KR920017245A - 반도체장치와 그의 제조방법 - Google Patents
반도체장치와 그의 제조방법 Download PDFInfo
- Publication number
- KR920017245A KR920017245A KR1019920001286A KR920001286A KR920017245A KR 920017245 A KR920017245 A KR 920017245A KR 1019920001286 A KR1019920001286 A KR 1019920001286A KR 920001286 A KR920001286 A KR 920001286A KR 920017245 A KR920017245 A KR 920017245A
- Authority
- KR
- South Korea
- Prior art keywords
- source
- gate electrode
- semiconductor substrate
- substrate
- offset step
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000004065 semiconductor Substances 0.000 title claims 9
- 239000000758 substrate Substances 0.000 claims 8
- 239000012535 impurity Substances 0.000 claims 5
- 150000002500 ions Chemical class 0.000 claims 3
- 238000009792 diffusion process Methods 0.000 claims 2
- 238000002513 implantation Methods 0.000 claims 1
- 238000005468 ion implantation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/08—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements
- G11C17/10—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements in which contents are determined during manufacturing by a predetermined arrangement of coupling elements, e.g. mask-programmable ROM
- G11C17/12—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements in which contents are determined during manufacturing by a predetermined arrangement of coupling elements, e.g. mask-programmable ROM using field-effect devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B20/00—Read-only memory [ROM] devices
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예에 의한 장치제조공정의 제1스텝을 표시하는 약도, 제2도는 본 발명의 실시예에 의한 장치제조공정의 제2스텝을 표시하는 약도.
Claims (5)
- 반도체기판, 그 기판상에 형성되는 게이트전극과, 그 기판에 제공되는 한쌍의 소스/드레인영역과, 그리고 적어도 하나의 소스/드레인영역에 형성되고 그리고 게이트전극 근접에서 기판으로 아래쪽으로 늘어나는 오프세트 스텝부분을 포함하는 반도체장치.
- 제1항에 있어서, 상기 오프세트 스텝부분의 깊이는 소스/드레인 영역을 형성하는 불순물확산이 상기 반도체기판에 확산될 수 있는 깊이보다 더 작게되게 프리세트되는 반도체장치.
- (Ⅰ)정보-기록영역을 제공하는 게이트전극을 가지는 반도체 기판상에 레지스트패턴을 형성하고, (Ⅱ)마스크로서 게이트전극과 레지스트패턴의 사용으로, 형성되는 적어도 하나의 소스/드레인영역에서 반도체 기판에 아래쪽으로 차단하여 게이트전극의 인근에 오프세트 스텝부분을 형성하고, 그리고 (Ⅲ)레지스트패턴을 제거하고 그리고나서 한쌍의 소스/드레인영역을 형성하도록 마스크로서 게이트전극의 사용으로 형성되는 소스/드레인영역에 불순물이온을 주입하는 스텝을 포함하고, 그것에 의해 적어도 하나의 소스/드레인영역은 전극 인근 장소에 오프세트 스텝부분을 가지는 반도체장치 제조방법.
- 제3항에 있어서, 불순물이온 주입은 불순물이온이 반도체기판에 대하여서 정상에 따라 주입되는 0°-각 주입에 따라서 실행되는 반도체장치 제조방법.
