DE69031933D1 - Positiv arbeitende photoempfindliche Polyimidharzzusammensetzung - Google Patents

Positiv arbeitende photoempfindliche Polyimidharzzusammensetzung

Info

Publication number
DE69031933D1
DE69031933D1 DE69031933T DE69031933T DE69031933D1 DE 69031933 D1 DE69031933 D1 DE 69031933D1 DE 69031933 T DE69031933 T DE 69031933T DE 69031933 T DE69031933 T DE 69031933T DE 69031933 D1 DE69031933 D1 DE 69031933D1
Authority
DE
Germany
Prior art keywords
resin composition
polyimide resin
photosensitive polyimide
positive working
working photosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69031933T
Other languages
English (en)
Other versions
DE69031933T2 (de
Inventor
Masahiko Yukawa
Toyohiko Abe
Noriaki Kohtoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Publication of DE69031933D1 publication Critical patent/DE69031933D1/de
Application granted granted Critical
Publication of DE69031933T2 publication Critical patent/DE69031933T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE69031933T 1989-10-27 1990-10-25 Positiv arbeitende photoempfindliche Polyimidharzzusammensetzung Expired - Fee Related DE69031933T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28133789 1989-10-27

Publications (2)

Publication Number Publication Date
DE69031933D1 true DE69031933D1 (de) 1998-02-19
DE69031933T2 DE69031933T2 (de) 1998-05-14

Family

ID=17637702

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69031933T Expired - Fee Related DE69031933T2 (de) 1989-10-27 1990-10-25 Positiv arbeitende photoempfindliche Polyimidharzzusammensetzung

Country Status (4)

