ES2185588T3 - Dispositivo de circuito integrado asegurado contra ataques realizados por destrucciob controlada de una capa complementaria. - Google Patents
Dispositivo de circuito integrado asegurado contra ataques realizados por destrucciob controlada de una capa complementaria.Info
- Publication number
- ES2185588T3 ES2185588T3 ES00920849T ES00920849T ES2185588T3 ES 2185588 T3 ES2185588 T3 ES 2185588T3 ES 00920849 T ES00920849 T ES 00920849T ES 00920849 T ES00920849 T ES 00920849T ES 2185588 T3 ES2185588 T3 ES 2185588T3
- Authority
- ES
- Spain
- Prior art keywords
- film
- integrated circuit
- active
- insured
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
- H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Abstract
Dispositivo (1) de circuito integrado que contiene: una capa (2) activa que comprende un material semiconductor; un circuito integrado en una cara (4) activa de la mencionada capa (2) activa, comprendiendo dicho circuito integrado elementos de circuito y al menos un área (5) de contacto aparente en la mencionada cara (4) activa; una capa (3) complementaria fijada a la mencionada cara (4) activa, cubriendo dicha capa (3) complementaria al menos parcialmente el mencionado circuito integrado de la mencionada capa (2) activa; caracterizado porque un agujero (20, 21, 22, 23) está practicado en la capa (3) complementaria, estando situado dicho agujero (20, 21, 22, 23) en la vertical de, al menos, un elemento de circuito.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9904916A FR2792440B1 (fr) | 1999-04-19 | 1999-04-19 | Dispositif a circuit integre securise contre des attaques procedant par destruction controlee d'une couche complementaire |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2185588T3 true ES2185588T3 (es) | 2003-05-01 |
Family
ID=9544592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES00920849T Expired - Lifetime ES2185588T3 (es) | 1999-04-19 | 2000-04-19 | Dispositivo de circuito integrado asegurado contra ataques realizados por destrucciob controlada de una capa complementaria. |
Country Status (9)
Country | Link |
---|---|
US (1) | US6576991B1 (es) |
EP (1) | EP1183642B1 (es) |
JP (1) | JP4566412B2 (es) |
CN (1) | CN1184594C (es) |
AT (1) | ATE226744T1 (es) |
DE (1) | DE60000666T2 (es) |
ES (1) | ES2185588T3 (es) |
FR (1) | FR2792440B1 (es) |
WO (1) | WO2000063836A1 (es) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10029035C1 (de) * | 2000-06-13 | 2002-02-28 | Infineon Technologies Ag | Verfahren zur Bearbeitung eines Wafers |
FR2828334A1 (fr) * | 2001-08-03 | 2003-02-07 | Schlumberger Systems & Service | Procede pour rendre connectable electriquement et mecaniquement un dispositif electrique ayant une face munie de plots de contacts |
WO2003081668A1 (en) * | 2002-03-21 | 2003-10-02 | Koninklijke Philips Electronics N.V. | Semiconductor device with a protective security coating and method of manufacturing the same |
AU2003263433A1 (en) * | 2002-09-17 | 2004-04-08 | Axalto Sa | Method of manufacturing a wafer assembly |
US20050263596A1 (en) * | 2004-05-12 | 2005-12-01 | Solicore, Inc. | Portable charger, including portable sleeve, for an electronically readable card |
JP4581011B2 (ja) * | 2008-01-25 | 2010-11-17 | 株式会社東芝 | 電気部品とその製造方法 |
