CN113382611B - Phase change's heat dissipation subsides - Google Patents
Phase change's heat dissipation subsides Download PDFInfo
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- CN113382611B CN113382611B CN202110686296.7A CN202110686296A CN113382611B CN 113382611 B CN113382611 B CN 113382611B CN 202110686296 A CN202110686296 A CN 202110686296A CN 113382611 B CN113382611 B CN 113382611B
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- heat exchange
- heat
- phase change
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
Abstract
The invention relates to the field of phase change heat transfer and enhanced heat exchange, and discloses a heat dissipation patch with phase change, wherein a plurality of heat exchange units are distributed on the surface of a heat exchange layer, each heat exchange unit comprises an elastic bag body and a heat exchange agent positioned in the elastic bag body, and the heat exchange agent can be converted between a gas state and a liquid state, so that the heat exchange agent continuously absorbs heat and releases heat in the elastic bag body to cause reciprocating change of the heat exchange agent in the gas-liquid two phase states, the heat exchange intensity at the wall surface is improved compared with that of single condensation heat exchange, and the heat exchange intensity is improved. The elasticity utricule volume shows the expansion of volume, the dynamic change of shrink along with the phase change of inside heat transfer agent for the area of contact of elasticity utricule and high temperature steam, unsmooth degree also constantly change, have reduced the probability that the membranous that high temperature steam produced at the heat exchanger internal face condenses, have increased heat transfer area simultaneously, have further strengthened the heat transfer.
Description
Technical Field
The invention relates to the field of phase change heat transfer and enhanced heat exchange, in particular to a phase change heat dissipation patch.
Background
The phase-change heat transfer is also called phase-change convection heat transfer, which is a phenomenon of convection heat transfer with phase change accompanied by the boiling of liquid when steam meets condensation. The convective heat transfer coefficient of phase change heat transfer is often greater than convective heat transfer without phase change. On one hand, due to the existence of phase change latent heat, the condition of phase change is more often greater than the condition of no phase change for the convection heat transfer coefficient of the same fluid; on the other hand, due to the phase change, the thickness of the virtual film is reduced, the convection heat transfer coefficient is effectively increased, and the heat exchange is enhanced.
At present, the application field of phase change heat transfer is very wide. For example, the heat dissipation capability of the conventional high-power refrigeration air conditioning unit for cooling the electronic devices in the current data center no longer meets the heat dissipation requirements of the electronic devices and the high-power computers, and the main problems of high cost and high energy consumption. Immersion cooling is used as a phase change cooling mode without power source driving, so that the heat dissipation efficiency is greatly improved, and the capital construction and operation and maintenance costs are reduced. The working principle is that an electric insulation cooling working medium such as fluorinated liquid is used as a cooling working medium to directly immerse an electronic device, and the latent heat of vaporization required by the phase state conversion from liquid state to gaseous state of the cooling working medium is utilized to complete the heat absorption so as to achieve the purpose of heat dissipation; for another example, with the increasing aggravation of natural environment problems such as lack of fresh water and deterioration of water quality, the per-capita level of fresh water resources in China only reaches one fourth of the average level in the world, so that the development of seawater desalination engineering in China is increasingly emphasized. High-temperature and high-pressure steam is utilized, heat exchange structures such as a heat pipe are combined, latent heat carried by the steam is utilized to heat the seawater, and the effect of seawater desalination is achieved. Phase change heat transfer also plays a crucial role in this process.
The system device for achieving the purposes of heat dissipation of electronic devices, seawater desalination and the like by utilizing the phase-change heat exchange fully embodies the important role of the phase-change heat exchange. But the heat exchange strength of the phase change heat exchange can influence the excellent degree of the corresponding function of the system device. The weakening of the heat exchange strength of the phase change heat exchange is mainly reflected in film-shaped condensation in the condensation heat exchange process. When the film-shaped condensation is generated on the surface of the flat plate wall or the circular tube, a layer of liquid film is formed on the surface, the latent heat of vaporization released by the steam during the condensation can be released only through the layer of liquid film, the thickness of the liquid film is gradually increased along with the time, and the heat exchange efficiency is reduced. The frequency of film-like condensation and the thickness of the liquid film are reduced by a certain means, and the enhancement of phase change heat transfer is a trend.
The heat sink is published under the number 107816907A, and the name of the heat sink is 'a micro-nano composite structure surface heat sink and a method for strengthening heat exchange' in the publication period of 20.03.2018, and is used in the field of heat exchange of high-power electrical integrated devices. The technology has the disadvantages that although the heat transfer is enhanced by changing the surface, the existing surface is higher in cost and more complicated to add or improve due to the complex structure of the existing heat exchanger utilizing phase change.
The liquid cooling device is under the name of 209472923U, and the publication date of the liquid cooling device is 2019, 10 and 8, and is applied to electronic devices such as servers in an immersion cooling mode, so that the heat dissipation effect is improved. The technology has the defects that the cooling working medium discharges heat out of the system through heat exchange with the upper condensation tube bundle, film condensation inevitably occurs, and the heat exchange effect is greatly weakened.
Disclosure of Invention
The present invention has been made to solve the above problems, and an object of the present invention is to provide a heat dissipating patch with a phase change.
The invention provides a phase-change heat dissipation patch which can be arranged on a shell of a cooling device, wherein a cooling working medium for cooling is arranged in the cooling device, and the phase-change heat dissipation patch comprises: a heat exchange layer attached to a casing of the cooling device; and a plurality of heat exchange units distributed on the heat exchange layer; wherein, heat transfer unit includes: the elastic bag body and a heat exchange agent positioned in the elastic bag body, wherein the heat exchange agent can be converted between a gas state and a liquid state, and the phase change point of the heat exchange agent is lower than 80 ℃.
The heat dissipation patch with phase change provided by the invention can also have the following characteristics: wherein, the elastic capsule body is hemispherical, and the elastic capsule body accounts for more than 75 percent of the surface area of the heat exchange layer under the condition of complete expansion.
The heat dissipation patch with phase change provided by the invention can also have the following characteristics: the heat exchange layers are distributed in a rectangular array, and the distance between every two adjacent heat exchange units is 1-2 sphere diameters.
The heat dissipation patch with phase change provided by the invention can also have the following characteristics: wherein, the heat transfer layer includes: an adhering part adhered to the housing of the cooling device; a heat exchanging part attached to the attaching part.
The heat dissipation patch with phase change provided by the invention can also have the following characteristics: wherein the thickness of the heat exchanging part is 1mm-3mm.
Action and effects of the invention
According to the heat dissipation patch with the phase change, the plurality of heat exchange units are distributed on the surface of the heat exchange layer, each heat exchange unit comprises the elastic bag body and the heat exchange agent positioned in the elastic bag body, and the heat exchange agent can be converted between a gas state and a liquid state, so that the heat exchange agent continuously absorbs heat and releases heat in the elastic bag body, the reciprocating change of the heat exchange agent in the gas-liquid two phase states is caused, the heat exchange intensity on the wall surface is improved compared with that of single condensation heat exchange, and the heat exchange intensity is improved. The volume of the elastic bag body shows dynamic changes of expansion and contraction of the volume along with the phase change of the internal heat exchange agent, so that the contact area and the concave-convex degree of the elastic bag body and the high-temperature steam are constantly changed, the probability of film condensation of the high-temperature steam on the inner wall surface of the heat exchanger is reduced, the heat exchange area is increased, and the heat exchange is further strengthened.
Drawings
FIG. 1 is a schematic view of a cooling apparatus in the present embodiment;
fig. 2 is a perspective view of the heat dissipation patch with phase change in the embodiment;
fig. 3 is a schematic application diagram of the phase-change heat dissipation patch in this embodiment; and
fig. 4 is a schematic view of the state of the heat exchange unit in this embodiment.
Detailed Description
In order to make the technical means, the creation features, the achievement purposes and the effects of the invention easy to understand, the invention is specifically described below by combining the embodiment and the attached drawings.
Fig. 1 is a schematic view of a cooling apparatus in the present embodiment.
As shown in fig. 1, the cooling device 100 includes a box body 1, a cooling working medium 2, a phase change heat dissipation patch 3, and a cooling pipe (not shown).
The inside of the box main body 1 is a hollow structure.
The cooling working medium 2 is located in the box main body 1 and used for dissipating heat of the server.
The phase-change heat dissipation paste 3 is installed on the inner top surface of the box main body and used for absorbing heat of the cooling working medium 2.
The cooling duct is installed at the top end of the tank main body 1 for cooling the tank main body 1.
Fig. 2 is a perspective view of the phase-change heat dissipation patch in this embodiment.
As shown in fig. 2, the phase change heat dissipation patch 3 provided in this embodiment includes a heat exchange layer 31 and a plurality of heat exchange units 32.
The heat exchange layer 31 is in a square sheet shape and includes a sticking portion and a heat exchange portion, and the heat exchange layer is attached to the inner side surface of the lid body 3 through the sticking portion.
The sticking portion has viscosity, and in this embodiment, the material of the sticking portion is silica gel or gelatin.