- 제3항에 있어서, 오프세트 스텝부분은 소스/드레인영역을 형성하는 불순물 이온확산의 그것보다 더 작은 깊이를 가지게 만들어지는 반도체장치 제조방법.※참고사항:최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3017788A JP2612969B2 (ja) | 1991-02-08 | 1991-02-08 | 半導体装置の製造方法 |
JP91-017788 | 1991-02-08 | ||
JP91-17788 | 1991-02-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920017245A true KR920017245A (ko) | 1992-09-26 |
KR960000716B1 KR960000716B1 (ko) | 1996-01-11 |
Family
ID=11953459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920001286A KR960000716B1 (ko) | 1991-02-08 | 1992-01-29 | 반도체장치와 그의 제조방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5214303A (ko) |
JP (1) | JP2612969B2 (ko) |
KR (1) | KR960000716B1 (ko) |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2622425B2 (ja) * | 1990-11-20 | 1997-06-18 | シャープ株式会社 | 半導体装置の製造方法 |
JPH05283654A (ja) * | 1992-04-03 | 1993-10-29 | Toshiba Corp | マスクromとその製造方法 |
JP2927161B2 (ja) * | 1993-10-25 | 1999-07-28 | ヤマハ株式会社 | 半導体メモリとその製法 |
JPH07273224A (ja) * | 1994-03-29 | 1995-10-20 | Sharp Corp | 半導体装置の製造方法 |
US5831312A (en) * | 1996-04-09 | 1998-11-03 | United Microelectronics Corporation | Electrostic discharge protection device comprising a plurality of trenches |
US5652162A (en) * | 1996-06-13 | 1997-07-29 | Taiwan Semiconductor Manufacturing, Company Ltd. | Method for fabricating flat ROM devices using memory array cells with concave channels |
US5949711A (en) * | 1996-09-26 | 1999-09-07 | Waferscale Integration, Inc. | Dual bit memory cell |
TW381325B (en) * | 1997-04-15 | 2000-02-01 | United Microelectronics Corp | Three dimensional high density deep trench ROM and the manufacturing method thereof |
IL125604A (en) | 1997-07-30 | 2004-03-28 | Saifun Semiconductors Ltd | Non-volatile electrically erasable and programmble semiconductor memory cell utilizing asymmetrical charge |
US6768165B1 (en) | 1997-08-01 | 2004-07-27 | Saifun Semiconductors Ltd. | Two bit non-volatile electrically erasable and programmable semiconductor memory cell utilizing asymmetrical charge trapping |
US6430077B1 (en) | 1997-12-12 | 2002-08-06 | Saifun Semiconductors Ltd. | Method for regulating read voltage level at the drain of a cell in a symmetric array |
US6633496B2 (en) | 1997-12-12 | 2003-10-14 | Saifun Semiconductors Ltd. | Symmetric architecture for memory cells having widely spread metal bit lines |
US6633499B1 (en) | 1997-12-12 | 2003-10-14 | Saifun Semiconductors Ltd. | Method for reducing voltage drops in symmetric array architectures |
US6030871A (en) * | 1998-05-05 | 2000-02-29 | Saifun Semiconductors Ltd. | Process for producing two bit ROM cell utilizing angled implant |
US6348711B1 (en) | 1998-05-20 | 2002-02-19 | Saifun Semiconductors Ltd. | NROM cell with self-aligned programming and erasure areas |
US6215148B1 (en) | 1998-05-20 | 2001-04-10 | Saifun Semiconductors Ltd. | NROM cell with improved programming, erasing and cycling |
EP0977258B9 (en) * | 1998-07-29 | 2005-07-27 | Macronix International Co., Ltd. | Process and integrated circuit for a multilevel memory cell |
US6429063B1 (en) | 1999-10-26 | 2002-08-06 | Saifun Semiconductors Ltd. | NROM cell with generally decoupled primary and secondary injection |
US6928001B2 (en) * | 2000-12-07 | 2005-08-09 | Saifun Semiconductors Ltd. | Programming and erasing methods for a non-volatile memory cell |
US6490204B2 (en) | 2000-05-04 | 2002-12-03 | Saifun Semiconductors Ltd. | Programming and erasing methods for a reference cell of an NROM array |
US6396741B1 (en) * | 2000-05-04 | 2002-05-28 | Saifun Semiconductors Ltd. | Programming of nonvolatile memory cells |
