WO2002042716A3 - Wafer eutectic bonding of mems gyros - Google Patents
Wafer eutectic bonding of mems gyros Download PDFInfo
- Publication number
- WO2002042716A3 WO2002042716A3 PCT/US2001/044329 US0144329W WO0242716A3 WO 2002042716 A3 WO2002042716 A3 WO 2002042716A3 US 0144329 W US0144329 W US 0144329W WO 0242716 A3 WO0242716 A3 WO 0242716A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- eutectic bonding
- mems gyros
- wafer eutectic
- wafer
- gyros
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0172—Seals
- B81C2203/019—Seals characterised by the material or arrangement of seals between parts
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Gyroscopes (AREA)
- Micromachines (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002237682A AU2002237682A1 (en) | 2000-11-27 | 2001-11-27 | Wafer eutectic bonding of mems gyros |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25320600P | 2000-11-27 | 2000-11-27 | |
US60/253,206 | 2000-11-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002042716A2 WO2002042716A2 (en) | 2002-05-30 |
WO2002042716A3 true WO2002042716A3 (en) | 2003-01-23 |
Family
ID=22959320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/044329 WO2002042716A2 (en) | 2000-11-27 | 2001-11-27 | Wafer eutectic bonding of mems gyros |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2002237682A1 (en) |
WO (1) | WO2002042716A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8853747B2 (en) | 2004-05-12 | 2014-10-07 | Qualcomm Mems Technologies, Inc. | Method of making an electronic device with a curved backplate |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7138293B2 (en) * | 2002-10-04 | 2006-11-21 | Dalsa Semiconductor Inc. | Wafer level packaging technique for microdevices |
KR100474455B1 (en) | 2002-11-08 | 2005-03-11 | 삼성전자주식회사 | Method and device for mounting vacumm of micro electro mechanical system at wafer level |
US6914323B2 (en) | 2003-03-20 | 2005-07-05 | Honeywell International Inc. | Methods and apparatus for attaching getters to MEMS device housings |
US7045868B2 (en) | 2003-07-31 | 2006-05-16 | Motorola, Inc. | Wafer-level sealed microdevice having trench isolation and methods for making the same |
TWI251712B (en) | 2003-08-15 | 2006-03-21 | Prime View Int Corp Ltd | Interference display plate |
US7291513B2 (en) * | 2003-12-15 | 2007-11-06 | Dalsa Semiconductor Inc. | Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy |
KR100501723B1 (en) * | 2003-12-17 | 2005-07-18 | 삼성전자주식회사 | METHOD FOR FABRICATING GYROSCOPE USING Si-METAL-Si WAFER AND GYROSCOPE FABRICATED BY THE METHOD |
US7042076B2 (en) | 2004-03-09 | 2006-05-09 | Northrop Grumman Corporation | Vacuum sealed microdevice packaging with getters |
US7668415B2 (en) | 2004-09-27 | 2010-02-23 | Qualcomm Mems Technologies, Inc. | Method and device for providing electronic circuitry on a backplate |
US7710629B2 (en) | 2004-09-27 | 2010-05-04 | Qualcomm Mems Technologies, Inc. | System and method for display device with reinforcing substance |
US7551246B2 (en) | 2004-09-27 | 2009-06-23 | Idc, Llc. | System and method for display device with integrated desiccant |
FR2883099B1 (en) * | 2005-03-14 | 2007-04-13 | Commissariat Energie Atomique | PROTECTION OF A THIN LAYER GETTER |
US7442570B2 (en) * | 2005-03-18 | 2008-10-28 | Invensence Inc. | Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom |
US20100139373A1 (en) * | 2005-08-19 | 2010-06-10 | Honeywell Internationa Inc. | Mems sensor package |
EP1979268A2 (en) | 2006-04-13 | 2008-10-15 | Qualcomm Mems Technologies, Inc. | Packaging a mems device using a frame |
