DE69731485D1 - Halbleitervorrichtung mit selektiv diffundierten bereichen - Google Patents
Halbleitervorrichtung mit selektiv diffundierten bereichenInfo
- Publication number
- DE69731485D1 DE69731485D1 DE69731485T DE69731485T DE69731485D1 DE 69731485 D1 DE69731485 D1 DE 69731485D1 DE 69731485 T DE69731485 T DE 69731485T DE 69731485 T DE69731485 T DE 69731485T DE 69731485 D1 DE69731485 D1 DE 69731485D1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- solids
- diffusion region
- dopant source
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000002019 doping agent Substances 0.000 abstract 8
- 239000000758 substrate Substances 0.000 abstract 8
- 238000009792 diffusion process Methods 0.000 abstract 5
- 239000007787 solid Substances 0.000 abstract 5
- 238000000034 method Methods 0.000 abstract 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
- Bipolar Transistors (AREA)
- Drying Of Semiconductors (AREA)
- Thyristors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP96120865A EP0851511A1 (de) | 1996-12-24 | 1996-12-24 | Halbleitereinrichtung mit zwei selektiv diffundierten Bereichen |
EP96120865 | 1996-12-24 | ||
PCT/EP1997/007246 WO1998028798A1 (en) | 1996-12-24 | 1997-12-22 | Semiconductor device with selectively diffused regions |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69731485D1 true DE69731485D1 (de) | 2004-12-09 |
DE69731485T2 DE69731485T2 (de) | 2005-10-27 |
Family
ID=8223558
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69731485T Expired - Lifetime DE69731485T2 (de) | 1996-12-24 | 1997-12-22 | Halbleitervorrichtung mit selektiv diffundierten bereichen |
Country Status (10)
Country | Link |
---|---|
EP (2) | EP0851511A1 (de) |
JP (2) | JP3999820B2 (de) |
CN (1) | CN1155104C (de) |
AT (1) | ATE281698T1 (de) |
AU (1) | AU741153B2 (de) |
CA (1) | CA2276008C (de) |
DE (1) | DE69731485T2 (de) |
DK (1) | DK0960443T3 (de) |
ES (1) | ES2232887T3 (de) |
WO (1) | WO1998028798A1 (de) |
Families Citing this family (75)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000138386A (ja) * | 1998-11-04 | 2000-05-16 | Shin Etsu Chem Co Ltd | 太陽電池の製造方法およびこの方法で製造された太陽電池 |
EP1024523A1 (de) * | 1999-01-27 | 2000-08-02 | Imec (Interuniversity Microelectronics Center) VZW | Herstellungsverfahren von Dünnschicht-Halbleiterbauelementen |
NL1012961C2 (nl) * | 1999-09-02 | 2001-03-05 | Stichting Energie | Werkwijze voor het vervaardigen van een halfgeleiderinrichting. |
KR100420030B1 (ko) * | 2001-04-23 | 2004-02-25 | 삼성에스디아이 주식회사 | 태양 전지의 제조 방법 |
GB0114896D0 (en) * | 2001-06-19 | 2001-08-08 | Bp Solar Ltd | Process for manufacturing a solar cell |
EP1378947A1 (de) | 2002-07-01 | 2004-01-07 | Interuniversitair Microelektronica Centrum Vzw | Ätzpaste für Halbleiter und Verwendung einer Ätzpaste zum lokalisierten Ätzen von Halbleitersubstraten |
JP4121928B2 (ja) | 2003-10-08 | 2008-07-23 | シャープ株式会社 | 太陽電池の製造方法 |
JP4232597B2 (ja) | 2003-10-10 | 2009-03-04 | 株式会社日立製作所 | シリコン太陽電池セルとその製造方法 |
JP2006073617A (ja) * | 2004-08-31 | 2006-03-16 | Sharp Corp | 太陽電池およびその製造方法 |