JP3506668B2 (ja) | 2000-11-17 | 2004-03-15 | 沖電気工業株式会社 | 読み出し専用不揮発性メモリの製造方法 |
US6614692B2 (en) | 2001-01-18 | 2003-09-02 | Saifun Semiconductors Ltd. | EEPROM array and method for operation thereof |
US6677805B2 (en) | 2001-04-05 | 2004-01-13 | Saifun Semiconductors Ltd. | Charge pump stage with body effect minimization |
US6584017B2 (en) | 2001-04-05 | 2003-06-24 | Saifun Semiconductors Ltd. | Method for programming a reference cell |
US6636440B2 (en) | 2001-04-25 | 2003-10-21 | Saifun Semiconductors Ltd. | Method for operation of an EEPROM array, including refresh thereof |
JP2003092365A (ja) | 2001-09-18 | 2003-03-28 | Oki Electric Ind Co Ltd | 読み出し専用不揮発性メモリ |
US6791396B2 (en) | 2001-10-24 | 2004-09-14 | Saifun Semiconductors Ltd. | Stack element circuit |
US6643181B2 (en) | 2001-10-24 | 2003-11-04 | Saifun Semiconductors Ltd. | Method for erasing a memory cell |
US7098107B2 (en) * | 2001-11-19 | 2006-08-29 | Saifun Semiconductor Ltd. | Protective layer in memory device and method therefor |
US6885585B2 (en) * | 2001-12-20 | 2005-04-26 | Saifun Semiconductors Ltd. | NROM NOR array |
US6583007B1 (en) | 2001-12-20 | 2003-06-24 | Saifun Semiconductors Ltd. | Reducing secondary injection effects |
US6700818B2 (en) | 2002-01-31 | 2004-03-02 | Saifun Semiconductors Ltd. | Method for operating a memory device |
US6914820B1 (en) | 2002-05-06 | 2005-07-05 | Multi Level Memory Technology | Erasing storage nodes in a bi-directional nonvolatile memory cell |
US7221591B1 (en) | 2002-05-06 | 2007-05-22 | Samsung Electronics Co., Ltd. | Fabricating bi-directional nonvolatile memory cells |
US6747896B2 (en) | 2002-05-06 | 2004-06-08 | Multi Level Memory Technology | Bi-directional floating gate nonvolatile memory |
US6917544B2 (en) | 2002-07-10 | 2005-07-12 | Saifun Semiconductors Ltd. | Multiple use memory chip |
US6826107B2 (en) * | 2002-08-01 | 2004-11-30 | Saifun Semiconductors Ltd. | High voltage insertion in flash memory cards |
US7136304B2 (en) | 2002-10-29 | 2006-11-14 | Saifun Semiconductor Ltd | Method, system and circuit for programming a non-volatile memory array |
US7178004B2 (en) | 2003-01-31 | 2007-02-13 | Yan Polansky | Memory array programming circuit and a method for using the circuit |
US7142464B2 (en) * | 2003-04-29 | 2006-11-28 | Saifun Semiconductors Ltd. | Apparatus and methods for multi-level sensing in a memory array |
US7123532B2 (en) | 2003-09-16 | 2006-10-17 | Saifun Semiconductors Ltd. | Operating array cells with matched reference cells |
US7317633B2 (en) | 2004-07-06 | 2008-01-08 | Saifun Semiconductors Ltd | Protection of NROM devices from charge damage |
US7095655B2 (en) | 2004-08-12 | 2006-08-22 | Saifun Semiconductors Ltd. | Dynamic matching of signal path and reference path for sensing |
US7638850B2 (en) | 2004-10-14 | 2009-12-29 | Saifun Semiconductors Ltd. | Non-volatile memory structure and method of fabrication |
US7535765B2 (en) | 2004-12-09 | 2009-05-19 | Saifun Semiconductors Ltd. | Non-volatile memory device and method for reading cells |
EP1684308A1 (en) | 2005-01-19 | 2006-07-26 | Saifun Semiconductors Ltd. | Methods for preventing fixed pattern programming |
US8053812B2 (en) | 2005-03-17 | 2011-11-08 | Spansion Israel Ltd | Contact in planar NROM technology |
US7804126B2 (en) | 2005-07-18 | 2010-09-28 | Saifun Semiconductors Ltd. | Dense non-volatile memory array and method of fabrication |
US7668017B2 (en) | 2005-08-17 | 2010-02-23 | Saifun Semiconductors Ltd. | Method of erasing non-volatile memory cells |
US7221138B2 (en) | 2005-09-27 | 2007-05-22 | Saifun Semiconductors Ltd | Method and apparatus for measuring charge pump output current |