US8040587B2 (en) | 2006-05-17 | 2011-10-18 | Qualcomm Mems Technologies, Inc. | Desiccant in a MEMS device |
WO2007149475A2 (en) | 2006-06-21 | 2007-12-27 | Qualcomm Mems Technologies, Inc. | Method for packaging an optical mems device |
EP2047596A2 (en) * | 2006-07-20 | 2009-04-15 | Nxp B.V. | Frame and method of manufacturing assembly |
US7816164B2 (en) | 2006-12-01 | 2010-10-19 | Qualcomm Mems Technologies, Inc. | MEMS processing |
US8435838B2 (en) | 2007-09-28 | 2013-05-07 | Qualcomm Mems Technologies, Inc. | Optimization of desiccant usage in a MEMS package |
DE102007048332A1 (en) * | 2007-10-09 | 2009-04-16 | Robert Bosch Gmbh | Composite of at least two semiconductor substrates and manufacturing method |
DE102007048604A1 (en) | 2007-10-10 | 2009-04-16 | Robert Bosch Gmbh | Composite of at least two semiconductor substrates and manufacturing method |
DE102008016004B4 (en) | 2008-03-27 | 2024-07-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Microelectromechanical inertial sensor with atmospheric damping |
US8956904B2 (en) | 2008-09-10 | 2015-02-17 | Analog Devices, Inc. | Apparatus and method of wafer bonding using compatible alloy |
US7943411B2 (en) | 2008-09-10 | 2011-05-17 | Analog Devices, Inc. | Apparatus and method of wafer bonding using compatible alloy |
DE102009026628A1 (en) * | 2009-06-02 | 2010-12-09 | Robert Bosch Gmbh | Micromechanical component and method for producing a micromechanical component |
US8507913B2 (en) | 2010-09-29 | 2013-08-13 | Analog Devices, Inc. | Method of bonding wafers |
US8567246B2 (en) | 2010-10-12 | 2013-10-29 | Invensense, Inc. | Integrated MEMS device and method of use |
US9664750B2 (en) | 2011-01-11 | 2017-05-30 | Invensense, Inc. | In-plane sensing Lorentz force magnetometer |
US8860409B2 (en) | 2011-01-11 | 2014-10-14 | Invensense, Inc. | Micromachined resonant magnetic field sensors |
US8947081B2 (en) | 2011-01-11 | 2015-02-03 | Invensense, Inc. | Micromachined resonant magnetic field sensors |
WO2016130722A1 (en) | 2015-02-11 | 2016-08-18 | Invensense, Inc. | 3D INTEGRATION USING Al-Ge EUTECTIC BOND INTERCONNECT |
WO2019183259A1 (en) | 2018-03-20 | 2019-09-26 | Obsidian Sensors, Inc. | Capping plate for panel scale packaging of mems products |
CN109761188A (en) * | 2018-12-25 | 2019-05-17 | 合肥芯福传感器技术有限公司 | A kind of wafer-level vacuum encapsulating method |
DE102021116237A1 (en) | 2021-06-23 | 2022-12-29 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE |
US11807520B2 (en) | 2021-06-23 | 2023-11-07 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and method for manufacturing thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5792984A (en) * | 1996-07-01 | 1998-08-11 | Cts Corporation | Molded aluminum nitride packages |
US6204448B1 (en) * | 1998-12-04 | 2001-03-20 | Kyocera America, Inc. | High frequency microwave packaging having a dielectric gap |
-
2001
- 2001-11-27 WO PCT/US2001/044329 patent/WO2002042716A2/en not_active Application Discontinuation
- 2001-11-27 AU AU2002237682A patent/AU2002237682A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5792984A (en) * | 1996-07-01 | 1998-08-11 | Cts Corporation | Molded aluminum nitride packages |
US6204448B1 (en) * | 1998-12-04 | 2001-03-20 | Kyocera America, Inc. | High frequency microwave packaging having a dielectric gap |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8853747B2 (en) | 2004-05-12 | 2014-10-07 | Qualcomm Mems Technologies, Inc. | Method of making an electronic device with a curved backplate |
Also Published As
Publication number | Publication date |
---|---|
WO2002042716A2 (en) | 2002-05-30 |
AU2002237682A1 (en) | 2002-06-03 |
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