DE69026055D1 - Wärmeübertragungsapparat für eine integrierte Schaltungsanordnung - Google Patents

Wärmeübertragungsapparat für eine integrierte Schaltungsanordnung

Info

Publication number
DE69026055D1
DE69026055D1 DE69026055T DE69026055T DE69026055D1 DE 69026055 D1 DE69026055 D1 DE 69026055D1 DE 69026055 T DE69026055 T DE 69026055T DE 69026055 T DE69026055 T DE 69026055T DE 69026055 D1 DE69026055 D1 DE 69026055D1
Authority
DE
Germany
Prior art keywords
integrated circuit
heat transfer
circuit arrangement
transfer apparatus
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69026055T
Other languages
English (en)
Other versions
DE69026055T2 (de
Inventor
Richard Frances Frankeny
Karl Hermann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69026055D1 publication Critical patent/DE69026055D1/de
Publication of DE69026055T2 publication Critical patent/DE69026055T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69026055T 1989-12-29 1990-12-20 Wärmeübertragungsapparat für eine integrierte Schaltungsanordnung Expired - Fee Related DE69026055T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/459,089 US5006924A (en) 1989-12-29 1989-12-29 Heat sink for utilization with high density integrated circuit substrates

Publications (2)

Publication Number Publication Date
DE69026055D1 true DE69026055D1 (de) 1996-04-25
DE69026055T2 DE69026055T2 (de) 1996-10-02

Family

ID=23823359

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69026055T Expired - Fee Related DE69026055T2 (de) 1989-12-29 1990-12-20 Wärmeübertragungsapparat für eine integrierte Schaltungsanordnung

Country Status (4)

Country Link
US (1) US5006924A (de)
EP (1) EP0435586B1 (de)
JP (1) JPH079956B2 (de)
DE (1) DE69026055T2 (de)

Families Citing this family (89)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04206555A (ja) * 1990-11-30 1992-07-28 Hitachi Ltd 電子機器の冷却装置
SE9100596D0 (sv) * 1991-03-01 1991-03-01 Carlstedt Elektronik Ab Magasin foer stora vlsi-kapslar
US5187645A (en) * 1991-06-07 1993-02-16 Ergo Computing, Inc. Portable computer with docking connector for peripheral devices
US5285108A (en) * 1991-06-21 1994-02-08 Compaq Computer Corporation Cooling system for integrated circuits
US5166863A (en) * 1991-07-15 1992-11-24 Amdahl Corporation Liquid-cooled assembly of heat-generating devices and method for assembling and disassembling
US5168348A (en) * 1991-07-15 1992-12-01 International Business Machines Corporation Impingment cooled compliant heat sink
DE4217597C2 (de) * 1992-05-27 1994-09-08 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte hochintegrierte gehäuselose Bausteine
DE4217598A1 (de) * 1992-05-27 1993-12-02 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte hochintegrierte, gehäuselose Bausteine
US5265321A (en) * 1992-09-22 1993-11-30 Microelectronics And Computer Technology Corporation Integrated circuit structure with heat exchanger elements secured thereto and method of making
US5344795A (en) * 1992-09-22 1994-09-06 Microelectronics And Computer Technology Corporation Method for encapsulating an integrated circuit using a removable heatsink support block
US5309321A (en) * 1992-09-22 1994-05-03 Microelectronics And Computer Technology Corporation Thermally conductive screen mesh for encapsulated integrated circuit packages
US5323292A (en) * 1992-10-06 1994-06-21 Hewlett-Packard Company Integrated multi-chip module having a conformal chip/heat exchanger interface
DE4326207A1 (de) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanisch schwimmendes Mehr-Chip-Substrat
US5270902A (en) * 1992-12-16 1993-12-14 International Business Machines Corporation Heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip
US5560423A (en) * 1994-07-28 1996-10-01 Aavid Laboratories, Inc. Flexible heat pipe for integrated circuit cooling apparatus
US6305463B1 (en) * 1996-02-22 2001-10-23 Silicon Graphics, Inc. Air or liquid cooled computer module cold plate
US5983997A (en) * 1996-10-17 1999-11-16 Brazonics, Inc. Cold plate having uniform pressure drop and uniform flow rate
SE9604705L (sv) 1996-12-20 1998-06-21 Ericsson Telefon Ab L M Förfarande och medel för att arrangera värmeöverföring
US6330153B1 (en) * 1999-01-14 2001-12-11 Nokia Telecommunications Oy Method and system for efficiently removing heat generated from an electronic device
US6690578B2 (en) * 2000-02-02 2004-02-10 Rittal Gmbh & Co. Kg Cooling device
US6892796B1 (en) * 2000-02-23 2005-05-17 General Motors Corporation Apparatus and method for mounting a power module
US7086452B1 (en) * 2000-06-30 2006-08-08 Intel Corporation Method and an apparatus for cooling a computer
JP3376346B2 (ja) * 2000-09-25 2003-02-10 株式会社東芝 冷却装置、この冷却装置を有する回路モジュールおよび電子機器
US6418748B1 (en) 2001-03-22 2002-07-16 Emmpak Foods, Inc. Machinery cooling system
NL1017913C2 (nl) * 2001-04-24 2002-10-25 Marcus Jozef Gertrudi Zelissen Montage van Peltier elementen in een koel of warmte inrichting.
US7096676B2 (en) 2001-04-24 2006-08-29 Top-Cool Holding B.V. Electric cooling device
GB2388469A (en) * 2002-04-16 2003-11-12 Chin-Wen Wang Heat radiator
GB2388473B (en) * 2002-05-08 2005-09-21 Sun Microsystems Inc Compliant heat sink interface
US6702002B2 (en) * 2002-06-03 2004-03-09 Chin-Wen Wang Hydronic pump type heat radiator
US6665186B1 (en) * 2002-10-24 2003-12-16 International Business Machines Corporation Liquid metal thermal interface for an electronic module
US6919504B2 (en) * 2002-12-19 2005-07-19 3M Innovative Properties Company Flexible heat sink
US20050039884A1 (en) * 2003-08-20 2005-02-24 Ivan Pawlenko Conformal heat sink
US7109581B2 (en) * 2003-08-25 2006-09-19 Nanoconduction, Inc. System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
FR2860947B1 (fr) * 2003-10-10 2005-12-23 Thales Sa Dispositif de refroidissement de circuits imprimes electronique et mode realisation.
JP2005129734A (ja) * 2003-10-23 2005-05-19 Sony Corp 電子機器
DK1923771T3 (en) * 2003-11-07 2015-06-01 Asetek As Cooling system for a computer system
US20050099775A1 (en) * 2003-11-12 2005-05-12 Himanshu Pokharna Pumped liquid cooling for computer systems using liquid metal coolant
US20050189089A1 (en) * 2004-02-27 2005-09-01 Nanocoolers Inc. Fluidic apparatus and method for cooling a non-uniformly heated power device
JP4046703B2 (ja) * 2004-03-04 2008-02-13 三菱電機株式会社 ヒートシンク
US7133286B2 (en) * 2004-05-10 2006-11-07 International Business Machines Corporation Method and apparatus for sealing a liquid cooled electronic device
US7188667B2 (en) * 2004-07-29 2007-03-13 International Business Machines Corporation Liquid cooling structure for electronic device
US20060088746A1 (en) * 2004-10-25 2006-04-27 3M Innovative Properties Company Passive dual-phase cooling for fuel cell assemblies
US20060090881A1 (en) * 2004-10-29 2006-05-04 3M Innovative Properties Company Immersion cooling apparatus
US7581585B2 (en) 2004-10-29 2009-09-01 3M Innovative Properties Company Variable position cooling apparatus
JP4551261B2 (ja) * 2005-04-01 2010-09-22 株式会社日立製作所 冷却ジャケット
EP1886208A1 (de) 2005-05-06 2008-02-13 Asetek A/S Kühlsystem für ein computersystem
US20060261469A1 (en) * 2005-05-23 2006-11-23 Taiwan Semiconductor Manufacturing Co., Ltd. Sealing membrane for thermal interface material
JP4439441B2 (ja) * 2005-07-01 2010-03-24 富士通株式会社 熱交換器
JP2007042863A (ja) * 2005-08-03 2007-02-15 Matsushita Electric Ind Co Ltd 電子機器
JP4962836B2 (ja) * 2006-01-10 2012-06-27 中村製作所株式会社 冷却部を備えた電子部品用パッケージ、およびその形成方法
EP1853099A1 (de) * 2006-05-04 2007-11-07 Bombardier Transportation GmbH Kühlvorrichtung und deren Verwendung
NL1031817C2 (nl) * 2006-05-15 2007-11-16 Stork Fokker Aesp Bv Thermisch elektrische generator omvattende module, alsmede stroombron.
US7995344B2 (en) * 2007-01-09 2011-08-09 Lockheed Martin Corporation High performance large tolerance heat sink
JP4697475B2 (ja) * 2007-05-21 2011-06-08 トヨタ自動車株式会社 パワーモジュールの冷却器及びパワーモジュール
US7508670B1 (en) * 2007-08-14 2009-03-24 Lockheed Martin Corporation Thermally conductive shelf
WO2009032144A2 (en) * 2007-08-28 2009-03-12 General Dynamics Advanced Information Systems, Inc. System and method for interconnecting circuit boards
TWI423403B (zh) * 2007-09-17 2014-01-11 Ibm 積體電路疊層
TW201019431A (en) * 2008-11-03 2010-05-16 Wen-Qiang Zhou Insulating and heat-dissipating structure of an electronic component
JP5412815B2 (ja) * 2008-12-04 2014-02-12 富士通株式会社 冷却ジャケット、冷却ユニット、冷却システム及び電子機器
JP5212125B2 (ja) * 2009-01-13 2013-06-19 株式会社デンソー パワーデバイス用ヒートシンク
US8910706B2 (en) * 2009-02-05 2014-12-16 International Business Machines Corporation Heat sink apparatus with extendable pin fins
WO2010114317A2 (ko) * 2009-04-01 2010-10-07 주식회사 엘지화학 우수한 방열 특성의 전지모듈 및 중대형 전지팩
JP4978653B2 (ja) * 2009-04-10 2012-07-18 セイコーエプソン株式会社 電子部品の温度制御装置並びにハンドラ装置
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
US8018719B2 (en) * 2009-05-26 2011-09-13 International Business Machines Corporation Vapor chamber heat sink with cross member and protruding boss
US8014150B2 (en) * 2009-06-25 2011-09-06 International Business Machines Corporation Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling
US8018720B2 (en) * 2009-06-25 2011-09-13 International Business Machines Corporation Condenser structures with fin cavities facilitating vapor condensation cooling of coolant
US8422229B2 (en) * 2009-06-25 2013-04-16 Oracle America, Inc. Molded heat sink and method of making same
US8490679B2 (en) * 2009-06-25 2013-07-23 International Business Machines Corporation Condenser fin structures facilitating vapor condensation cooling of coolant
US8059405B2 (en) * 2009-06-25 2011-11-15 International Business Machines Corporation Condenser block structures with cavities facilitating vapor condensation cooling of coolant
US8094454B2 (en) * 2009-11-23 2012-01-10 Delphi Technologies, Inc. Immersion cooling apparatus for a power semiconductor device
CN102640347B (zh) * 2009-12-07 2015-12-02 住友重机械工业株式会社 挖土机
US20110303403A1 (en) * 2010-06-11 2011-12-15 International Business Machines Corporation Flexible Heat Exchanger
TW201241603A (en) * 2011-04-08 2012-10-16 Asustek Comp Inc Motherboard
US20130044431A1 (en) * 2011-08-18 2013-02-21 Harris Corporation Liquid cooling of stacked die through substrate lamination
US20130153187A1 (en) * 2011-12-14 2013-06-20 International Business Machines Corporation Dual Heat Sinks For Distributing A Thermal Load
US8792238B2 (en) * 2012-02-03 2014-07-29 Celsia Technologies Taiwan, Inc. Heat-dissipating module having loop-type vapor chamber
US8587945B1 (en) * 2012-07-27 2013-11-19 Outlast Technologies Llc Systems structures and materials for electronic device cooling
US9812377B2 (en) * 2013-09-04 2017-11-07 Mitsubishi Electric Corporation Semiconductor module and inverter device
EP2849221A1 (de) * 2013-09-11 2015-03-18 ABB Technology AG Kühlanordnung für ein Leistungshalbleitermodul
WO2016089385A1 (en) * 2014-12-03 2016-06-09 Ge Intelligent Platforms, Inc. Combined energy dissipation apparatus and method
US10509447B2 (en) * 2015-09-16 2019-12-17 Nvidia Corporation Thermal shield can for improved thermal performance of mobile devices
EP3147940A1 (de) * 2015-09-22 2017-03-29 Siemens Aktiengesellschaft Kühlkörper
US11076510B2 (en) * 2018-08-13 2021-07-27 Facebook Technologies, Llc Heat management device and method of manufacture
US11410905B2 (en) 2019-03-18 2022-08-09 International Business Machines Corporation Optimized weight heat spreader for an electronic package
US11158562B2 (en) 2020-02-11 2021-10-26 International Business Machines Corporation Conformal integrated circuit (IC) device package lid
CN113645799A (zh) * 2020-04-27 2021-11-12 富泰华工业（深圳）有限公司 用于电子装置的散热结构及电子装置
DE102022112003A1 (de) 2022-05-13 2023-11-16 Connaught Electronics Ltd. Steuergeräteanordnung mit in einem Kanalsystem einer Leiterplatteneinheit angeordnetem Wärmeübertragungsmaterial und Verfahren zum Herstellen einer Steuergeräteanordnung
WO2024030671A1 (en) * 2022-08-05 2024-02-08 Transport Phenomena Technologies, Llc Compliant cooling plates

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5248364B2 (de) * 1974-12-12 1977-12-09
JPS5248364U (de) * 1975-10-02 1977-04-06
JPS57124155U (de) * 1981-01-26 1982-08-03
US4384168A (en) * 1981-05-12 1983-05-17 The United States Of America As Represented By The Department Of Energy Conductor for a fluid-cooled winding
US4449580A (en) * 1981-06-30 1984-05-22 International Business Machines Corporation Vertical wall elevated pressure heat dissipation system
JPS5987843A (ja) * 1982-11-12 1984-05-21 Hitachi Ltd 半導体冷却装置
JPS6084848A (ja) * 1983-10-17 1985-05-14 Hitachi Ltd 半導体装置
JPS60229353A (ja) * 1984-04-27 1985-11-14 Hitachi Ltd 熱伝達装置
JPH06101523B2 (ja) * 1985-03-04 1994-12-12 株式会社日立製作所 集積回路チツプ冷却装置
JPS61220359A (ja) * 1985-03-26 1986-09-30 Hitachi Ltd 半導体モジユ−ル冷却構造体
JPS61279157A (ja) * 1985-06-05 1986-12-09 Hitachi Ltd 半導体装置の冷却装置
DE3688962T2 (de) * 1985-10-04 1993-12-09 Fujitsu Ltd Kühlsystem für eine elektronische Schaltungsanordnung.
US4943844A (en) * 1985-11-22 1990-07-24 Texas Instruments Incorporated High-density package
US4750086A (en) * 1985-12-11 1988-06-07 Unisys Corporation Apparatus for cooling integrated circuit chips with forced coolant jet
JPS6381959A (ja) * 1986-09-26 1988-04-12 Hitachi Ltd 半導体装置
JPS63100759A (ja) * 1986-10-17 1988-05-02 Hitachi Ltd Ｉｃチツプの冷却装置
JPH0828589B2 (ja) * 1987-02-25 1996-03-21 日本電気株式会社 Ｌｓｉの冷却構造
JPH07112033B2 (ja) * 1987-03-16 1995-11-29 富士通株式会社 冷却モジユ−ル構造
JPH0812890B2 (ja) * 1988-05-24 1996-02-07 富士通株式会社 モジュール封止方法

Also Published As

Publication number Publication date
JPH079956B2 (ja) 1995-02-01
DE69026055T2 (de) 1996-10-02
EP0435586A2 (de) 1991-07-03
US5006924A (en) 1991-04-09
JPH03211862A (ja) 1991-09-17
EP0435586A3 (en) 1991-11-21
EP0435586B1 (de) 1996-03-20

Similar Documents

Publication Publication Date Title
DE69026055T2 (de) Wärmeübertragungsapparat für eine integrierte Schaltungsanordnung
DE58903363D1 (de) Kuehleinrichtung fuer mehrere kuehlmittelkreislaeufe.
DE69007113T2 (de) Prüfvorrichtung für thermalabbildungseinrichtungen.
KR960014942A (ko) 고온측정용 탐침카드
SG65594G (en) Integrated circuit transfer test device system
DE68918156D1 (de) Flache Kühlungsstruktur für integrierte Schaltung.
DE69102497T2 (de) Kühleinrichtung mit Perforationen für eine gedruckte Schaltkreisanordnung.
DE69027908T2 (de) Untersuchungsapparatur für eine gedruckte Schaltung
DE69020354D1 (de) Wärmeübertragungsgerät.
DE3851044T2 (de) Kühlungsvorrichtung für eine elektronische Anlage.
KR880700946A (ko) 전자부품 또는 회로 사이에서 정보를 전달하기 위한 장치
DE69024234T2 (de) Kondensator für eine integrierte Schaltung
DE3868481D1 (de) Kuehlungsvorrichtung fuer mikrowellenschaltungen.
DE68918301T2 (de) Passivierungsverfahren für eine integrierte Schaltung.
DE59008557D1 (de) Schaltungsanordnung für Anzeigevorrichtung.
DE69018257D1 (de) Fixiervorrichtung für thermotransferdrucker.
DE69000769T2 (de) Kuehlvorrichtung.
DE68929487D1 (de) Versorgungssteckerstift-Anordnung für eine integrierte Schaltung
FR2617977B1 (fr) Appareil de test de circuit imprime
KR900014384U (ko) 벨트용 마크의 열전사 장치
DE9410061U1 (de) Kühlkörperanordnung für eine integrierte Schaltung
NO901707D0 (no) Fremgangsmaate for hoeytemperaturvasking.
DK58190D0 (da) Magnetisk jaevnstroemsformer med lav temperaturdrift
NO903742D0 (no) Tenningskrets for termisk kilde.
KR900018044U (ko) 전자기기용 방열구

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee