EP0382948A1 - Versorgungssteckerstift-Anordnung für eine integrierte Schaltung - Google Patents

Versorgungssteckerstift-Anordnung für eine integrierte Schaltung Download PDF

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Publication number
EP0382948A1
EP0382948A1 EP19890200352 EP89200352A EP0382948A1 EP 0382948 A1 EP0382948 A1 EP 0382948A1 EP 19890200352 EP19890200352 EP 19890200352 EP 89200352 A EP89200352 A EP 89200352A EP 0382948 A1 EP0382948 A1 EP 0382948A1
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EP
European Patent Office
Prior art keywords
supply
pin
bonding pad
integrated circuit
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19890200352
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English (en)
French (fr)
Other versions
EP0382948B1 (de
Inventor
Roelof Herman Willem Salters
Betty Prince
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV, Koninklijke Philips Electronics NV filed Critical Philips Gloeilampenfabrieken NV
Priority to EP89200352A priority Critical patent/EP0382948B1/de
Priority to EP01202742A priority patent/EP1179848A3/de
Priority to DE68929487T priority patent/DE68929487T2/de
Priority to ES89200352T priority patent/ES2208631T3/es
Priority to JP2028142A priority patent/JP2885456B2/ja
Priority to FI900653A priority patent/FI113908B/fi
Priority to SK649-90A priority patent/SK64990A3/sk
Priority to CS90649A priority patent/CZ281891B6/cs
Priority to SU904743167A priority patent/RU2092932C1/ru
Priority to CN90101465A priority patent/CN1025904C/zh
Priority to KR1019900001770A priority patent/KR100218076B1/ko
Priority to MYPI90000244A priority patent/MY105266A/en
Publication of EP0382948A1 publication Critical patent/EP0382948A1/de
Priority to US07/739,625 priority patent/US5126822A/en
Application granted granted Critical
Publication of EP0382948B1 publication Critical patent/EP0382948B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49589—Capacitor integral with or on the leadframe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Definitions

  • the invention relates to an integrated circuit being coupled to connection pins via conductive connections, among which connection pins there is at least one first supply pin for connection to a first supply voltage and at least one second supply pin for connection to a second supply voltage.
  • Integrated circuits of this kind are widely known, for example in an encapsulated form, the connection pins extending beyond the encapsulation.
  • I.C.'s e.g. microprocessors or memories, wherein the supply pins are located diametrically opposite to one another
  • Philips Data Handbook IC10, 1987, page 103 showing the pinning diagram for a SRAM
  • Philips Data Handbook IC14, 1987, page 322 showing the pinning diagram for a microcontroller.
  • a smoothing capacitance according to common practice located between the first supply pin and the second supply pin, necessarily needs long wires to cover the distance between the supply pins located diametrically.
  • the parasitic impedance of these wires diminishes the efficiency of the smoothing capacitance.
  • such long wires are liable to act as antennae for receiving or transmitting disturbances interfering with the circuitry.
  • an inductive loop comprising the chip, whereon the bonding pads for the bonding wires connected to the supply pins are located, the bonding wires and the supply pins themselves, has a considerable inductance because of its relatively large area. This causes the occurrence of inductive voltage spikes on the chip's internal supply lines, which spikes may interfere with the operation of the integrated circuit.
  • the series arrangement of a supply pin and an associated bonding wire has an electrical path length that is the longest possible in the conventional dual-in-line I.C. This causes the impedance thereof, in particular the inductance, to be the largest possible.
  • connection pins are located along the circumference of the I.C.
  • Two supply pins are provided at opposite sides of the I.C. Consequently, a smoothing capacitor connected between the supply pins creates a relatively large loop likewise.
  • Other arrangements of connection pins may comprise connection pins arranged in a grid having more than two columns and more than two rows. Such a grid arrangement allows a large density of pins, which in particular is advantageous for I.C.'s that consume more power. Especially in high power-consumption environment, where currents and current changes are large, the operation may be limited by the above inductive effect.
  • an integrated circuit according to the invention is characterized, in that an aggregated electrical path length of each supply pin and of the conductive connection between the circuit and the supply pin is equal to or shorter than an aggregated electrical path length of any of the connection pins not being a supply pin and the conductive connection between the circuit and the relevant connection pin not being a supply pin.
  • the inductance of the series arrangement of a supply pin and its associated conductive connection now is the lowest possible.
  • An embodiment of an integrated circuit according to the invention is characterized, in that the first supply pin and the second supply pin are located next to one another. By locating the first and second supply pins next to one another, the area of the loop described herein above is further decreased considerably, thus minimizing the inductances.
  • Another advantage of this supply pin arrangement is, that the associated bonding wires and supply pins conduct currents in an anti-­parallel orientation. This causes the common effective inductance of this arrangement of supply pins and associated bonding wires to be less than half of the inductance of a single bonding wire due to a substantial cancellation electro-magnetic fields generated by the inductances of the neighbouring wires.
  • a further embodiment of an integrated circuit according to the invention is characterized, in that there are provided at least two first supply pins and at least two second supply pin.
  • This architecture decreases the amplitude of disturbances at the chip's internal supply lines even more because the presence of at least two supply pins and wires per supply voltage reduces the current per supply path by at least a factor 2.
  • connection pins comprise an output pin for transmitting an output signal
  • said output pin is located next to one of said supply pins.
  • a plurality of other circuitry may be interconnected to said output pins.
  • Each of the other circuits and the interconnections thereto represent impedances. Therefore output pins for transmitting output signals to other circuitry usually carry more powerful signals than other pins.
  • connection pins further comprise control pins such as a clock-input, or a chip-enable, or a read-enable or a write-enable, or an output-enable or a program-enable, according to the invention, is characterized in that the control pins are located nearer to a predetermined supply pin than connection pins not being a supply pin or output pin.
  • control pins such as clock pins and enable pins in the immediate proximity of the paired supply pins a core of pins has been created. The pins forming said core are present in almost all I.C.'s.
  • Chip designers may therefore take such a core as a starting point for creating a circuit, which is less sensitive to inductive interferences and generates much less of such inductive voltage spikes. Extensions of circuits designed according to the invention are easily accomplished, for the locations of the bulk of the pins and therefore the main parts of the lay-out are predetermined. For memories in particular this way of designing has important advantages as the memory cell matrices differ only in size, but not in lay-out.
  • the amplitudes of disturbing voltages caused by switching were lower by a factor 4 à 5 than in a memory conventionally supplied.
  • FIG 1 an example of the pin arrangement of a conventional dual-in-line I.C. is shown.
  • the Figure shows a SRAM I.C., comprising an integrated circuit chip 100 encapsulated within an encapsulation 112, that has been drawn partially for the sake of clarity.
  • the chip 100 is provided with bonding pads such as 114 and 116, located near the edges of chip 100.
  • the bonding pads shown are connected via conductive connections, e.g. bonding wires, such as 122 and 124, to the connection pins 1-24 extending beyond the encapsulation 112.
  • the connection pins 1-24 and the bonding wires such as 122 and 124 couple the chip 100 to the external world.
  • the chip 100 is supplied with a supply voltage V CC via supply pin 24 and bonding wire 124, and with a supply voltage GND via supply pin 12 and bonding wire 122.
  • supply pins 12 and 24 are placed diametrically opposite to each other.
  • Connection pins 9-11 and 13-17 are input/output pins for data transport.
  • Connection pins 1-8, 19, 22 and 23 are address pins.
  • Connections 18, 20, and 21 serve as control pins for controlling the chip 100 with a chip-select signal, an output-enable signal and a write-enable signal, respectively.
  • the locations of the bonding pads correspond circumferentially with the locations of the connection pins 1-24.
  • this set up the electrical path length of the supply arrangement comprising supply pin 12 and bonding wire 122, and supply pin 24 and bonding wire 124, is the longest possible among all series connections of a connection pin and its associated bonding wire present.
  • a smoothing capacitor 126 is connected between the supply pins 12 and 24.
  • Another drawback of the conventional architecture emanates from the connection of this capacitor 26.
  • the supply pins 12 and 24 are located diametrically opposite to each other the smoothing capacitor 26 has to be connected there-between by means of relatively long wires. This implies a presence of a loop of conductors, comprising the capacitor's 26 wires, the supply pins 12 and 24 and the bonding wires 122 and 124, the relatively large area thereof allowing further inductive effects, interfering the operation of the I.C. or with other circuitry in the I.C.'s neighbourhood (not shown). Also, the long wires' impedance may cause delays, thereby reducing the capacitor's 26 effect.
  • FIG. 2 the pin arrangement of an I.C. according to the invention is presented by way of an example.
