DE69131529D1 - Positiv arbeitende lichtempfindliche Harzzusammensetzung - Google Patents

Positiv arbeitende lichtempfindliche Harzzusammensetzung

Info

Publication number
DE69131529D1
DE69131529D1 DE69131529T DE69131529T DE69131529D1 DE 69131529 D1 DE69131529 D1 DE 69131529D1 DE 69131529 T DE69131529 T DE 69131529T DE 69131529 T DE69131529 T DE 69131529T DE 69131529 D1 DE69131529 D1 DE 69131529D1
Authority
DE
Germany
Prior art keywords
resin composition
photosensitive resin
positive working
working photosensitive
positive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69131529T
Other languages
English (en)
Other versions
DE69131529T2 (de
Inventor
Toshio Banba
Etsu Takeuchi
Toshiro Takeda
Naoshige Takeda
Akira Tokoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP13711290A external-priority patent/JP2877894B2/ja
Priority claimed from JP13711390A external-priority patent/JP2877895B2/ja
Priority claimed from JP13711190A external-priority patent/JP2828736B2/ja
Priority claimed from JP15404990A external-priority patent/JP2828740B2/ja
Priority claimed from JP17737690A external-priority patent/JPH087436B2/ja
Priority claimed from JP3104053A external-priority patent/JP2698228B2/ja
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Application granted granted Critical
Publication of DE69131529D1 publication Critical patent/DE69131529D1/de
Publication of DE69131529T2 publication Critical patent/DE69131529T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/04—Chromates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/107—Polyamide or polyurethane

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
DE69131529T 1990-05-29 1991-05-28 Positiv arbeitende lichtempfindliche Harzzusammensetzung Expired - Lifetime DE69131529T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP13711290A JP2877894B2 (ja) 1990-05-29 1990-05-29 ポジ型感光性樹脂組成物
JP13711390A JP2877895B2 (ja) 1990-05-29 1990-05-29 ポジ型感光性樹脂組成物
JP13711190A JP2828736B2 (ja) 1990-05-29 1990-05-29 ポジ型感光性樹脂組成物
JP15404990A JP2828740B2 (ja) 1990-06-14 1990-06-14 ポジ型感光性樹脂組成物
JP17737690A JPH087436B2 (ja) 1990-07-06 1990-07-06 感光性ジアゾキノン化合物及びそれを用いたポジ型感光性樹脂組成物
JP3104053A JP2698228B2 (ja) 1991-02-13 1991-02-13 感光性樹脂用現像液

Publications (2)

Publication Number Publication Date
DE69131529D1 true DE69131529D1 (de) 1999-09-23
DE69131529T2 DE69131529T2 (de) 2000-01-20

Family

ID=27552184

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69131529T Expired - Lifetime DE69131529T2 (de) 1990-05-29 1991-05-28 Positiv arbeitende lichtempfindliche Harzzusammensetzung

Country Status (4)

