DE69722498D1 - Basismaterial für Klebeband - Google Patents

Basismaterial für Klebeband

Info

Publication number
DE69722498D1
DE69722498D1 DE69722498T DE69722498T DE69722498D1 DE 69722498 D1 DE69722498 D1 DE 69722498D1 DE 69722498 T DE69722498 T DE 69722498T DE 69722498 T DE69722498 T DE 69722498T DE 69722498 D1 DE69722498 D1 DE 69722498D1
Authority
DE
Germany
Prior art keywords
base material
adhesive tape
tape
adhesive
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69722498T
Other languages
English (en)
Other versions
DE69722498T2 (de
Inventor
Kouichi Nagamoto
Mikio Komiyama
Kazuyoshi Ebe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of DE69722498D1 publication Critical patent/DE69722498D1/de
Application granted granted Critical
Publication of DE69722498T2 publication Critical patent/DE69722498T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C09J2475/006—Presence of polyurethane in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2861—Adhesive compositions having readily strippable combined with readily readhearable properties [e.g., stick-ons, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31573—Next to addition polymer of ethylenically unsaturated monomer
    • Y10T428/31576—Ester monomer type [polyvinylacetate, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
  • Jigs For Machine Tools (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE69722498T 1996-03-15 1997-03-14 Basismaterial für Klebeband Expired - Lifetime DE69722498T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5965196A JP3177149B2 (ja) 1996-03-15 1996-03-15 粘着テープ用基材、該基材を用いた粘着テープ、および該基材の製造方法
JP5965196 1996-03-15

Publications (2)

Publication Number Publication Date
DE69722498D1 true DE69722498D1 (de) 2003-07-10
DE69722498T2 DE69722498T2 (de) 2004-05-06

Family

ID=13119328

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69722498T Expired - Lifetime DE69722498T2 (de) 1996-03-15 1997-03-14 Basismaterial für Klebeband

Country Status (7)

Country Link
US (1) US6139953A (de)
EP (1) EP0798355B1 (de)
JP (1) JP3177149B2 (de)
KR (1) KR100489844B1 (de)
DE (1) DE69722498T2 (de)
SG (1) SG70000A1 (de)
TW (1) TW360904B (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10337823A (ja) * 1997-04-11 1998-12-22 Lintec Corp 基材および該基材を用いた粘着テープ
US5972152A (en) * 1997-05-16 1999-10-26 Micron Communications, Inc. Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier
JP3739570B2 (ja) 1998-06-02 2006-01-25 リンテック株式会社 粘着シートおよびその利用方法
JP3784202B2 (ja) * 1998-08-26 2006-06-07 リンテック株式会社 両面粘着シートおよびその使用方法
JP3383227B2 (ja) * 1998-11-06 2003-03-04 リンテック株式会社 半導体ウエハの裏面研削方法
JP2002141306A (ja) * 2000-11-02 2002-05-17 Lintec Corp ダイシングシート
JP2003096140A (ja) * 2001-09-20 2003-04-03 Nitto Denko Corp 複合フィルムおよび粘着シート
US7018268B2 (en) * 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing
KR101016081B1 (ko) * 2002-07-26 2011-02-17 닛토덴코 가부시키가이샤 점착 시트와 그의 제조방법, 상기 점착 시트의 사용방법,및 상기 점착 시트에 사용되는 다층 시트와 그의 제조방법
US20080193728A1 (en) * 2002-07-26 2008-08-14 Nitto Denko Corporation Pressure-sensitive adhesive sheet, method for producing the same and method for using the same as well as a multi-layer sheet for use in the pressure-sensitive adhesive sheet and method for producing the same
US20050153129A1 (en) * 2002-07-26 2005-07-14 Nitto Denko Corporation Pressure-sensitive adhesive sheet, method for producing the same and method for using the same as well as a multi-layer sheet for use in the pressure-sensitive adhesive sheet and method for producing the same
TWI310230B (en) * 2003-01-22 2009-05-21 Lintec Corp Adhesive sheet, method for protecting surface of semiconductor wafer and method for processing work
KR101067519B1 (ko) * 2003-03-17 2011-09-27 린텍 가부시키가이샤 표면보호용 점착시트 및 그 제조방법
JP4592535B2 (ja) 2005-02-23 2010-12-01 日東電工株式会社 多層シートとその製造方法及びこの多層シートを用いた粘着シート
JP4879702B2 (ja) * 2006-10-20 2012-02-22 リンテック株式会社 ダイソート用シートおよび接着剤層を有するチップの移送方法
KR101215157B1 (ko) 2006-12-05 2012-12-24 린텍 가부시키가이샤 레이저 다이싱 시트 및 칩 보디의 제조 방법
US8114520B2 (en) * 2006-12-05 2012-02-14 Lintec Corporation Laser dicing sheet and process for producing chip body
JP5059559B2 (ja) * 2006-12-05 2012-10-24 リンテック株式会社 レーザーダイシングシートおよびチップ体の製造方法
DE102007034877A1 (de) * 2007-07-24 2009-01-29 Schmid Rhyner Ag Verfahren und Vorrichtung zum Auftrag von Kunststoffbeschichtungen
TW200940671A (en) * 2007-12-28 2009-10-01 Du Pont Thermally and actinically curable adhesive composition
CN101970590A (zh) * 2007-12-28 2011-02-09 E.I.内穆尔杜邦公司 可光化固化的粘合剂组合物
TW200934662A (en) * 2007-12-28 2009-08-16 Du Pont Method for reworking adhesively bonded liquid crystal displays
JP5383069B2 (ja) * 2008-03-25 2014-01-08 グンゼ株式会社 バックグラインドフィルム及びその製造方法
JP5383070B2 (ja) * 2008-03-25 2014-01-08 グンゼ株式会社 バックグラインドフィルム及びその製造方法
JP5388465B2 (ja) * 2008-03-25 2014-01-15 グンゼ株式会社 バックグラインド用基体フィルム及びその製造方法
JP5388466B2 (ja) * 2008-03-25 2014-01-15 グンゼ株式会社 バックグラインド用基体フィルム及びその製造方法
JP6176432B2 (ja) * 2008-04-21 2017-08-09 エルジー・ケム・リミテッド 粘着フィルム及びこれを使用したバックグラインディング方法
US8419896B2 (en) * 2008-11-20 2013-04-16 E. I. Du Pont De Nemours And Company Semi-automated reworkability process for de-bonding a display
JP2012509514A (ja) * 2008-11-20 2012-04-19 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー ディスプレイを剥離するための半自動化再生設備
JP5625218B2 (ja) * 2009-05-13 2014-11-19 日東電工株式会社 複合フィルムおよびその製造方法
TWI507501B (zh) * 2009-06-15 2015-11-11 Lg Chemical Ltd 用於處理晶圓的薄片
US20120156483A1 (en) * 2009-08-28 2012-06-21 Nitto Denko Corporation Ashesive tape or sheet, and base material therefor
JP5068793B2 (ja) * 2009-09-24 2012-11-07 リンテック株式会社 粘着シート
EP2657310B1 (de) * 2011-01-27 2022-11-16 LG Energy Solution, Ltd. Quellband zum füllen von lücken
WO2014021450A1 (ja) * 2012-08-02 2014-02-06 リンテック株式会社 フィルム状接着剤、半導体接合用接着シート、および半導体装置の製造方法
WO2014028024A1 (en) 2012-08-16 2014-02-20 E. I. Du Pont De Nemours And Company Actinically curable adhesive composition and bonding method using same
WO2014033932A1 (ja) * 2012-08-31 2014-03-06 株式会社ダイセル 光学シート
GB2525848B (en) * 2014-04-09 2020-12-09 Huawei Tech Co Ltd Base station deployment
DE102014218117A1 (de) * 2014-09-10 2016-03-10 Krones Aktiengesellschaft Gebinde mit wenigstens zwei klebend aneinander haftenden Artikeln und beidseitig klebendes Haftelement zur Verwendung hierfür
JP6944758B2 (ja) * 2015-01-16 2021-10-06 日東電工株式会社 両面粘着シート