Country Link
EP (1) EP0424940B1 (de)
JP (1) JP2906637B2 (de)
KR (1) KR0148011B1 (de)
DE (1) DE69031933T2 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3321548B2 (ja) * 1996-06-17 2002-09-03 株式会社日立製作所 感光性ポリイミド前駆体組成物、およびそれを用いたパターン形成方法
WO1999019771A1 (fr) * 1997-10-13 1999-04-22 Pi R & D Co., Ltd. Composition de polyimide photosensible positive
JP4958355B2 (ja) * 1999-08-06 2012-06-20 株式会社ピーアイ技術研究所 ポリイミドの電着用組成物及びそれを用いたパターン化ポリイミド膜の作製方法
WO2001040873A1 (fr) * 1999-11-30 2001-06-07 Nissan Chemical Industries, Ltd. Composition de resine de polyimide photosensible de type positif
WO2001075525A1 (fr) * 2000-03-30 2001-10-11 Nissan Chemical Industries, Ltd. Composition de resine polyimide photosensible positive
JP4390028B2 (ja) 2000-10-04 2009-12-24 日産化学工業株式会社 ポジ型感光性ポリイミド樹脂組成物
JP4981215B2 (ja) * 2001-03-19 2012-07-18 株式会社カネカ 感光性樹脂組成物およびそれを用いた感光性ドライフィルムレジスト
JP2003012611A (ja) * 2001-07-03 2003-01-15 Mitsui Chemicals Inc 新規なビスアミノフェノール類及びその製造方法
KR100905682B1 (ko) * 2001-09-26 2009-07-03 닛산 가가쿠 고교 가부시키 가이샤 포지티브형 감광성 폴리이미드 수지 조성물
JP4530284B2 (ja) 2004-10-07 2010-08-25 信越化学工業株式会社 ポリイミド系光硬化性樹脂組成物並びにパターン形成方法及び基板保護用皮膜
JP4386454B2 (ja) 2006-08-22 2009-12-16 信越化学工業株式会社 アルカリ水溶液に可溶な感光性ポリイミド樹脂、該樹脂を含む組成物、及び該組成物から得られる膜
JP4336999B2 (ja) 2007-01-31 2009-09-30 信越化学工業株式会社 シルフェニレン骨格含有高分子化合物及び光硬化性樹脂組成物並びにパターン形成方法及び基板回路保護用皮膜
JP2009019105A (ja) 2007-07-11 2009-01-29 Nitto Denko Corp ポリイミドからなる光半導体素子封止用樹脂
KR101102256B1 (ko) * 2007-12-14 2012-01-03 주식회사 엘지화학 폴리이미드계 고분자 화합물 및 이를 포함하는 포지티브형폴리이미드 감광성 수지 조성물
KR100932770B1 (ko) 2007-12-18 2009-12-21 전북대학교산학협력단 포지형 감광성 폴리이미드 수지 및 이의 조성물
JP4849362B2 (ja) 2008-03-14 2012-01-11 ナガセケムテックス株式会社 感放射線性樹脂組成物
KR101023089B1 (ko) 2008-09-29 2011-03-24 제일모직주식회사 포지티브형 감광성 수지 조성물
JP5206977B2 (ja) 2009-03-12 2013-06-12 信越化学工業株式会社 新規ポリイミドシリコーン及びこれを含有する感光性樹脂組成物並びにパターン形成方法
JP5390964B2 (ja) * 2009-07-01 2014-01-15 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びそれを用いた感光性フィルム
KR101249686B1 (ko) * 2009-07-16 2013-04-05 주식회사 엘지화학 폴리이미드 및 이를 포함하는 감광성 수지 조성물
TWI516527B (zh) 2009-12-10 2016-01-11 信越化學工業股份有限公司 光固化性樹脂組成物，圖案形成法和基板保護膜，以及使用該組成物之膜狀黏著劑及黏著片
KR101333704B1 (ko) 2009-12-29 2013-11-27 제일모직주식회사 포지티브형 감광성 수지 조성물
KR101295464B1 (ko) * 2010-07-14 2013-08-09 주식회사 엘지화학 파지티브 타입 감광성 수지 조성물 및 이를 포함하는 유기 발광 소자 블랙 뱅크
KR101400192B1 (ko) 2010-12-31 2014-05-27 제일모직 주식회사 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자
KR101705755B1 (ko) 2013-12-19 2017-02-10 제일모직 주식회사 포지티브형 감광성 수지 조성물, 감광성 수지막, 및 표시 소자
KR101837946B1 (ko) 2014-03-31 2018-03-13 코오롱인더스트리 주식회사 폴리이미드 수지 및 이를 이용한 필름
CN107406590B (zh) 2015-01-27 2020-08-04 东丽株式会社 树脂、感光性树脂组合物及使用了它们的电子部件、显示装置
CN111303420A (zh) * 2019-11-19 2020-06-19 上海极紫科技有限公司 一种可碱显影的正性聚酰亚胺光敏树脂及其制备方法
CN111333837B (zh) * 2020-01-07 2022-11-25 上海极紫科技有限公司 一种正性光敏聚酰亚胺树脂及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6046421B2 (ja) 1978-03-01 1985-10-16 東レ株式会社 耐熱性感光材料
JPS5952823B2 (ja) 1978-03-01 1984-12-21 東レ株式会社 耐熱性感光材料
JPS5952822B2 (ja) 1978-04-14 1984-12-21 東レ株式会社 耐熱性感光材料
JPS57168942A (en) 1981-04-13 1982-10-18 Hitachi Ltd Photosensitive polymer composition
JPH0644154B2 (ja) 1986-07-03 1994-06-08 宇部興産株式会社 有機溶媒可溶性のポジ型感光性ポリイミド組成物
US4927736A (en) 1987-07-21 1990-05-22 Hoechst Celanese Corporation Hydroxy polyimides and high temperature positive photoresists therefrom
JPS6433133A (en) 1987-07-30 1989-02-03 Nippon Telegraph & Telephone Reactive polyamic acid and its production
EP0379639A3 (de) * 1988-09-26 1991-02-06 International Business Machines Corporation Elektronenstrahl-empfindliches, positives Polyimid
EP0378156A3 (de) * 1989-01-09 1992-02-26 Nitto Denko Corporation Lichtempfindliche positiv arbeitende Polyimid-Zusammensetzung

Also Published As

Publication number Publication date
EP0424940B1 (de) 1998-01-14
JP2906637B2 (ja) 1999-06-21
EP0424940A3 (en) 1991-12-18
DE69031933T2 (de) 1998-05-14
EP0424940A2 (de) 1991-05-02
JPH03209478A (ja) 1991-09-12
KR0148011B1 (ko) 1998-08-01
KR910008485A (ko) 1991-05-31

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee