WO2002042716A3 - Wafer eutectic bonding of mems gyros - Google Patents

Wafer eutectic bonding of mems gyros Download PDF

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Publication number
WO2002042716A3
WO2002042716A3 PCT/US2001/044329 US0144329W WO0242716A3 WO 2002042716 A3 WO2002042716 A3 WO 2002042716A3 US 0144329 W US0144329 W US 0144329W WO 0242716 A3 WO0242716 A3 WO 0242716A3
Authority
WO
WIPO (PCT)
Prior art keywords
eutectic bonding
mems gyros
wafer eutectic
wafer
gyros
Prior art date
Application number
PCT/US2001/044329
Other languages
French (fr)
Other versions
WO2002042716A2 (en
Inventor
Floyd K Eide
Andy A Nguyen
Original Assignee
Microsensors Inc
Floyd K Eide
Andy A Nguyen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microsensors Inc, Floyd K Eide, Andy A Nguyen filed Critical Microsensors Inc
Priority to AU2002237682A priority Critical patent/AU2002237682A1/en
Publication of WO2002042716A2 publication Critical patent/WO2002042716A2/en
Publication of WO2002042716A3 publication Critical patent/WO2002042716A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts

Abstract

A gyro package includes at least one cap portion (22) coupled to a base portion (28), a getter (44), a gyro (26), a sealed ring (35).
PCT/US2001/044329 2000-11-27 2001-11-27 Wafer eutectic bonding of mems gyros WO2002042716A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002237682A AU2002237682A1 (en) 2000-11-27 2001-11-27 Wafer eutectic bonding of mems gyros

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US25320600P 2000-11-27 2000-11-27
US60/253,206 2000-11-27

Publications (2)

Publication Number Publication Date
WO2002042716A2 WO2002042716A2 (en) 2002-05-30
WO2002042716A3 true WO2002042716A3 (en) 2003-01-23

Family

ID=22959320

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/044329 WO2002042716A2 (en) 2000-11-27 2001-11-27 Wafer eutectic bonding of mems gyros

Country Status (2)

Country Link
AU (1) AU2002237682A1 (en)
WO (1) WO2002042716A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8853747B2 (en) 2004-05-12 2014-10-07 Qualcomm Mems Technologies, Inc. Method of making an electronic device with a curved backplate

