DE68929487D1 - Versorgungssteckerstift-Anordnung für eine integrierte Schaltung - Google Patents

Versorgungssteckerstift-Anordnung für eine integrierte Schaltung

Info

Publication number
DE68929487D1
DE68929487D1 DE68929487T DE68929487T DE68929487D1 DE 68929487 D1 DE68929487 D1 DE 68929487D1 DE 68929487 T DE68929487 T DE 68929487T DE 68929487 T DE68929487 T DE 68929487T DE 68929487 D1 DE68929487 D1 DE 68929487D1
Authority
DE
Germany
Prior art keywords
integrated circuit
supply pin
pin arrangement
arrangement
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE68929487T
Other languages
English (en)
Other versions
DE68929487T2 (de
Inventor
Roelof Herman Willem Salters
Betty Prince
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP BV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of DE68929487D1 publication Critical patent/DE68929487D1/de
Application granted granted Critical
Publication of DE68929487T2 publication Critical patent/DE68929487T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49589—Capacitor integral with or on the leadframe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Dram (AREA)
  • Static Random-Access Memory (AREA)
  • Semiconductor Memories (AREA)
DE68929487T 1989-02-14 1989-02-14 Versorgungssteckerstift-Anordnung für eine integrierte Schaltung Expired - Lifetime DE68929487T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP89200352A EP0382948B1 (de) 1989-02-14 1989-02-14 Versorgungssteckerstift-Anordnung für eine integrierte Schaltung

Publications (2)

Publication Number Publication Date
DE68929487D1 true DE68929487D1 (de) 2003-11-13
DE68929487T2 DE68929487T2 (de) 2004-07-22

Family

ID=8202322

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68929487T Expired - Lifetime DE68929487T2 (de) 1989-02-14 1989-02-14 Versorgungssteckerstift-Anordnung für eine integrierte Schaltung

Country Status (11)

Country Link
EP (2) EP0382948B1 (de)
JP (1) JP2885456B2 (de)
KR (1) KR100218076B1 (de)
CN (1) CN1025904C (de)
CZ (1) CZ281891B6 (de)
DE (1) DE68929487T2 (de)
ES (1) ES2208631T3 (de)
FI (1) FI113908B (de)
MY (1) MY105266A (de)
RU (1) RU2092932C1 (de)
SK (1) SK64990A3 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2208631T3 (es) * 1989-02-14 2004-06-16 Koninklijke Philips Electronics N.V. Disposicion de clavijas de alimentacion para un circuito integrado.
US5291455A (en) * 1992-05-08 1994-03-01 Motorola, Inc. Memory having distributed reference and bias voltages
US5270964A (en) * 1992-05-19 1993-12-14 Sun Microsystems, Inc. Single in-line memory module
WO1995022839A1 (en) * 1994-02-17 1995-08-24 National Semiconductor Corporation Packaged integrated circuit with reduced electromagnetic interference
DE69620859T2 (de) * 1996-01-22 2002-10-31 Ericsson Telefon Ab L M Erdsymmetrische Halbleiterintegrierte Anordnung mit einer Parallelresonanzschaltung
CN101505167B (zh) * 2007-12-21 2013-05-08 北京登合科技有限公司 移动终端的音频编码解码模组
US7969002B2 (en) * 2008-10-29 2011-06-28 Maxim Integrated Products, Inc. Integrated circuit packages incorporating an inductor and methods
CN102368686B (zh) * 2011-08-01 2016-08-10 刘圣平 一种防短路失控的电路模块端口布置方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3808475A (en) * 1972-07-10 1974-04-30 Amdahl Corp Lsi chip construction and method
JPS5844743A (ja) * 1981-09-10 1983-03-15 Fujitsu Ltd 半導体集積回路
JPS58124262A (ja) * 1982-01-20 1983-07-23 Nec Corp 集積回路装置
JPS601856A (ja) * 1983-06-20 1985-01-08 Nec Corp メモリチツプモジユ−ル
JPS60152039A (ja) * 1984-01-20 1985-08-10 Toshiba Corp ＧａＡｓゲ−トアレイ集積回路
JPS61288451A (ja) * 1985-06-17 1986-12-18 Toshiba Corp 集積回路用パツケ−ジの入出力ピンの配置構造
JPS6281743A (ja) * 1985-10-07 1987-04-15 Hitachi Comput Eng Corp Ltd 半導体装置
JPS6290956A (ja) * 1985-10-17 1987-04-25 Sumitomo Electric Ind Ltd 半導体集積回路
ES2208631T3 (es) * 1989-02-14 2004-06-16 Koninklijke Philips Electronics N.V. Disposicion de clavijas de alimentacion para un circuito integrado.

Also Published As

Publication number Publication date
FI113908B (fi) 2004-06-30
MY105266A (en) 1994-09-30
CN1025904C (zh) 1994-09-07
CZ281891B6 (cs) 1997-03-12
DE68929487T2 (de) 2004-07-22
JPH02277262A (ja) 1990-11-13
EP0382948B1 (de) 2003-10-08
SK278712B6 (sk) 1998-01-14
EP1179848A3 (de) 2005-03-09
EP1179848A2 (de) 2002-02-13
CZ64990A3 (en) 1997-01-15
CN1045486A (zh) 1990-09-19
ES2208631T3 (es) 2004-06-16
RU2092932C1 (ru) 1997-10-10
SK64990A3 (en) 1998-01-14
JP2885456B2 (ja) 1999-04-26
KR900013618A (ko) 1990-09-06
FI900653A0 (fi) 1990-02-09
EP0382948A1 (de) 1990-08-22
KR100218076B1 (ko) 1999-09-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: EISENFUEHR, SPEISER & PARTNER, 10178 BERLIN

8327 Change in the person/name/address of the patent owner

Owner name: NXP B.V., EINDHOVEN, NL