US20070087503A1 (en) * | 2005-10-17 | 2007-04-19 | Saifun Semiconductors, Ltd. | Improving NROM device characteristics using adjusted gate work function |
US7352627B2 (en) | 2006-01-03 | 2008-04-01 | Saifon Semiconductors Ltd. | Method, system, and circuit for operating a non-volatile memory array |
US7808818B2 (en) | 2006-01-12 | 2010-10-05 | Saifun Semiconductors Ltd. | Secondary injection for NROM |
US7760554B2 (en) | 2006-02-21 | 2010-07-20 | Saifun Semiconductors Ltd. | NROM non-volatile memory and mode of operation |
US8253452B2 (en) | 2006-02-21 | 2012-08-28 | Spansion Israel Ltd | Circuit and method for powering up an integrated circuit and an integrated circuit utilizing same |
US7692961B2 (en) | 2006-02-21 | 2010-04-06 | Saifun Semiconductors Ltd. | Method, circuit and device for disturb-control of programming nonvolatile memory cells by hot-hole injection (HHI) and by channel hot-electron (CHE) injection |
US7638835B2 (en) | 2006-02-28 | 2009-12-29 | Saifun Semiconductors Ltd. | Double density NROM with nitride strips (DDNS) |
US7701779B2 (en) | 2006-04-27 | 2010-04-20 | Sajfun Semiconductors Ltd. | Method for programming a reference cell |
US7605579B2 (en) | 2006-09-18 | 2009-10-20 | Saifun Semiconductors Ltd. | Measuring and controlling current consumption and output current of charge pumps |
EP2820403B1 (en) | 2012-02-28 | 2020-04-08 | Ramot at Tel-Aviv University Ltd. | Molecular sensor based on virtual buried nanowire |
JP2018125518A (ja) * | 2017-02-03 | 2018-08-09 | ソニーセミコンダクタソリューションズ株式会社 | トランジスタ、製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4380866A (en) * | 1981-05-04 | 1983-04-26 | Motorola, Inc. | Method of programming ROM by offset masking of selected gates |
JPS6390853A (ja) * | 1986-10-06 | 1988-04-21 | Hitachi Ltd | 半導体装置 |
US4964080A (en) * | 1990-03-09 | 1990-10-16 | Intel Corporation | Three-dimensional memory cell with integral select transistor |
-
1991
- 1991-02-08 JP JP3017788A patent/JP2612969B2/ja not_active Expired - Fee Related
-
1992
- 1992-01-28 US US07/826,998 patent/US5214303A/en not_active Expired - Lifetime
- 1992-01-29 KR KR1019920001286A patent/KR960000716B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2612969B2 (ja) | 1997-05-21 |
KR960000716B1 (ko) | 1996-01-11 |
US5214303A (en) | 1993-05-25 |
JPH04256360A (ja) | 1992-09-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR920017245A (ko) | 반도체장치와 그의 제조방법 | |
KR870000763A (ko) | 반도체 장치 및 그 제조방법 | |
KR860700315A (ko) | 반도체 장치의 제조방법 | |
KR890003028A (ko) | 고저항 다결정 실리콘의 제조방법 | |
KR970077166A (ko) | 반도체 기판에 삼중웰을 형성하는 방법 | |
KR890011027A (ko) | 반도체장치의 제조방법 | |
KR960026459A (ko) | 트랜지스터 제조방법 | |
KR930008961A (ko) | 반도체장치의 제조방법 | |
KR930001308A (ko) | 평행주사 이온 주입을 이용한 반도체 장치의 제조방법 | |
KR960026554A (ko) | 반도체소자 제조방법 | |
KR960009015A (ko) | 반도체 소자의 게이트 전극 형성방법 | |
KR950012717A (ko) | 반도체 소자 제조 방법 | |
KR960026948A (ko) | 모스펫 제조방법 | |
KR950010126A (ko) | 반도체 소자의 소오스/드레인 접합부 형성방법 | |
KR910015072A (ko) | Mos 전계효과 트랜지스터 및 그 제조방법 | |
KR920007165A (ko) | Cmos소자 제조방법 | |
KR970054250A (ko) | 마스크 롬의 제조방법 | |
KR910019256A (ko) | 앤-채널 트랜지스터 제조방법 | |
KR970054208A (ko) | 마스크 롬의 제조방법 | |
KR960009066A (ko) | 반도체 소자의 트랜지스터 제조방법 | |
KR920010769A (ko) | 국부적 질소이온 주입을 이용한 모스 트랜지스터 제조방법 | |
KR910019204A (ko) | 슬롭형 게이트를 이용한 ldd제조방법 | |
KR980006408A (ko) | 마스크 롬의 제조방법 | |
KR970054354A (ko) | 바이폴라 접합 트랜지스터 및 그 제조방법 | |
KR920020643A (ko) | Di-ldd 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20060110 Year of fee payment: 11 |
|
LAPS | Lapse due to unpaid annual fee |