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* Cited by examiner, † Cited by third party
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US7138293B2 (en) 2002-10-04 2006-11-21 Dalsa Semiconductor Inc. Wafer level packaging technique for microdevices
KR100474455B1 (en) * 2002-11-08 2005-03-11 삼성전자주식회사 Method and device for mounting vacumm of micro electro mechanical system at wafer level
US6914323B2 (en) 2003-03-20 2005-07-05 Honeywell International Inc. Methods and apparatus for attaching getters to MEMS device housings
US7045868B2 (en) 2003-07-31 2006-05-16 Motorola, Inc. Wafer-level sealed microdevice having trench isolation and methods for making the same
TWI251712B (en) 2003-08-15 2006-03-21 Prime View Int Corp Ltd Interference display plate
US7291513B2 (en) * 2003-12-15 2007-11-06 Dalsa Semiconductor Inc. Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy
KR100501723B1 (en) * 2003-12-17 2005-07-18 삼성전자주식회사 METHOD FOR FABRICATING GYROSCOPE USING Si-METAL-Si WAFER AND GYROSCOPE FABRICATED BY THE METHOD
US7042076B2 (en) * 2004-03-09 2006-05-09 Northrop Grumman Corporation Vacuum sealed microdevice packaging with getters
US7551246B2 (en) 2004-09-27 2009-06-23 Idc, Llc. System and method for display device with integrated desiccant
US7668415B2 (en) 2004-09-27 2010-02-23 Qualcomm Mems Technologies, Inc. Method and device for providing electronic circuitry on a backplate
US7710629B2 (en) 2004-09-27 2010-05-04 Qualcomm Mems Technologies, Inc. System and method for display device with reinforcing substance
FR2883099B1 (en) 2005-03-14 2007-04-13 Commissariat Energie Atomique PROTECTION OF A THIN LAYER GETTER
US7442570B2 (en) 2005-03-18 2008-10-28 Invensence Inc. Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom
US20100139373A1 (en) * 2005-08-19 2010-06-10 Honeywell Internationa Inc. Mems sensor package
US7746537B2 (en) 2006-04-13 2010-06-29 Qualcomm Mems Technologies, Inc. MEMS devices and processes for packaging such devices
US8040587B2 (en) 2006-05-17 2011-10-18 Qualcomm Mems Technologies, Inc. Desiccant in a MEMS device
WO2007149475A2 (en) 2006-06-21 2007-12-27 Qualcomm Mems Technologies, Inc. Method for packaging an optical mems device
US20090315169A1 (en) * 2006-07-20 2009-12-24 Nxp B.V. Frame and method of manufacturing assembly
US7816164B2 (en) 2006-12-01 2010-10-19 Qualcomm Mems Technologies, Inc. MEMS processing
EP2116508A3 (en) 2007-09-28 2010-10-13 QUALCOMM MEMS Technologies, Inc. Optimization of desiccant usage in a MEMS package
DE102007048332A1 (en) * 2007-10-09 2009-04-16 Robert Bosch Gmbh Composite of at least two semiconductor substrates and manufacturing method
DE102007048604A1 (en) 2007-10-10 2009-04-16 Robert Bosch Gmbh Composite of at least two semiconductor substrates and manufacturing method
DE102008016004A1 (en) * 2008-03-27 2009-10-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Microelectromechanical inertial sensor with atmospheric damping
US7943411B2 (en) 2008-09-10 2011-05-17 Analog Devices, Inc. Apparatus and method of wafer bonding using compatible alloy
US8956904B2 (en) 2008-09-10 2015-02-17 Analog Devices, Inc. Apparatus and method of wafer bonding using compatible alloy
DE102009026628A1 (en) * 2009-06-02 2010-12-09 Robert Bosch Gmbh Micromechanical component and method for producing a micromechanical component
US8507913B2 (en) 2010-09-29 2013-08-13 Analog Devices, Inc. Method of bonding wafers
US8567246B2 (en) 2010-10-12 2013-10-29 Invensense, Inc. Integrated MEMS device and method of use
US8947081B2 (en) 2011-01-11 2015-02-03 Invensense, Inc. Micromachined resonant magnetic field sensors
US8860409B2 (en) 2011-01-11 2014-10-14 Invensense, Inc. Micromachined resonant magnetic field sensors
US9664750B2 (en) 2011-01-11 2017-05-30 Invensense, Inc. In-plane sensing Lorentz force magnetometer
US9754922B2 (en) 2015-02-11 2017-09-05 Invensense, Inc. 3D integration using Al—Ge eutectic bond interconnect
US11685649B2 (en) 2018-03-20 2023-06-27 Obsidian Sensors, Inc. Capping plate for panel scale packaging of MEMS products
DE102021116237A1 (en) 2021-06-23 2022-12-29 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE
US11807520B2 (en) 2021-06-23 2023-11-07 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor structure and method for manufacturing thereof

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US5792984A (en) * 1996-07-01 1998-08-11 Cts Corporation Molded aluminum nitride packages
US6204448B1 (en) * 1998-12-04 2001-03-20 Kyocera America, Inc. High frequency microwave packaging having a dielectric gap

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5792984A (en) * 1996-07-01 1998-08-11 Cts Corporation Molded aluminum nitride packages
US6204448B1 (en) * 1998-12-04 2001-03-20 Kyocera America, Inc. High frequency microwave packaging having a dielectric gap

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8853747B2 (en) 2004-05-12 2014-10-07 Qualcomm Mems Technologies, Inc. Method of making an electronic device with a curved backplate

Also Published As

Publication number Publication date
WO2002042716A2 (en) 2002-05-30
AU2002237682A1 (en) 2002-06-03

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