DE69325953T2 - Leistungshalbleitermodul - Google Patents

Leistungshalbleitermodul

Info

Publication number
DE69325953T2
DE69325953T2 DE69325953T DE69325953T DE69325953T2 DE 69325953 T2 DE69325953 T2 DE 69325953T2 DE 69325953 T DE69325953 T DE 69325953T DE 69325953 T DE69325953 T DE 69325953T DE 69325953 T2 DE69325953 T2 DE 69325953T2
Authority
DE
Germany
Prior art keywords
power semiconductor
semiconductor module
module
power
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69325953T
Other languages
English (en)
Other versions
DE69325953D1 (de
Inventor
Seiichi Oshima
Fumitaka C C Mitsubis Tametani
Jun C O Fukuryo Semic Yamagata
Ken C O Mitsubishi D Takanashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15661792&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69325953(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE69325953D1 publication Critical patent/DE69325953D1/de
Application granted granted Critical
Publication of DE69325953T2 publication Critical patent/DE69325953T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
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    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383Multilayer substrates
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    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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    • H05K2201/10007Types of components
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    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
DE69325953T 1992-06-17 1993-06-17 Leistungshalbleitermodul Expired - Lifetime DE69325953T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4157988A JP2854757B2 (ja) 1992-06-17 1992-06-17 半導体パワーモジュール

Publications (2)

Publication Number Publication Date
DE69325953D1 DE69325953D1 (de) 1999-09-16
DE69325953T2 true DE69325953T2 (de) 2000-01-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE69325953T Expired - Lifetime DE69325953T2 (de) 1992-06-17 1993-06-17 Leistungshalbleitermodul

Country Status (4)

Country Link
US (1) US5444297A (de)
EP (1) EP0575892B1 (de)
JP (1) JP2854757B2 (de)
DE (1) DE69325953T2 (de)

Cited By (4)

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DE69325953D1 (de) 1999-09-16
US5444297A (en) 1995-08-22
EP0575892B1 (de) 1999-08-11

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