-12 2013-10-29 Invensense, Inc. Integrated MEMS device and method of use
US8947081B2 (en) 2011-01-11 2015-02-03 Invensense, Inc. Micromachined resonant magnetic field sensors
US9664750B2 (en) 2011-01-11 2017-05-30 Invensense, Inc. In-plane sensing Lorentz force magnetometer
US8860409B2 (en) 2011-01-11 2014-10-14 Invensense, Inc. Micromachined resonant magnetic field sensors
WO2016130722A1 (en) 2015-02-11 2016-08-18 Invensense, Inc. 3D INTEGRATION USING Al-Ge EUTECTIC BOND INTERCONNECT
TWI827586B (en) * 2018-03-20 2024-01-01 美商歐柏西迪恩感應器公司 Capping plate for panel scale packaging of mems products
DE102021116237A1 (en) 2021-06-23 2022-12-29 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE
US11807520B2 (en) * 2021-06-23 2023-11-07 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor structure and method for manufacturing thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5792984A (en) * 1996-07-01 1998-08-11 Cts Corporation Molded aluminum nitride packages
US6204448B1 (en) * 1998-12-04 2001-03-20 Kyocera America, Inc. High frequency microwave packaging having a dielectric gap

Also Published As

Publication number Publication date
WO2002042716A3 (en) 2003-01-23
WO2002042716A2 (en) 2002-05-30

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