FI113908B - Syöttönastojen uudelleenjärjestely integroitua piirimoduulia ja integroitua piirisirua varten - Google Patents

Syöttönastojen uudelleenjärjestely integroitua piirimoduulia ja integroitua piirisirua varten Download PDF

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Publication number
FI113908B
FI113908B FI900653A FI900653A FI113908B FI 113908 B FI113908 B FI 113908B FI 900653 A FI900653 A FI 900653A FI 900653 A FI900653 A FI 900653A FI 113908 B FI113908 B FI 113908B
Authority
FI
Finland
Prior art keywords
pins
integrated circuit
output
supply
input
Prior art date
Application number
FI900653A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI900653A0 (fi
Inventor
Roelof Herman Willem Salters
Betty Prince
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of FI900653A0 publication Critical patent/FI900653A0/fi
Application granted granted Critical
Publication of FI113908B publication Critical patent/FI113908B/fi

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49589—Capacitor integral with or on the leadframe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
FI900653A 1989-02-14 1990-02-09 Syöttönastojen uudelleenjärjestely integroitua piirimoduulia ja integroitua piirisirua varten FI113908B (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP89200352 1989-02-14
EP89200352A EP0382948B1 (de) 1989-02-14 1989-02-14 Versorgungssteckerstift-Anordnung für eine integrierte Schaltung

Publications (2)

Publication Number Publication Date
FI900653A0 FI900653A0 (fi) 1990-02-09
FI113908B true FI113908B (fi) 2004-06-30

Family

ID=8202322

Family Applications (1)

Application Number Title Priority Date Filing Date
FI900653A FI113908B (fi) 1989-02-14 1990-02-09 Syöttönastojen uudelleenjärjestely integroitua piirimoduulia ja integroitua piirisirua varten

Country Status (11)

Country Link
EP (2) EP0382948B1 (de)
JP (1) JP2885456B2 (de)
KR (1) KR100218076B1 (de)
CN (1) CN1025904C (de)
CZ (1) CZ281891B6 (de)
DE (1) DE68929487T2 (de)
ES (1) ES2208631T3 (de)
FI (1) FI113908B (de)
MY (1) MY105266A (de)
RU (1) RU2092932C1 (de)
SK (1) SK64990A3 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2208631T3 (es) * 1989-02-14 2004-06-16 Koninklijke Philips Electronics N.V. Disposicion de clavijas de alimentacion para un circuito integrado.
US5291455A (en) * 1992-05-08 1994-03-01 Motorola, Inc. Memory having distributed reference and bias voltages
US5270964A (en) * 1992-05-19 1993-12-14 Sun Microsystems, Inc. Single in-line memory module
WO1995022839A1 (en) * 1994-02-17 1995-08-24 National Semiconductor Corporation Packaged integrated circuit with reduced electromagnetic interference
DE69620859T2 (de) * 1996-01-22 2002-10-31 Ericsson Telefon Ab L M Erdsymmetrische Halbleiterintegrierte Anordnung mit einer Parallelresonanzschaltung
CN101505167B (zh) * 2007-12-21 2013-05-08 北京登合科技有限公司 移动终端的音频编码解码模组
US7969002B2 (en) * 2008-10-29 2011-06-28 Maxim Integrated Products, Inc. Integrated circuit packages incorporating an inductor and methods
CN102368686B (zh) * 2011-08-01 2016-08-10 刘圣平 一种防短路失控的电路模块端口布置方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3808475A (en) * 1972-07-10 1974-04-30 Amdahl Corp Lsi chip construction and method
JPS5844743A (ja) * 1981-09-10 1983-03-15 Fujitsu Ltd 半導体集積回路
JPS58124262A (ja) * 1982-01-20 1983-07-23 Nec Corp 集積回路装置
JPS601856A (ja) * 1983-06-20 1985-01-08 Nec Corp メモリチツプモジユ−ル
JPS60152039A (ja) * 1984-01-20 1985-08-10 Toshiba Corp ＧａＡｓゲ−トアレイ集積回路
JPS61288451A (ja) * 1985-06-17 1986-12-18 Toshiba Corp 集積回路用パツケ−ジの入出力ピンの配置構造
JPS6281743A (ja) * 1985-10-07 1987-04-15 Hitachi Comput Eng Corp Ltd 半導体装置
JPS6290956A (ja) * 1985-10-17 1987-04-25 Sumitomo Electric Ind Ltd 半導体集積回路
ES2208631T3 (es) * 1989-02-14 2004-06-16 Koninklijke Philips Electronics N.V. Disposicion de clavijas de alimentacion para un circuito integrado.

Also Published As

Publication number Publication date
DE68929487D1 (de) 2003-11-13
MY105266A (en) 1994-09-30
CN1025904C (zh) 1994-09-07
CZ281891B6 (cs) 1997-03-12
DE68929487T2 (de) 2004-07-22
JPH02277262A (ja) 1990-11-13
EP0382948B1 (de) 2003-10-08
SK278712B6 (sk) 1998-01-14
EP1179848A3 (de) 2005-03-09
EP1179848A2 (de) 2002-02-13
CZ64990A3 (en) 1997-01-15
CN1045486A (zh) 1990-09-19
ES2208631T3 (es) 2004-06-16
RU2092932C1 (ru) 1997-10-10
SK64990A3 (en) 1998-01-14
JP2885456B2 (ja) 1999-04-26
KR900013618A (ko) 1990-09-06
FI900653A0 (fi) 1990-02-09
EP0382948A1 (de) 1990-08-22
KR100218076B1 (ko) 1999-09-01

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Legal Events

Date Code Title Description
HC Name/ company changed in application

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V.

HC Name/ company changed in application

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V.

FG Patent granted

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V.