FR2935061A1 (fr) * | 2008-08-13 | 2010-02-19 | St Microelectronics Rousset | Dispositif de detection d'une attaque d'un circuit integre |
JP5466102B2 (ja) * | 2010-07-08 | 2014-04-09 | セイコーインスツル株式会社 | 貫通電極付きガラス基板の製造方法及び電子部品の製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2517165A1 (fr) * | 1981-11-20 | 1983-05-27 | Radiotechnique Compelec | Procede pour munir d'un ecran un circuit electronique, et carte de paiement munie d'un ecran |
FR2677785A1 (fr) * | 1991-06-17 | 1992-12-18 | Philips Composants | Procede de fabrication d'une carte a microcircuit. |
US5468990A (en) * | 1993-07-22 | 1995-11-21 | National Semiconductor Corp. | Structures for preventing reverse engineering of integrated circuits |
US5581445A (en) * | 1994-02-14 | 1996-12-03 | Us3, Inc. | Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module |
FR2727227B1 (fr) * | 1994-11-17 | 1996-12-20 | Schlumberger Ind Sa | Dispositif de securite actif a memoire electronique |
JPH08213392A (ja) * | 1995-02-01 | 1996-08-20 | Oki Electric Ind Co Ltd | 半導体素子及びその製造方法 |
JP2905736B2 (ja) * | 1995-12-18 | 1999-06-14 | 株式会社エイ・ティ・アール光電波通信研究所 | 半導体装置 |
US5841193A (en) * | 1996-05-20 | 1998-11-24 | Epic Technologies, Inc. | Single chip modules, repairable multichip modules, and methods of fabrication thereof |
US5898215A (en) * | 1996-12-16 | 1999-04-27 | Motorola, Inc. | Microelectronic assembly with connection to a buried electrical element, and method for forming same |
FR2767966B1 (fr) * | 1997-08-28 | 1999-12-03 | Schlumberger Ind Sa | Dispositif a circuit integre securise et procede de fabrication |
DE19741889C2 (de) * | 1997-09-23 | 2000-06-08 | Hoeft & Wessel Aktiengesellsch | Baugruppe mit einem Datenspeicher und einem Beschädigungsdetektor |
US6140707A (en) * | 1998-05-07 | 2000-10-31 | 3M Innovative Properties Co. | Laminated integrated circuit package |
JP2000186931A (ja) * | 1998-12-21 | 2000-07-04 | Murata Mfg Co Ltd | 小型電子部品及びその製造方法並びに該小型電子部品に用いるビアホールの成形方法 |
US6326698B1 (en) * | 2000-06-08 | 2001-12-04 | Micron Technology, Inc. | Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices |
-
1999
- 1999-04-19 FR FR9904916A patent/FR2792440B1/fr not_active Expired - Fee Related
-
2000
- 2000-04-19 EP EP00920849A patent/EP1183642B1/fr not_active Revoked
- 2000-04-19 WO PCT/FR2000/001031 patent/WO2000063836A1/fr not_active Application Discontinuation
- 2000-04-19 DE DE60000666T patent/DE60000666T2/de not_active Revoked
- 2000-04-19 JP JP2000612883A patent/JP4566412B2/ja not_active Expired - Fee Related
- 2000-04-19 AT AT00920849T patent/ATE226744T1/de not_active IP Right Cessation
- 2000-04-19 US US09/959,166 patent/US6576991B1/en not_active Expired - Fee Related
- 2000-04-19 ES ES00920849T patent/ES2185588T3/es not_active Expired - Lifetime
- 2000-04-19 CN CNB008063788A patent/CN1184594C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ATE226744T1 (de) | 2002-11-15 |
US6576991B1 (en) | 2003-06-10 |
DE60000666D1 (de) | 2002-11-28 |
CN1347535A (zh) | 2002-05-01 |
CN1184594C (zh) | 2005-01-12 |
JP2003521757A (ja) | 2003-07-15 |
FR2792440B1 (fr) | 2001-06-08 |
JP4566412B2 (ja) | 2010-10-20 |
EP1183642A1 (fr) | 2002-03-06 |
WO2000063836A1 (fr) | 2000-10-26 |
FR2792440A1 (fr) | 2000-10-20 |
EP1183642B1 (fr) | 2002-10-23 |
DE60000666T2 (de) | 2003-07-03 |
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