The heat exchanging portion is bonded to the adhesive portion, and in this embodiment, the heat exchanging portion is made of silicone rubber or foam rubber having a thickness of 2 mm.
The plurality of heat exchange units 32 are distributed on the surface of the heat exchange part in a rectangular array, and the distance between every two adjacent heat exchange units is equal to the size of a sphere diameter.
The heat exchange unit 32 includes an elastic capsule and a heat exchange agent.
The shape of the elastic bag body is hemispherical. In this embodiment, the elastic capsule is made of a polyimide film, which has good elasticity and thermal conductivity, so that the spherical diameter of the elastic capsule can be varied within a range of 5mm to 15mm.
The heat exchange agent is positioned in the elastic bag body and can generate phase change at different temperatures. Namely 32a, 32b, 32c and 32a, the heat exchange agent is in liquid state, and the sphere diameter of the elastic capsule body is 5mm; the heat exchange agent in the state of 32b is in a liquid state and a gas state, at the moment, the heat exchange unit 32 is in a working state, and the sphere diameter of the elastic capsule body is 10mm; the heat transfer agent in the 32c state is in a gaseous state, at this time, the heat transfer unit 32 is in a saturated state, and the spherical diameter of the elastic bag body is 15mm.
In the present embodiment, ethanol, which has a low phase transition point, is non-toxic and non-polluting, is preferred as the heat exchanger.
When heat exchange occurs, the phase state of the ethanol is continuously converted between liquid state and gaseous state according to the heat absorption and release conditions, and the elastic bag body is correspondingly expanded and contracted in volume. In order to reduce the frequency of occurrence of film-like condensation, in the present embodiment, the size of the heat exchange unit is constantly changed.
Fig. 3 is a schematic diagram of an application of the heat dissipation patch with a changed state in this embodiment and fig. 4 is a schematic diagram of a state of the heat exchange unit in this embodiment.
As shown in fig. 3 and 4, the server a generates heat during the operation, the cooling working medium 2 absorbs the heat to convert a part of the cooling working medium from a liquid state to a gaseous state, the gaseous cooling working medium rises to contact with the phase change heat dissipation patch and transfers heat with the phase change heat dissipation patch, that is: the ethanol in the elastic bag body absorbs heat and then is gasified after the temperature is increased; another portion of the heat is consumed in the form of the volumetric work required to expand the volume of the elastomeric bladder during the ethanol vaporization process. The gasified ethanol simultaneously discharges heat to the cover body, and the part of the heat is taken out of the cooling device by the cooling pipeline.
The ethanol in the elastic capsule continuously discharges heat to the external environment and continuously absorbs heat from the cooling working medium, so that the ethanol is maintained at a relatively stable temperature. When the heat exchange quantity between the cooling working medium and the elastic bag body is reduced, the heat of the working gas (vaporized ethanol) is continuously discharged outwards, so that part of the working gas is liquefied, and the volume of the elastic bag body is reduced. The working liquid (liquid ethanol) in the elastic capsule body continuously absorbs and releases heat to generate gas-liquid phase change, so that the heat exchange strength of the cover body is improved. The volume of the elastic bag body shows dynamic change of expansion and contraction of the volume along with the phase change of the internal working liquid, so that the contact surface area and the concave-convex degree of the elastic bag body and the cooling working medium are also changed continuously, the film condensation frequency of the high-temperature cooling working medium generated on the inner wall surface of the heat exchanger is reduced, the heat exchange area of the cooling working medium and the elastic bag body is increased, and the heat exchange is further strengthened.
The sphere diameter variation range of the elastic bag body is determined by the surface area of the actual heat exchange patch, and the elastic bag body is ensured to account for more than 75% of the surface area of the heat exchange patch under the condition of complete expansion, namely, the elastic bag body of the heat exchange unit continuously absorbs heat and exchanges heat, so that the heat exchange unit is switched among an initial state 32a, a working state 32b and a saturated state 32 c.
Effects and effects of the embodiments
According to the cooling device, the heat dissipation paste with phase state change is arranged in the cooling device, the surface of the heat exchange layer in the heat dissipation paste is distributed with the plurality of heat exchange units, each heat exchange unit comprises the elastic bag body and the heat exchange agent positioned in the elastic bag body, and the heat exchange agent can be converted between a gas state and a liquid state, so that the heat exchange agent continuously absorbs heat and releases heat in the elastic bag body, the reciprocating change of the heat exchange agent in the gas-liquid two phase states is caused, the heat exchange intensity at the wall surface is improved compared with that of single condensation heat exchange, and the heat exchange intensity is improved. The volume of the elastic bag body shows dynamic changes of expansion and contraction of the volume along with the phase change of the internal heat exchange agent, so that the contact area and the concave-convex degree of the elastic bag body and the high-temperature steam are constantly changed, the probability of film condensation of the high-temperature steam on the inner wall surface of the heat exchanger is reduced, the heat exchange area is increased, and the heat exchange is further strengthened.
The above embodiments are preferred examples of the present invention, and are not intended to limit the scope of the present invention.
The heat dissipation patch in other embodiments may also be directly attached to the cooling pipe or the heating element for heat dissipation, and will not be described in detail again.
Claims (3)
1. A phase change's heat dissipation subsides sets up on cooling device's casing, has the cooling working medium that is used for carrying on the cooling in this cooling device, its characterized in that includes:
a heat exchange layer attached to a casing of the cooling device; and
a plurality of heat exchange units distributed on the heat exchange layer;
wherein, the heat transfer unit includes:
the elastic bag body and the heat exchange agent positioned in the elastic bag body can be converted between a gas state and a liquid state, the phase change point of the heat exchange agent is lower than 80 ℃,
the outer surface of the elastic bag body is contacted with the gaseous cooling working medium,
the elastic capsule body is hemispherical, and the elastic capsule body accounts for more than 75 percent of the surface area of the heat exchange layer under the condition of complete expansion,
the heat exchange units are distributed on the heat exchange layer in a rectangular array, and the distance between every two adjacent heat exchange units is 1-2 sphere diameters.
2. The phase change heat dissipation patch according to claim 1, wherein:
wherein the heat exchange layer comprises:
a sticking portion stuck to a housing of the cooling device;
and the heat exchange part is attached to the adhering part and used for installing the heat exchange unit.
3. The phase change heat dissipation patch according to claim 2, wherein:
wherein, the thickness of the heat exchanging part is 1mm-3mm.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2063696A2 (en) * | 2007-11-23 | 2009-05-27 | MiCryon Technik GmbH | Method for cooling high thermal charged construction elements and device for carrying out the method |
| CN101639332A (en) * | 2009-08-26 | 2010-02-03 | 大连理工大学 | Plate type heat exchanging element for evaporation and condensation |
| CN104266513A (en) * | 2014-09-25 | 2015-01-07 | 德艾柯工程技术（上海）有限公司 | Vertical condenser |
| CN108507368A (en) * | 2018-03-02 | 2018-09-07 | 上海电力学院 | Utilize the device of bionic principle Augmentation of condensation heat transfer |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2388473B (en) * | 2002-05-08 | 2005-09-21 | Sun Microsystems Inc | Compliant heat sink interface |
| CN101182976A (en) * | 2006-11-14 | 2008-05-21 | 诺亚公司 | Dissipating heat cavity and phase-change heat radiating device with the same |
| CN207443316U (en) * | 2017-10-11 | 2018-06-01 | 上海阿莱德实业股份有限公司 | A kind of heat conduction heat accumulation composite materials suitable for mobile phone temperature control |
| CN209197543U (en) * | 2018-10-24 | 2019-08-02 | 山东岱荣节能环保科技有限公司 | A kind of efficient phase transformation pipe |
| CN109378551B (en) * | 2018-11-20 | 2023-11-10 | 华南理工大学 | Novel phase change cooling and heating integrated structure of power battery |
| CN212086803U (en) * | 2020-06-08 | 2020-12-04 | 太仓市华盈电子材料有限公司 | One-way heat conducting device |
-
2021
- 2021-06-21 CN CN202110686296.7A patent/CN113382611B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2063696A2 (en) * | 2007-11-23 | 2009-05-27 | MiCryon Technik GmbH | Method for cooling high thermal charged construction elements and device for carrying out the method |
| CN101639332A (en) * | 2009-08-26 | 2010-02-03 | 大连理工大学 | Plate type heat exchanging element for evaporation and condensation |
| CN104266513A (en) * | 2014-09-25 | 2015-01-07 | 德艾柯工程技术（上海）有限公司 | Vertical condenser |
| CN108507368A (en) * | 2018-03-02 | 2018-09-07 | 上海电力学院 | Utilize the device of bionic principle Augmentation of condensation heat transfer |
Non-Patent Citations (2)
| Title |
|---|
| 水平滴型管外凝结液膜分布及换热特性研究;李慧君等;《华北电力大学学报(自然科学版)》;20150930(第05期);全文 * |
| 表面多孔涂层对强化凝结换热的影响;马学虎等;《清华大学学报(自然科学版)》;19981010(第10期);全文 * |
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