DE69308482T2 - Vorrichtung zum Polieren von Halbleiterscheiben - Google Patents

Vorrichtung zum Polieren von Halbleiterscheiben

Info

Publication number
DE69308482T2
DE69308482T2 DE69308482T DE69308482T DE69308482T2 DE 69308482 T2 DE69308482 T2 DE 69308482T2 DE 69308482 T DE69308482 T DE 69308482T DE 69308482 T DE69308482 T DE 69308482T DE 69308482 T2 DE69308482 T2 DE 69308482T2
Authority
DE
Germany
Prior art keywords
semiconductor wafers
polishing semiconductor
polishing
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69308482T
Other languages
English (en)
Other versions
DE69308482D1 (de
Inventor
Yukio Tsutsumi
Shigeo Kumabe
Keisuke Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Silicon Corp
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Silicon Corp
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Silicon Corp, Mitsubishi Materials Corp filed Critical Mitsubishi Materials Silicon Corp
Publication of DE69308482D1 publication Critical patent/DE69308482D1/de
Application granted granted Critical
Publication of DE69308482T2 publication Critical patent/DE69308482T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
DE69308482T 1992-09-18 1993-08-10 Vorrichtung zum Polieren von Halbleiterscheiben Expired - Lifetime DE69308482T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25012592A JP2655975B2 (ja) 1992-09-18 1992-09-18 ウェーハ研磨装置

Publications (2)

Publication Number Publication Date
DE69308482D1 DE69308482D1 (de) 1997-04-10
DE69308482T2 true DE69308482T2 (de) 1997-07-31

Family

ID=17203199

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69308482T Expired - Lifetime DE69308482T2 (de) 1992-09-18 1993-08-10 Vorrichtung zum Polieren von Halbleiterscheiben

Country Status (5)

Country Link
US (1) US5618227A (de)
EP (1) EP0598190B1 (de)
JP (1) JP2655975B2 (de)
KR (1) KR100281173B1 (de)
DE (1) DE69308482T2 (de)