  • the Figure shows a SRAM I.C., comprising an integrated circuit chip 300 encapsulated within an encapsulation 312, that has been drawn only partially for clarity.
  • the chip 300 is provided with bonding pads, such as 314 and 316, that are located near the edges of chip 300.
  • the bonding pads are connected via bonding wires, such as 322 and 324, to the connection pins 1-24, extending beyond the encapsulation 312.
  • the chip 300 is supplied with a supply voltage V CC via supply pins 6 and 18, and with a supply voltage GND via supply pins 7 and 19.
  • the supply pins 6 and 7 (and 18 and 19) now are disposed in such a manner as to minimize the respective aggregated electrial path length of the respective supply pin and its associated bonding wire.
  • the supply pins 6 and 7 on the one hand and the supply pins 18 and 19 on the other hand are located centrally within their associated sequencies of connection pins.
  • the aggregated inductance of the series arrangement of a supply pin and its associated bonding wire is reduced considerably with respect to the aggregated inductance present in the corresponding supply pin and bonding wire of the conventionally pinned I.C. of the previous Figure.
  • a smoothing capacitor 326 (328) can be connected there-between using very short connecting wires.
  • the loop, formed by the two supply pins 6 and 7, the bonding wires 322 and 324, chip 300 and capacitor 326 now has an extremely short circumference and an extremely small area enclosed thereby.
  • the wires now connecting capacitor 326 (328) to the supply pins have a much smaller impedance than in the case shown in Figure 1, which increases the capacitor's effect.
  • the area of said loop is much smaller than in the case of the previous Figure, which implies a much smaller loop-inductance, and therefore a much lower susceptibility to e.g. externally generated electromagnetic fields.
  • the smoothing capacitor 326 e.g. a surface mounted device
  • Another advantage of the supply pin arrangement having a V CC -pin in the immediate proximity of a GND-pin is the reduction of the effective aggregated inductances of the supply pins and the associated bonding wires. This reduction is caused by the anti-parallel orientation of the currents conducted in the conductors each comprising a supply pin and an associated bonding wire.
  • the mutual inductance generated by anti-parallel oriented currents in two conductors disposed parallel to each other causes the effective inductance of the parallel arranged conductors to be less than half of the inductance of a single conductor.
  • the shown I.C. further is provided with two supply pins 6 and 18 for supply voltage V CC and two supply pins 7 and 19 for supply voltage GND.
  • the current conducted per supply pin now is halved with respect to the case shown in Figure 1, which further reduces the amplitude of inductive voltage spikes.
  • V CC pins 6 and 18 and of the GND pins 7 and 19 are chosen to be rotationally symmetrical as can be seen from the drawing.
  • a mirror-symmetrical arrangement of the supply pins could lead to the destruction of the I.C. in case it would unintentionally be inserted into a circuit board the other way around, that is in the drawing upside down.
  • output pins 5, 8, 17 and 20 are located next to a supply pin. Said output pins are externally accessible terminals, coupled to outputs of the on-chip output buffers (not shown).
  • the arrangement of output pins next to supply pins has several advantages. First, the length of the electrical path constituted by an output pin and its associated bonding wire is in the same order of magnitude as, or equal to, the length of the electrical path constituted by a supply pin and its associated bonding wire. Consequently, the impedance (inductance) of the former is equally low. Second, the output buffers are located in the margin of chip 300.
  • the buffers are supplied via short on-chip supply lines (not shown). Short supply lines are advantageous for output buffers in particular, since they generally switch large current that may cause inductive voltage spikes on the associated supply lines. If the supply lines are kept as short as possible, the inductance thereof will be equally low.
  • the control pin 10 for the chip-select signal, the control pin 15 for the write-enable signal and the control pin 22 for the output-enable are disposed beyond the output pins in their associated sequences of connection pins.
  • the set of supply pins 6, 7, 18, 19, the output pins 4, 5, 8, 9, 16, 17, 20, 21 and the control pins 10, 15, 22 forms a core of frequently occurring pins in a memory I.C.
  • I.C. for another type of I.C., for instance a microcontroller, another set of control pins may be arranged as the specific application of the I.C. may require.
  • the concentration of said supply pins, output pins and control pins into a core, and dividing the chip into core circuitry and additional circuitry, has several advantages.
  • the I.C. is less sensitive to inductive voltage spikes as already has been discussed herein above.
  • the core of standard connection pins offers a starting point for I.C.-designers that is common to various lay-outs and from whereon extensions are relatively easy to make
  • connection pin arrangement for a conventional memory I.C. having connection pins located along its circumference.
  • the I.C. comprises an integrated circuit chip 500 encapsulated within encapsulation 512, which has been drawn only partially for clarity.
  • the chip 500 is provided with bonding pads such as 514 and 516, located near the chip's 500 edges.
  • the bonding pads are connected to the connection pins, such as 14 and 28 via bonding wires, such as 522 and 524.
  • Connection pins 28 and 14 are supply pins for receiving supply voltages V CC and GND, respectively.
  • Connection pins 1, 10, 15 and 21 are not connected.
  • Connection pins 11-13 and 16-20 are output pins, connections 2-9, 26 and 27 are address pins and connection pins 22-24 are control pins for receiving various chip-enable signals, which are included for the ease of memory expansion.
  • the supply pins 14 and 28 have not the best possible location in view of the reduction of inductive interferences. First, they are not the shortest possible connection pins, for pins 1 and 15 are shorther but are not connected. Second, the supply pins are located on opposite sides of the I.C. Smoothing capacitor 526 is to be connected between the supply pins 28 and 14 using wires that bridge the long distance across the I.C. What has been further described with reference to the I.C. of Figure 1 with regard to the drawbacks of the pin arrangement will apply equally to the I.C. of Figure 3.
  • FIG 4 an example of the pin arrangement for an I.C. having its pins disposed circumferentially is shown.
  • the Figure shows an integrated circuit chip 600 within an encapsulation 612.
  • the V DD supply pins 14 and 28 now are located next to a GND supply pin 15 and 1, respectively.
  • the arrangement of a V DD supply pin next to a GND supply pin is located centrally in a relevant sequence of connection pins, that is, the arrangement is flanked by other connection pins on both sides, the number of other connection pins being approximately equal for both sides.
  • Smoothing capacitors 626 and 628 have been connected between supply pins 14 and 15 and supply pins 1 and 28, respectively, via short wires.
  • the output pins 12, 13 and 16, 17 are disposed next to the arrangement of supply pins 14 and 15.
  • the output pins 3, 2 and 27, 26 are disposed next to the arrangement of supply pins 1 and 28.
  • the connection pins 22-25 constitute the control pins for various chip-enable signals, the connection pins 5-11, 20
  • pin-arrangements could be made for other kind of circuits, e.g. microcontrollers.
  • similar arrangements are possible for integrated circuit modules comprising more than a single chip, which pin-­arrangements similarly reflect the object of the invention to reduce the inductive voltage spikes by pairing the supply pins in the nearest proximity of the chips, and by disposing output pins next to the supply pins in the respective connection pin-arrangements.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Dram (AREA)
  • Static Random-Access Memory (AREA)
  • Semiconductor Memories (AREA)
EP89200352A 1989-02-14 1989-02-14 Versorgungssteckerstift-Anordnung für eine integrierte Schaltung Expired - Lifetime EP0382948B1 (de)