US7906722B2 (en) | 2005-04-19 | 2011-03-15 | Palo Alto Research Center Incorporated | Concentrating solar collector with solid optical element |
US7799371B2 (en) | 2005-11-17 | 2010-09-21 | Palo Alto Research Center Incorporated | Extruding/dispensing multiple materials to form high-aspect ratio extruded structures |
US7765949B2 (en) | 2005-11-17 | 2010-08-03 | Palo Alto Research Center Incorporated | Extrusion/dispensing systems and methods |
US20070107773A1 (en) | 2005-11-17 | 2007-05-17 | Palo Alto Research Center Incorporated | Bifacial cell with extruded gridline metallization |
WO2007059578A1 (en) | 2005-11-24 | 2007-05-31 | Newsouth Innovations Pty Limited | High efficiency solar cell fabrication |
US7820475B2 (en) * | 2005-12-21 | 2010-10-26 | Sunpower Corporation | Back side contact solar cell structures and fabrication processes |
US7851693B2 (en) | 2006-05-05 | 2010-12-14 | Palo Alto Research Center Incorporated | Passively cooled solar concentrating photovoltaic device |
US8322025B2 (en) | 2006-11-01 | 2012-12-04 | Solarworld Innovations Gmbh | Apparatus for forming a plurality of high-aspect ratio gridline structures |
US7780812B2 (en) | 2006-11-01 | 2010-08-24 | Palo Alto Research Center Incorporated | Extrusion head with planarized edge surface |
US7922471B2 (en) | 2006-11-01 | 2011-04-12 | Palo Alto Research Center Incorporated | Extruded structure with equilibrium shape |
US8226391B2 (en) | 2006-11-01 | 2012-07-24 | Solarworld Innovations Gmbh | Micro-extrusion printhead nozzle with tapered cross-section |
US7638438B2 (en) | 2006-12-12 | 2009-12-29 | Palo Alto Research Center Incorporated | Solar cell fabrication using extrusion mask |
US7928015B2 (en) | 2006-12-12 | 2011-04-19 | Palo Alto Research Center Incorporated | Solar cell fabrication using extruded dopant-bearing materials |
EP2122691A4 (de) | 2007-02-16 | 2011-02-16 | Nanogram Corp | Solarzellenstrukturen, pv-module und entsprechende verfahren |
US7954449B2 (en) | 2007-05-08 | 2011-06-07 | Palo Alto Research Center Incorporated | Wiring-free, plumbing-free, cooled, vacuum chuck |
WO2009010585A2 (en) * | 2007-07-18 | 2009-01-22 | Interuniversitair Microelektronica Centrum Vzw | Method for producing an emitter structure and emitter structures resulting therefrom |
KR20100036344A (ko) * | 2007-07-26 | 2010-04-07 | 유니페어지태트 콘스탄츠 | 백-에칭된 이미터 및 대응하는 태양전지를 갖는 실리콘 태양전지의 제조방법 |
DE102007035068A1 (de) * | 2007-07-26 | 2009-01-29 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Fertigen einer Silizium-Solarzelle mit einem selektiven Emitter sowie entsprechende Solarzelle |
JP5236914B2 (ja) * | 2007-09-19 | 2013-07-17 | シャープ株式会社 | 太陽電池の製造方法 |
US8222516B2 (en) * | 2008-02-20 | 2012-07-17 | Sunpower Corporation | Front contact solar cell with formed emitter |
CN102105999A (zh) * | 2008-07-28 | 2011-06-22 | 达伊4能量有限公司 | 用低温精密回蚀和钝化过程制备的具有选择性发射极的晶体硅光伏电池 |
JP5344872B2 (ja) * | 2008-08-27 | 2013-11-20 | 三菱電機株式会社 | 光起電力装置 |