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5391942A (en) * 1977-01-22 1978-08-12 Koyo Sangyo Co Adhesive tape
JPS62153376A (ja) * 1985-12-27 1987-07-08 F S K Kk ウェハダイシング用粘着シート
JPS63153814A (ja) * 1986-07-09 1988-06-27 F S K Kk ウエハ貼着用粘着シ−ト
GB8621835D0 (en) * 1986-09-10 1986-10-15 Courtaulds Plc Urethane polymer films
JPH01240243A (ja) * 1988-03-18 1989-09-25 Tokuda Seisakusho Ltd 電極およびその製造方法
JP2572422B2 (ja) * 1988-04-18 1997-01-16 帝人株式会社 耐熱粘着テープ用フィルム
DE4121702A1 (de) * 1991-07-01 1993-01-07 Huels Chemische Werke Ag Teilkristalliner film und dessen verwendung
JPH05135405A (ja) * 1991-11-13 1993-06-01 Dainippon Ink & Chem Inc 光デイスク用紫外線硬化型樹脂組成物
JPH0616721A (ja) * 1992-07-02 1994-01-25 Nippon Kayaku Co Ltd 樹脂組成物、透過型スクリーン用紫外線硬化型樹脂組成物及びその硬化物
JP2862453B2 (ja) * 1993-03-17 1999-03-03 積水化学工業株式会社 両面粘着テープ及びその製造方法
JPH0744913A (ja) * 1993-07-26 1995-02-14 Canon Inc 光記録媒体用保護粘着シートおよびそれを用いた光記録媒体
JPH0740755U (ja) * 1993-12-27 1995-07-21 積水化学工業株式会社 粘着テープ
JP2851808B2 (ja) * 1995-01-30 1999-01-27 ロデール・ニッタ株式会社 研磨用ウエハ保持部材及びそのウエハ保持部材の定盤への装着方法

Also Published As

Publication number Publication date
SG70000A1 (en) 2000-01-25
KR970065676A (ko) 1997-10-13
JP3177149B2 (ja) 2001-06-18
TW360904B (en) 1999-06-11
EP0798355A3 (de) 1998-09-09
KR100489844B1 (ko) 2005-12-27
DE69722498T2 (de) 2004-05-06
JPH09253964A (ja) 1997-09-30
EP0798355A2 (de) 1997-10-01
US6139953A (en) 2000-10-31
EP0798355B1 (de) 2003-06-04

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