Priority Applications (13)

Application Number Priority Date Filing Date Title
EP89200352A EP0382948B1 (de) 1989-02-14 1989-02-14 Versorgungssteckerstift-Anordnung für eine integrierte Schaltung
EP01202742A EP1179848A3 (de) 1989-02-14 1989-02-14 Versorgungssteckerstift-Anordnung für ein IC
DE68929487T DE68929487T2 (de) 1989-02-14 1989-02-14 Versorgungssteckerstift-Anordnung für eine integrierte Schaltung
ES89200352T ES2208631T3 (es) 1989-02-14 1989-02-14 Disposicion de clavijas de alimentacion para un circuito integrado.
JP2028142A JP2885456B2 (ja) 1989-02-14 1990-02-07 集積回路用の給電ピン配置
SK649-90A SK64990A3 (en) 1989-02-14 1990-02-09 Integrated circuit on the semiconductor substrate
FI900653A FI113908B (fi) 1989-02-14 1990-02-09 Syöttönastojen uudelleenjärjestely integroitua piirimoduulia ja integroitua piirisirua varten
CS90649A CZ281891B6 (cs) 1989-02-14 1990-02-09 Uspořádání integrovaného obvodu na polovodičovém substrátu
SU904743167A RU2092932C1 (ru) 1989-02-14 1990-02-12 Устройство интегральной схемы и интегральная схема на полупроводниковой подложке
CN90101465A CN1025904C (zh) 1989-02-14 1990-02-12 有中部电源-接地脚的集成电路组件
KR1019900001770A KR100218076B1 (ko) 1989-02-14 1990-02-14 집적 회로 모듈 및 반도체 기판
MYPI90000244A MY105266A (en) 1989-02-14 1990-02-14 Supply pin rearrangement for an i.c.
US07/739,625 US5126822A (en) 1989-02-14 1991-08-02 Supply pin rearrangement for an I.C.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP89200352A EP0382948B1 (de) 1989-02-14 1989-02-14 Versorgungssteckerstift-Anordnung für eine integrierte Schaltung

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP01202742.1 Division-Into 2001-07-18

Publications (2)

Publication Number Publication Date
EP0382948A1 true EP0382948A1 (de) 1990-08-22
EP0382948B1 EP0382948B1 (de) 2003-10-08

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Application Number Title Priority Date Filing Date
EP89200352A Expired - Lifetime EP0382948B1 (de) 1989-02-14 1989-02-14 Versorgungssteckerstift-Anordnung für eine integrierte Schaltung
EP01202742A Withdrawn EP1179848A3 (de) 1989-02-14 1989-02-14 Versorgungssteckerstift-Anordnung für ein IC

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP01202742A Withdrawn EP1179848A3 (de) 1989-02-14 1989-02-14 Versorgungssteckerstift-Anordnung für ein IC

Country Status (11)

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EP (2) EP0382948B1 (de)
JP (1) JP2885456B2 (de)
KR (1) KR100218076B1 (de)
CN (1) CN1025904C (de)
CZ (1) CZ281891B6 (de)
DE (1) DE68929487T2 (de)
ES (1) ES2208631T3 (de)
FI (1) FI113908B (de)
MY (1) MY105266A (de)
RU (1) RU2092932C1 (de)
SK (1) SK64990A3 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0568808A2 (de) * 1992-05-08 1993-11-10 Motorola, Inc. Speicher mit verteilten Referenz- und Vorspannungen
WO1995022839A1 (en) * 1994-02-17 1995-08-24 National Semiconductor Corporation Packaged integrated circuit with reduced electromagnetic interference
EP0785616A1 (de) * 1996-01-22 1997-07-23 Telefonaktiebolaget Lm Ericsson Erdsymmetrische Halbleiterintegrierte Anordnung mit einer Parallelresonanzschaltung
EP0813204A2 (de) * 1992-05-19 1997-12-17 Sun Microsystems, Inc. Auf einer Zeile zusammengestelltes Speichermodul
CN101505166B (zh) * 2007-12-21 2012-09-05 北京登合科技有限公司 移动终端的音频编码解码模组

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2208631T3 (es) * 1989-02-14 2004-06-16 Koninklijke Philips Electronics N.V. Disposicion de clavijas de alimentacion para un circuito integrado.
US7969002B2 (en) * 2008-10-29 2011-06-28 Maxim Integrated Products, Inc. Integrated circuit packages incorporating an inductor and methods
CN102368686B (zh) * 2011-08-01 2016-08-10 刘圣平 一种防短路失控的电路模块端口布置方法

Citations (3)

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Publication number Priority date Publication date Assignee Title
EP0074825A2 (de) * 1981-09-10 1983-03-23 Fujitsu Limited Herstellung von integrierten Schaltungen nach dem Mutterscheibenverfahren
EP0151870A2 (de) * 1984-01-20 1985-08-21 Kabushiki Kaisha Toshiba Integrierte Gatterordnung mit Schottky-Dioden
EP0205728A2 (de) * 1985-06-17 1986-12-30 Kabushiki Kaisha Toshiba Anordnung von Eingangs- und Ausgangssteckstiften einer integrierten Schaltungspackung

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EP0568808A2 (de) * 1992-05-08 1993-11-10 Motorola, Inc. Speicher mit verteilten Referenz- und Vorspannungen
EP0568808A3 (de) * 1992-05-08 1994-08-31 Motorola Inc
EP0813204A2 (de) * 1992-05-19 1997-12-17 Sun Microsystems, Inc. Auf einer Zeile zusammengestelltes Speichermodul
WO1995022839A1 (en) * 1994-02-17 1995-08-24 National Semiconductor Corporation Packaged integrated circuit with reduced electromagnetic interference
EP0785616A1 (de) * 1996-01-22 1997-07-23 Telefonaktiebolaget Lm Ericsson Erdsymmetrische Halbleiterintegrierte Anordnung mit einer Parallelresonanzschaltung
US5844301A (en) * 1996-01-22 1998-12-01 Telefonaktiebolaget Lm Ericsson Balanced integrated semiconductor device operating with a parallel resonator circuit
CN101505166B (zh) * 2007-12-21 2012-09-05 北京登合科技有限公司 移动终端的音频编码解码模组
CN101505165B (zh) * 2007-12-21 2012-09-19 北京登合科技有限公司 移动终端的音频编码解码模组
CN101505164B (zh) * 2007-12-21 2013-02-20 北京登合科技有限公司 移动终端的音频编码解码模组
CN101505167B (zh) * 2007-12-21 2013-05-08 北京登合科技有限公司 移动终端的音频编码解码模组

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FI113908B (fi) 2004-06-30
DE68929487D1 (de) 2003-11-13
MY105266A (en) 1994-09-30
CN1025904C (zh) 1994-09-07
CZ281891B6 (cs) 1997-03-12
DE68929487T2 (de) 2004-07-22
JPH02277262A (ja) 1990-11-13
EP0382948B1 (de) 2003-10-08
SK278712B6 (sk) 1998-01-14
EP1179848A3 (de) 2005-03-09
EP1179848A2 (de) 2002-02-13
CZ64990A3 (en) 1997-01-15
CN1045486A (zh) 1990-09-19
ES2208631T3 (es) 2004-06-16
RU2092932C1 (ru) 1997-10-10
SK64990A3 (en) 1998-01-14
JP2885456B2 (ja) 1999-04-26
KR900013618A (ko) 1990-09-06
FI900653A0 (fi) 1990-02-09
KR100218076B1 (ko) 1999-09-01

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