Country Link
US (1) US5449584A (de)
EP (1) EP0459395B1 (de)
KR (1) KR0183990B1 (de)
DE (1) DE69131529T2 (de)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
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US5851736A (en) * 1991-03-05 1998-12-22 Nitto Denko Corporation Heat-resistant photoresist composition, photosensitive substrate, and process for forming heat-resistant positive or negative pattern
JP2674415B2 (ja) * 1992-01-27 1997-11-12 信越化学工業株式会社 感光性樹脂組成物及び電子部品用保護膜
JP3024695B2 (ja) * 1994-06-08 2000-03-21 東京応化工業株式会社 ポジ型ホトレジスト組成物
CN1106788C (zh) * 1996-02-13 2003-04-23 日东电工株式会社 电路基片
TW502135B (en) * 1996-05-13 2002-09-11 Sumitomo Bakelite Co Positive type photosensitive resin composition and process for preparing polybenzoxazole resin film by using the same
JPH1039510A (ja) * 1996-07-29 1998-02-13 Nitto Denko Corp ネガ型フォトレジスト組成物及びその利用
EP0831534A3 (de) * 1996-09-24 1998-05-20 Siemens Aktiengesellschaft Halbleiterbauelement mit einer Passivierungsschicht
US6001517A (en) * 1996-10-31 1999-12-14 Kabushiki Kaisha Toshiba Positive photosensitive polymer composition, method of forming a pattern and electronic parts
JP3190967B2 (ja) * 1996-12-16 2001-07-23 住友ベークライト株式会社 アルカリ性水溶液及び感光性樹脂組成物のパターン形成方法
US6207356B1 (en) 1996-12-31 2001-03-27 Sumitomo Bakelite Company Limited Method for the pattern-processing of photosensitive resin composition
DE69706396T2 (de) * 1997-01-03 2002-04-18 Sumitomo Bakelite Co. Ltd., Tokio/Tokyo Verfahren zur Bebilderung einer photoempfindlichen Harzzusammensetzung
EP0905170B1 (de) * 1997-09-24 2013-10-30 Qimonda AG Polybenzoxazol- und Polybenzothiazol-Vorstufen
KR19990037527A (ko) * 1997-10-31 1999-05-25 후지쯔 가부시끼가이샤 폴리이미드계 감광성 수지조성물용 현상액
WO1999054787A1 (fr) * 1998-04-15 1999-10-28 Asahi Kasei Kogyo Kabushiki Kaisha Composition de resine photosensible positive
JP3509612B2 (ja) * 1998-05-29 2004-03-22 日立化成デュポンマイクロシステムズ株式会社 感光性重合体組成物、レリーフパターンの製造法及び電子部品
SG104255A1 (en) * 1998-09-29 2004-06-21 Sumitomo Bakelite Co Polybenzoxazole resin and precursor thereof
US6143467A (en) * 1998-10-01 2000-11-07 Arch Specialty Chemicals, Inc. Photosensitive polybenzoxazole precursor compositions
US6177225B1 (en) * 1998-10-01 2001-01-23 Arch Specialty Chemicals, Inc. Photosensitive resin compositions
US6214516B1 (en) 1998-10-01 2001-04-10 Arch Specialty Chemicals, Inc. Photosensitive resin compositions
US6127086A (en) * 1998-10-01 2000-10-03 Arch Specialty Chemicals, Inc. Photosensitive resin compositions
JP2000128984A (ja) * 1998-10-28 2000-05-09 Sumitomo Bakelite Co Ltd ポリベンゾオキサゾール前駆体及び樹脂
JP3426531B2 (ja) 1998-10-30 2003-07-14 日立化成デュポンマイクロシステムズ株式会社 感光性重合体組成物、レリーフパターンの製造法及び電子部品
JP4529252B2 (ja) * 1999-09-28 2010-08-25 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パターンの製造法及び電子部品
JP2002148804A (ja) * 2000-11-08 2002-05-22 Nitto Denko Corp 感光性樹脂組成物および回路基板
WO2003067631A2 (en) * 2002-02-06 2003-08-14 Arch Specialty Chemicals, Inc. Improved semiconductor stress buffer coating edge bead removal compositions and method for their use
US6887643B2 (en) * 2002-08-05 2005-05-03 Toray Industries, Inc. Photosensitive resin precursor composition
US6670090B1 (en) * 2002-09-03 2003-12-30 Industrial Technology Research Institute Positive working photosensitive composition, article and process for forming a relief pattern
WO2004081663A2 (en) * 2003-03-11 2004-09-23 Arch Specialty Chemicals, Inc. Novel photosensitive resin compositions
KR20060023520A (ko) * 2003-03-11 2006-03-14 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 신규한 감광성 수지 조성물들
EP1606326A2 (de) * 2003-03-11 2005-12-21 FujiFilm Electronic Materials USA, Inc. Neuartige lichtempfindliche harzzusammensetzungen
US6929891B2 (en) * 2003-03-11 2005-08-16 Arch Specialty Chemicals, Inc. Photosensitive resin compositions
KR101020164B1 (ko) 2003-07-17 2011-03-08 허니웰 인터내셔날 인코포레이티드 진보된 마이크로전자적 응용을 위한 평탄화 막, 및 이를제조하기 위한 장치 및 방법
KR20050017169A (ko) * 2003-08-08 2005-02-22 삼성에스디아이 주식회사 애노드 표면 개질층을 사용하는 유기 전계 발광 소자
JP4244309B2 (ja) * 2003-09-12 2009-03-25 富士フイルム株式会社 平版印刷版原版
TWI363249B (en) * 2003-10-15 2012-05-01 Fujifilm Electronic Materials Novel photosensitive resin compositions
JP4771412B2 (ja) * 2005-02-14 2011-09-14 信越化学工業株式会社 感光性樹脂及びその製造方法
JP4564439B2 (ja) * 2005-03-07 2010-10-20 日東電工株式会社 ポジ型感光性樹脂組成物
JP2008546204A (ja) * 2005-06-03 2008-12-18 フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド 前処理組成物
US8080350B2 (en) 2005-11-30 2011-12-20 Sumitomo Bakelite Company, Ltd. Positive photosensitive resin composition, and semiconductor device and display therewith
WO2008069812A1 (en) * 2006-12-03 2008-06-12 Central Glass Co., Ltd. Photosensitive polybenzoxazines and methods of making the same
US20100216070A1 (en) * 2006-12-04 2010-08-26 Central Glass Co., Ltd. Photosensitive Polyimides and Methods of Making the Same
DE102007005666A1 (de) 2007-01-31 2008-08-14 Gkss-Forschungszentrum Geesthacht Gmbh Herstellung eines funktionalisierten Polytriazol-Polymers
WO2009052177A1 (en) * 2007-10-16 2009-04-23 Fujifilm Electronic Materials U.S.A., Inc. Novel photosensitive resin compositions
GB0723855D0 (en) 2007-12-06 2008-01-16 Smith & Nephew Apparatus and method for wound volume measurement
KR101023089B1 (ko) * 2008-09-29 2011-03-24 제일모직주식회사 포지티브형 감광성 수지 조성물
TWI459141B (zh) * 2008-10-20 2014-11-01 Cheil Ind Inc 正型光敏性樹脂組成物
KR101333704B1 (ko) * 2009-12-29 2013-11-27 제일모직주식회사 포지티브형 감광성 수지 조성물
GB201015656D0 (en) 2010-09-20 2010-10-27 Smith & Nephew Pressure control apparatus
KR101400187B1 (ko) 2010-12-30 2014-05-27 제일모직 주식회사 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자
KR101400192B1 (ko) 2010-12-31 2014-05-27 제일모직 주식회사 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자
US9084845B2 (en) 2011-11-02 2015-07-21 Smith & Nephew Plc Reduced pressure therapy apparatuses and methods of using same
KR101423176B1 (ko) 2011-11-29 2014-07-25 제일모직 주식회사 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자
KR101413076B1 (ko) 2011-12-23 2014-06-30 제일모직 주식회사 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자
KR101432603B1 (ko) 2011-12-29 2014-08-21 제일모직주식회사 감광성 노볼락 수지, 이를 포함하는 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 이를 포함하는 반도체 소자

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Also Published As

Publication number Publication date
KR910020490A (ko) 1991-12-20
KR0183990B1 (ko) 1999-04-01
EP0459395A3 (en) 1992-07-08
EP0459395B1 (de) 1999-08-18
DE69131529T2 (de) 2000-01-20
US5449584A (en) 1995-09-12
EP0459395A2 (de) 1991-12-04

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