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US5885138A (en) 1993-09-21 1999-03-23 Ebara Corporation Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
JP3628307B2 (ja) * 1993-09-21 2005-03-09 株式会社東芝 ポリッシング装置及び方法
JPH0936198A (ja) 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
JP3169120B2 (ja) * 1995-07-21 2001-05-21 信越半導体株式会社 半導体鏡面ウェーハの製造方法
KR100487590B1 (ko) 1995-08-21 2005-08-04 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
JP2976862B2 (ja) * 1995-09-28 1999-11-10 日本電気株式会社 研磨装置
JPH09254027A (ja) * 1996-03-25 1997-09-30 Chiyoda Kk 研磨用マウンテン材
EP0805000A1 (de) * 1996-05-02 1997-11-05 MEMC Electronic Materials, Inc. Verfahren und Vorrichtung zum Reinigen und Trocknen einer Halbleiterscheibe nach dem Polieren
JP2000315665A (ja) 1999-04-29 2000-11-14 Ebara Corp 研磨方法及び装置
US6413156B1 (en) 1996-05-16 2002-07-02 Ebara Corporation Method and apparatus for polishing workpiece
JPH1022184A (ja) * 1996-06-28 1998-01-23 Sony Corp 基板張り合わせ装置
DE69718601T2 (de) * 1996-10-09 2003-11-27 Ebara Corp Vorrichtung zum Drehen und Polieren
TW374045B (en) * 1997-02-03 1999-11-11 Tokyo Electron Ltd Polishing apparatus, polishing member and polishing method
US6116994A (en) * 1997-04-11 2000-09-12 Ebara Corporation Polishing apparatus
DE19719503C2 (de) * 1997-05-07 2002-05-02 Wolters Peter Werkzeugmasch Vorrichtung zum chemisch-mechanischen Polieren von Oberflächen von Halbleiterwafern und Verfahren zum Betrieb der Vorrichtung
DE19722679A1 (de) * 1997-05-30 1998-12-03 Wacker Siltronic Halbleitermat Scheibenhalter und Verfahren zur Herstellung einer Halbleiterscheibe
US5899798A (en) * 1997-07-25 1999-05-04 Obsidian Inc. Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing
US5997388A (en) * 1997-08-11 1999-12-07 Micron Electronics, Inc. Apparatus for removing marks from integrated circuit devices
US5938508A (en) * 1997-08-11 1999-08-17 Micron Electronics, Inc. Method for removing marks from integrated circuit devices and devices so processed
US6213853B1 (en) 1997-09-10 2001-04-10 Speedfam-Ipec Corporation Integral machine for polishing, cleaning, rinsing and drying workpieces
US5888124A (en) * 1997-09-26 1999-03-30 Vanguard International Semiconductor Corporation Apparatus for polishing and cleaning a wafer
US5957764A (en) * 1997-11-05 1999-09-28 Aplex, Inc. Modular wafer polishing apparatus and method
US6062961A (en) * 1997-11-05 2000-05-16 Aplex, Inc. Wafer polishing head drive
US6142857A (en) * 1998-01-06 2000-11-07 Speedfam-Ipec Corporation Wafer polishing with improved backing arrangement
JP3467184B2 (ja) * 1998-02-05 2003-11-17 信越半導体株式会社 ワークの研磨方法
US6117778A (en) * 1998-02-11 2000-09-12 International Business Machines Corporation Semiconductor wafer edge bead removal method and tool
EP0956924A1 (de) * 1998-04-17 1999-11-17 OMD Officina Meccanica Domaso S.p.A. Werkzeughalter für eine Doppelspindelschleifmaschine
US6015499A (en) * 1998-04-17 2000-01-18 Parker-Hannifin Corporation Membrane-like filter element for chemical mechanical polishing slurries
JP3329288B2 (ja) * 1998-11-26 2002-09-30 信越半導体株式会社 半導体ウエーハおよびその製造方法
US6309279B1 (en) 1999-02-19 2001-10-30 Speedfam-Ipec Corporation Arrangements for wafer polishing
US6358128B1 (en) 1999-03-05 2002-03-19 Ebara Corporation Polishing apparatus
US6354922B1 (en) 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus
US6361422B1 (en) * 1999-06-15 2002-03-26 Applied Materials, Inc. Method and apparatus for transferring semiconductor substrates using an input module
US6184064B1 (en) 2000-01-12 2001-02-06 Micron Technology, Inc. Semiconductor die back side surface and method of fabrication
US6386947B2 (en) 2000-02-29 2002-05-14 Applied Materials, Inc. Method and apparatus for detecting wafer slipouts
JP3510177B2 (ja) * 2000-03-23 2004-03-22 株式会社東京精密 ウェハ研磨装置
US6478936B1 (en) * 2000-05-11 2002-11-12 Nutool Inc. Anode assembly for plating and planarizing a conductive layer
JP2001326201A (ja) * 2000-05-16 2001-11-22 Ebara Corp ポリッシング装置
US6645550B1 (en) * 2000-06-22 2003-11-11 Applied Materials, Inc. Method of treating a substrate
US6875076B2 (en) 2002-06-17 2005-04-05 Accretech Usa, Inc. Polishing machine and method
US6866560B1 (en) 2003-01-09 2005-03-15 Sandia Corporation Method for thinning specimen
US6879050B2 (en) * 2003-02-11 2005-04-12 Micron Technology, Inc. Packaged microelectronic devices and methods for packaging microelectronic devices
US7001827B2 (en) * 2003-04-15 2006-02-21 International Business Machines Corporation Semiconductor wafer front side protection
EP1626840A4 (de) * 2003-04-21 2008-09-03 Inopla Inc Vorrichtung und verfahren zum polieren von halbleiterwafern unter verwendung einer oder mehrerer polieroberflächen
JP2004358584A (ja) * 2003-06-03 2004-12-24 Fuji Spinning Co Ltd 研磨布及び研磨加工方法
JP4492054B2 (ja) * 2003-08-28 2010-06-30 株式会社Ｓｕｍｃｏ 剥離ウェーハの再生処理方法及び再生されたウェーハ
JP4467367B2 (ja) * 2004-06-22 2010-05-26 大日本スクリーン製造株式会社 基板反転装置、基板搬送装置、基板処理装置、基板反転方法、基板搬送方法および基板処理方法
JP4711904B2 (ja) * 2006-07-31 2011-06-29 日東電工株式会社 半導体ウエハへの粘着テープ貼付け方法および半導体ウエハからの保護テープ剥離方法
JP4589357B2 (ja) * 2007-04-16 2010-12-01 株式会社荏原製作所 ポリッシング装置
US20100200519A1 (en) * 2008-12-09 2010-08-12 E. I. Du Pont De Nemours And Company Filters for selective removal of large particles from particle slurries
CN102091994A (zh) * 2010-12-11 2011-06-15 昆明台兴精密机械有限责任公司 晶片单面抛光机主轴磨盘冷却装置
CN102049730B (zh) * 2010-12-29 2012-02-15 清华大学 一种用于化学机械抛光设备的晶圆交换装置
JP6276180B2 (ja) * 2011-08-11 2018-02-07 ケーエルエー−テンカー コーポレイション 高速回転チャックを有するシステムにおける空気流管理
CN107685275B (zh) * 2017-11-12 2023-06-06 肇庆学院 一种转盘式五工位抛光机
CN109277941B (zh) * 2018-09-30 2021-05-28 芜湖东旭光电装备技术有限公司 揭取装置

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DE246502C (de) *
US3292312A (en) * 1962-05-02 1966-12-20 James H Drury Method of abrading a workpiece
US3504457A (en) * 1966-07-05 1970-04-07 Geoscience Instr Corp Polishing apparatus
US3857123A (en) * 1970-10-21 1974-12-31 Monsanto Co Apparatus for waxless polishing of thin wafers
US4141180A (en) * 1977-09-21 1979-02-27 Kayex Corporation Polishing apparatus
US4270314A (en) * 1979-09-17 1981-06-02 Speedfam Corporation Bearing mount for lapping machine pressure plate
US4313284A (en) * 1980-03-27 1982-02-02 Monsanto Company Apparatus for improving flatness of polished wafers
JPS58171255A (ja) * 1982-03-29 1983-10-07 Toshiba Corp 両面鏡面研摩装置
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
US4918869A (en) * 1987-10-28 1990-04-24 Fujikoshi Machinery Corporation Method for lapping a wafer material and an apparatus therefor
US5036630A (en) * 1990-04-13 1991-08-06 International Business Machines Corporation Radial uniformity control of semiconductor wafer polishing
US5193316A (en) * 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
JP2753411B2 (ja) * 1991-11-11 1998-05-20 三菱マテリアル株式会社 ウェーハ接着装置およびウェーハ接着方法
US5498199A (en) * 1992-06-15 1996-03-12 Speedfam Corporation Wafer polishing method and apparatus
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus

Also Published As

Publication number Publication date
US5618227A (en) 1997-04-08
DE69308482D1 (de) 1997-04-10
KR100281173B1 (ko) 2001-03-02
JP2655975B2 (ja) 1997-09-24
KR940008007A (ko) 1994-04-28
EP0598190B1 (de) 1997-03-05
EP0598190A1 (de) 1994-05-25
JPH0699348A (ja) 1994-04-12

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