US7999175B2 (en) | 2008-09-09 | 2011-08-16 | Palo Alto Research Center Incorporated | Interdigitated back contact silicon solar cells with laser ablated grooves |
US8117983B2 (en) | 2008-11-07 | 2012-02-21 | Solarworld Innovations Gmbh | Directional extruded bead control |
US9150966B2 (en) | 2008-11-14 | 2015-10-06 | Palo Alto Research Center Incorporated | Solar cell metallization using inline electroless plating |
US8080729B2 (en) | 2008-11-24 | 2011-12-20 | Palo Alto Research Center Incorporated | Melt planarization of solar cell bus bars |
US8960120B2 (en) | 2008-12-09 | 2015-02-24 | Palo Alto Research Center Incorporated | Micro-extrusion printhead with nozzle valves |
JP5029921B2 (ja) * | 2009-01-19 | 2012-09-19 | シャープ株式会社 | 太陽電池セルの製造方法 |
DE102009018653B4 (de) * | 2009-03-04 | 2015-12-03 | SolarWorld Industries Thüringen GmbH | Verfahren zur Herstellung von Halbleiterbauelementen unter Nutzung von Dotierungstechniken |
DE102009041546A1 (de) | 2009-03-27 | 2010-10-14 | Bosch Solar Energy Ag | Verfahren zur Herstellung von Solarzellen mit selektivem Emitter |
KR101597825B1 (ko) * | 2009-07-24 | 2016-02-25 | 엘지전자 주식회사 | 태양전지, 태양전지의 제조방법 및 열확산용 열처리 장치 |
NL2003324C2 (en) * | 2009-07-31 | 2011-02-02 | Otb Solar Bv | Photovoltaic cell with a selective emitter and method for making the same. |
KR101611456B1 (ko) * | 2009-09-02 | 2016-04-11 | 엘지이노텍 주식회사 | 인계 분산제를 포함하는 전극 형성용 페이스트 조성물 |
US8735234B2 (en) | 2010-02-18 | 2014-05-27 | Varian Semiconductor Equipment Associates, Inc. | Self-aligned ion implantation for IBC solar cells |
WO2011110231A1 (en) * | 2010-03-12 | 2011-09-15 | Q-Cells Se | Method and in-line production system for the production of solar cells |
KR101046219B1 (ko) * | 2010-04-02 | 2011-07-04 | 엘지전자 주식회사 | 선택적 에미터를 갖는 태양전지 |
CN101866984B (zh) * | 2010-05-18 | 2015-01-07 | 常州亿晶光电科技有限公司 | 对晶体硅电池片表面选择性掺杂制发射级的方法 |
JP5734734B2 (ja) * | 2010-05-18 | 2015-06-17 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 半導体上に電流トラックを形成する方法 |
CN101866971A (zh) * | 2010-05-18 | 2010-10-20 | 常州亿晶光电科技有限公司 | 具有选择性发射级太阳能电池片 |
DE102010024308A1 (de) * | 2010-06-18 | 2011-12-22 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Erzeugung einer selektiven Dotierstruktur in einem Halbleitersubstrat zur Herstellung einer photovoltaischen Solarzelle |
JP5538103B2 (ja) * | 2010-07-07 | 2014-07-02 | 三菱電機株式会社 | 太陽電池セルの製造方法 |
US20110139231A1 (en) * | 2010-08-25 | 2011-06-16 | Daniel Meier | Back junction solar cell with selective front surface field |
KR101733055B1 (ko) * | 2010-09-06 | 2017-05-24 | 엘지전자 주식회사 | 태양 전지 모듈 |
CN102468364A (zh) * | 2010-11-05 | 2012-05-23 | 无锡尚德太阳能电力有限公司 | 一种选择性发射极太阳电池及其制作方法 |
EP2642527A4 (de) * | 2010-11-17 | 2017-10-18 | Hitachi Chemical Company, Ltd. | Verfahren zur herstellung von photovoltaikzellen |
CN102110721A (zh) * | 2010-12-17 | 2011-06-29 | 福建省上杭县九洲硅业有限公司 | 晶体硅太阳能电池的梯度型背表面场及其制备方法 |
CN102082210A (zh) * | 2010-12-18 | 2011-06-01 | 广东爱康太阳能科技有限公司 | 制造细栅选择性发射极晶硅太阳电池的方法 |
KR101114198B1 (ko) | 2010-12-31 | 2012-03-13 | 현대중공업 주식회사 | 국부화 에미터 태양전지 및 그 제조 방법 |
KR101198438B1 (ko) | 2010-12-31 | 2012-11-06 | 현대중공업 주식회사 | 양면 수광형 국부화 에미터 태양전지 및 그 제조 방법 |
DE102011002748A1 (de) | 2011-01-17 | 2012-07-19 | Robert Bosch Gmbh | Verfahren zur Herstellung einer Silizium-Solarzelle |
US8962424B2 (en) | 2011-03-03 | 2015-02-24 | Palo Alto Research Center Incorporated | N-type silicon solar cell with contact/protection structures |
KR101071546B1 (ko) | 2011-04-26 | 2011-10-10 | 주식회사 톱텍 | 태양전지 제조방법 및 이를 통해 제조된 태양전지 |
DE102011051040A1 (de) * | 2011-06-14 | 2012-12-20 | Solarworld Innovations Gmbh | Verfahren zum Herstellen einer Solarzelle und Verfahren zum Herstellen einer Metallisierungsstruktur |
CN102306684B (zh) * | 2011-09-19 | 2016-01-20 | 苏州旭环光伏科技有限公司 | 一种三级掺杂水平的选择性发射极及其制备方法 |
TWI424584B (zh) * | 2011-11-30 | 2014-01-21 | Au Optronics Corp | 製作太陽能電池之方法 |
US20130199604A1 (en) * | 2012-02-06 | 2013-08-08 | Silicon Solar Solutions | Solar cells and methods of fabrication thereof |
US8895325B2 (en) * | 2012-04-27 | 2014-11-25 | Varian Semiconductor Equipment Associates, Inc. | System and method for aligning substrates for multiple implants |
KR102039611B1 (ko) * | 2012-05-22 | 2019-11-01 | 주성엔지니어링(주) | 기판형 태양 전지 및 그의 제조 방법, 기판형 태양 전지의 도핑 방법 및 장치 |
CN102856436A (zh) * | 2012-09-05 | 2013-01-02 | 友达光电股份有限公司 | 太阳能电池及其制作方法 |
JP6379461B2 (ja) * | 2013-09-02 | 2018-08-29 | 日立化成株式会社 | p型拡散層を有するシリコン基板の製造方法、太陽電池素子の製造方法及び太陽電池素子 |
US9960287B2 (en) | 2014-02-11 | 2018-05-01 | Picasolar, Inc. | Solar cells and methods of fabrication thereof |
JP6661891B2 (ja) * | 2015-05-07 | 2020-03-11 | 日立化成株式会社 | 太陽電池素子の製造方法及び太陽電池素子 |
JP6270889B2 (ja) * | 2016-03-16 | 2018-01-31 | 三菱電機株式会社 | 太陽電池の製造方法 |
KR102045989B1 (ko) | 2018-03-14 | 2019-11-18 | 한국과학기술연구원 | 상호 확산을 사용한 반도체 소자 및 이를 제조하는 방법 |
WO2019206679A1 (en) | 2018-04-24 | 2019-10-31 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement | Passivated layer stack for a light harvesting device |
CN113675289B (zh) * | 2021-10-22 | 2022-03-01 | 浙江晶科能源有限公司 | 光伏电池及其制备方法、光伏组件 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2238251B1 (de) * | 1973-07-03 | 1977-09-16 | Telecommunications Sa | |
US4152824A (en) * | 1977-12-30 | 1979-05-08 | Mobil Tyco Solar Energy Corporation | Manufacture of solar cells |
US4478879A (en) * | 1983-02-10 | 1984-10-23 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Screen printed interdigitated back contact solar cell |
DE4217428A1 (de) * | 1991-12-09 | 1993-06-17 | Deutsche Aerospace | Hochleistungs-solarzellenstruktur |
DE4401782C2 (de) * | 1994-01-21 | 2001-08-02 | Angew Solarenergie Ase Gmbh | Verfahren zur Herstellung eines lokal flachen Emitters zwischen den Kontaktfingern einer Solarzelle |
JP3032422B2 (ja) * | 1994-04-28 | 2000-04-17 | シャープ株式会社 | 太陽電池セルとその製造方法 |
-
1996
- 1996-12-24 EP EP96120865A patent/EP0851511A1/de not_active Withdrawn
-
1997
- 1997-12-22 WO PCT/EP1997/007246 patent/WO1998028798A1/en active IP Right Grant
- 1997-12-22 DK DK97954669T patent/DK0960443T3/da active
- 1997-12-22 DE DE69731485T patent/DE69731485T2/de not_active Expired - Lifetime
- 1997-12-22 CA CA002276008A patent/CA2276008C/en not_active Expired - Fee Related
- 1997-12-22 EP EP97954669A patent/EP0960443B1/de not_active Expired - Lifetime
- 1997-12-22 CN CNB971808910A patent/CN1155104C/zh not_active Expired - Lifetime
- 1997-12-22 AU AU59555/98A patent/AU741153B2/en not_active Ceased
- 1997-12-22 ES ES97954669T patent/ES2232887T3/es not_active Expired - Lifetime
- 1997-12-22 JP JP52840198A patent/JP3999820B2/ja not_active Expired - Lifetime
- 1997-12-22 AT AT97954669T patent/ATE281698T1/de active
-
2007
- 2007-05-25 JP JP2007139083A patent/JP2007235174A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CA2276008A1 (en) | 1998-07-02 |
JP2002503390A (ja) | 2002-01-29 |
EP0960443A1 (de) | 1999-12-01 |
EP0851511A1 (de) | 1998-07-01 |
DK0960443T3 (da) | 2005-03-14 |
JP2007235174A (ja) | 2007-09-13 |
AU5955598A (en) | 1998-07-17 |
CA2276008C (en) | 2005-03-22 |
EP0960443B1 (de) | 2004-11-03 |
DE69731485T2 (de) | 2005-10-27 |
CN1155104C (zh) | 2004-06-23 |
ATE281698T1 (de) | 2004-11-15 |
CN1241298A (zh) | 2000-01-12 |
ES2232887T3 (es) | 2005-06-01 |
AU741153B2 (en) | 2001-11-22 |
JP3999820B2 (ja) | 2007-10-31 |
WO1998028798A1 (en) | 1998-07-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69731485D1 (de) | Halbleitervorrichtung mit selektiv diffundierten bereichen | |
KR960035794A (ko) | 엔모스(nmos) 집적회로장치에서 서브문턱전류를 감소시키는 큰 경사각도 붕소 이온주입 방법 | |
KR920017245A (ko) | 반도체장치와 그의 제조방법 | |
KR900001000A (ko) | 단일 폴리실리콘 자기-정합 트랜지스터 및 이의 제조 방법 | |
WO1999056324A3 (de) | Verfahren zur herstellung von kontaktstrukturen in solarzellen | |
TW369683B (en) | A method for forming a semiconductor device having a shallow junction and a low sheet resistance | |
KR970077166A (ko) | 반도체 기판에 삼중웰을 형성하는 방법 | |
EP0341461B1 (de) | Verfahren zur Herstellung einer bipolaren integrierten Schaltung | |
TW334641B (en) | Method of manufacturing semiconductor device | |
KR100370784B1 (ko) | 반도체 소자의 제조방법 | |
KR910005458A (ko) | 반도체장비의 제조방법 | |
EP0042040B1 (de) | Verfahren zur Herstellung eines Feldeffekttransistors mit isoliertem Gate in einem Körper aus Silizium | |
DE69926002D1 (de) | Herstellungsverfahren für eine Diode zur Integration mit einem Halbleiterbauelement und Herstellungsverfahren für ein Transistor-Bauelement mit einer integrierten Diode | |
TW302539B (en) | Manufacturing method of deep submicron PMOS device shallow junction | |
KR970017994A (ko) | 다수의 마이크로 전자 회로를 soi상에 제작하기 위한 방법 | |
KR970051950A (ko) | 반도체장치의 고저항 영역 형성방법 | |
KR900019257A (ko) | 쌍극 범프 트랜지스터와 그 트랜지스터 제조 방법 | |
TW373270B (en) | Method for forming impurity junction regions of semiconductor device | |
KR960026148A (ko) | 반도체소자 제조방법 | |
KR970008571A (ko) | 모스 전계 효과 트랜지스터 및 그 제조방법 | |
KR970052787A (ko) | 금속배선간 절연막 형성방법 | |
KR960026753A (ko) | 트윈(twin) 웰 제조방법 | |
HK1003548A1 (en) | Semiconductor device and method of manufacturing the same | |
KR970063479A (ko) | 반도체 장치의 이온 주입 방법 | |
KR960026948A (ko) | 모스펫 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |