GB2388473B - Compliant heat sink interface - Google Patents

Compliant heat sink interface

Info

Publication number
GB2388473B
GB2388473B GB0210524A GB0210524A GB2388473B GB 2388473 B GB2388473 B GB 2388473B GB 0210524 A GB0210524 A GB 0210524A GB 0210524 A GB0210524 A GB 0210524A GB 2388473 B GB2388473 B GB 2388473B
Authority
GB
United Kingdom
Prior art keywords
heat sink
sink interface
compliant heat
compliant
interface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB0210524A
Other versions
GB0210524D0 (en
GB2388473A (en
Inventor
Martin P Mayhead
Sean Conor Wrycraft
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sun Microsystems Inc
Original Assignee
Sun Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc
Priority to GB0210524A priority Critical patent/GB2388473B/en
Publication of GB0210524D0 publication Critical patent/GB0210524D0/en
Publication of GB2388473A publication Critical patent/GB2388473A/en
Application granted granted Critical
Publication of GB2388473B publication Critical patent/GB2388473B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB0210524A 2002-05-08 2002-05-08 Compliant heat sink interface Expired - Lifetime GB2388473B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0210524A GB2388473B (en) 2002-05-08 2002-05-08 Compliant heat sink interface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0210524A GB2388473B (en) 2002-05-08 2002-05-08 Compliant heat sink interface

Publications (3)

Publication Number Publication Date
GB0210524D0 GB0210524D0 (en) 2002-06-19
GB2388473A GB2388473A (en) 2003-11-12
GB2388473B true GB2388473B (en) 2005-09-21

Family

ID=9936279

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0210524A Expired - Lifetime GB2388473B (en) 2002-05-08 2002-05-08 Compliant heat sink interface

Country Status (1)

Country Link
GB (1) GB2388473B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2408388B (en) 2003-11-19 2007-09-05 Hush Technologies Invest Ltd Cooling apparatus
CN101182976A (en) * 2006-11-14 2008-05-21 诺亚公司 Dissipating heat cavity and phase-change heat radiating device with the same
GB0822819D0 (en) * 2008-12-16 2009-01-21 Sleddon Stephen Fount
US7816785B2 (en) 2009-01-22 2010-10-19 International Business Machines Corporation Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
US9417013B2 (en) * 2010-11-12 2016-08-16 Toyota Motor Engineering & Manufacturing North America, Inc. Heat transfer systems including heat conducting composite materials
EP2849221A1 (en) * 2013-09-11 2015-03-18 ABB Technology AG Cooling arrangement for a power semiconductor module
US9615486B2 (en) * 2014-03-26 2017-04-04 General Electric Company Thermal interface devices
DE102019201032A1 (en) * 2019-01-28 2020-07-30 lbeo Automotive Systems GmbH Cooling device for an object detection sensor
CN113382611B (en) * 2021-06-21 2022-12-13 上海电力大学 Phase change's heat dissipation subsides

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4997032A (en) * 1987-09-25 1991-03-05 Minnesota Mining And Manufacturing Company Thermal transfer bag
EP0435586A2 (en) * 1989-12-29 1991-07-03 International Business Machines Corporation Heat transfer apparatus for an integrated circuit device
US5402311A (en) * 1991-10-11 1995-03-28 Kabushiki Kaisha Toshiba Electronic apparatus having heat sink for cooling circuit component
DE19704549A1 (en) * 1996-02-13 1997-08-14 Electrovac Heatsinks for electrical and electronic components
WO2000078112A1 (en) * 1999-06-14 2000-12-21 Telefonaktiebolaget Lm Ericsson (Publ) A device for cooling of electronic components
US6241005B1 (en) * 1999-03-30 2001-06-05 Veeco Instruments, Inc. Thermal interface member

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4997032A (en) * 1987-09-25 1991-03-05 Minnesota Mining And Manufacturing Company Thermal transfer bag
EP0435586A2 (en) * 1989-12-29 1991-07-03 International Business Machines Corporation Heat transfer apparatus for an integrated circuit device
US5402311A (en) * 1991-10-11 1995-03-28 Kabushiki Kaisha Toshiba Electronic apparatus having heat sink for cooling circuit component
DE19704549A1 (en) * 1996-02-13 1997-08-14 Electrovac Heatsinks for electrical and electronic components
US6241005B1 (en) * 1999-03-30 2001-06-05 Veeco Instruments, Inc. Thermal interface member
WO2000078112A1 (en) * 1999-06-14 2000-12-21 Telefonaktiebolaget Lm Ericsson (Publ) A device for cooling of electronic components

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IBM Technical Disclosure Bulletin Vol 28, No 3, August 1985 *
IBM Tehnical Disclosure Bulletin Vol 22 No 4 *

Also Published As

Publication number Publication date
GB0210524D0 (en) 2002-06-19
GB2388473A (en) 2003-11-12

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20220507