CN111669952A - Data center submergence formula heat abstractor - Google Patents
Data center submergence formula heat abstractor Download PDFInfo
- Publication number
- CN111669952A CN111669952A CN202010663551.1A CN202010663551A CN111669952A CN 111669952 A CN111669952 A CN 111669952A CN 202010663551 A CN202010663551 A CN 202010663551A CN 111669952 A CN111669952 A CN 111669952A
- Authority
- CN
- China
- Prior art keywords
- heat
- liquid
- oscillating
- data center
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims abstract description 75
- 238000001816 cooling Methods 0.000 claims abstract description 67
- 238000009833 condensation Methods 0.000 claims abstract description 22
- 230000005494 condensation Effects 0.000 claims abstract description 22
- 238000001704 evaporation Methods 0.000 claims abstract description 21
- 230000008020 evaporation Effects 0.000 claims abstract description 21
- 239000003960 organic solvent Substances 0.000 claims abstract description 15
- 239000000110 cooling liquid Substances 0.000 claims abstract description 13
- 230000017525 heat dissipation Effects 0.000 claims abstract description 13
- 238000009413 insulation Methods 0.000 claims abstract description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 238000012546 transfer Methods 0.000 abstract description 15
- 238000005265 energy consumption Methods 0.000 abstract description 10
- 239000012530 fluid Substances 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 239000002826 coolant Substances 0.000 abstract description 6
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007791 dehumidification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to an immersed heat dissipation device for a data center, which comprises a liquid cooling cabinet, cooling liquid and a plurality of oscillating heat pipes, wherein the cooling liquid is filled in the liquid cooling cabinet, evaporation areas of the oscillating heat pipes extend into the liquid cooling cabinet, condensation areas of the oscillating heat pipes are positioned on the outer side of the liquid cooling cabinet, media are filled in tube bundles of the oscillating heat pipes, the media are organic solvents, a connection area between the oscillating heat pipes and the side wall of the liquid cooling cabinet is a heat insulation area, and the heat insulation area is positioned between the condensation area and the evaporation area. The heat in the cooling liquid is transferred to the outer side of the liquid cooling cabinet by the oscillating heat pipe. Heating element gives the coolant liquid with heat transfer, and the evaporation zone submergence of heat pipe bundle absorbs the heat of coolant liquid in the coolant liquid, and the organic solvent that has certain pressure of pouring in the heat pipe bundle is as the medium, and the medium is heated the back evaporation, forms the alternate plunger type fluid of gas-liquid in the heat pipe bundle, and plunger type fluid transmits the heat to the condensation zone of heat pipe bundle rapidly. High heat transfer coefficient, low energy consumption, energy saving and environmental protection.
Description
Technical Field
The invention belongs to the technical field of liquid cooling, and particularly relates to an immersed heat dissipation device for a data center.
Background
The information in this background section is only for enhancement of understanding of the general background of the invention and is not necessarily to be construed as an admission or any form of suggestion that this information forms the prior art that is already known to a person of ordinary skill in the art.
With the continuous development of the internet and computer technology, the construction of data centers under the background of the big data era is also in rapid development, and the rapid development of big data brings opportunities and new challenges to the development of computers. As global data processing demands continue to rise, the high energy consumption index also presents new challenges for the rapid development of data centers. Research reports from Global Market Insights (GMI) show that the current electricity usage in a data center accounts for approximately 3% of the total electricity usage worldwide, which is projected to rise to 8% by 2030. Because the energy consumption of the cooling system accounts for about 40% of the total energy consumption of the data center, the demand for intelligent energy-saving solutions is expected to promote the continuous growth of the cooling market of the data center.
The concept of data center energy utilization rate (PUE) is proposed by Christian Belady in 2006, the value of the PUE of the data center is equal to the ratio of total energy consumption of the data center to energy consumption of IT equipment, and the smaller the ratio is, the higher the energy utilization rate of the data center is, and the more the data center meets the low-carbon and energy-saving standards. At present, on a small scale in China, the value of the small-scale data can be as high as about 3, compared with international IT enterprises, Yahoo data centers (PUE ═ 1.08), Facebook data centers (PUE ═ 1.15), Google Belgium data centers (PUE ═ 1.16), Hewlett-packard data centers (PUE ═ 1.16), Microsoft Dublin data centers (PUE ═ 1.25) and Microsoft Ireland Dublin data centers, innovative design of a free cooling system and hot channel control are adopted, and the PUE value of the small-scale data centers is far lower than 1.6 of other Microsoft data centers. However, the average PUE value of all self-developed data centers of IT enterprises with leading national technical level, such as Ali baba, is lower than 1.3, and the actually measured annual PUE value of Shenzhen Guangming data center in Tengchen in 2018 is 1.26, which has a certain gap with international advanced enterprises.
The traditional data center cooling system adopts a precise air conditioner (namely, an air cooling technology) to cool a room where a cabinet is located, and because the heat productivity of the data center is very large and the basic constant temperature and humidity is required to operate continuously forever, the cooling system which is suitable for the data center has the advantages of high reliability (redundant spare machines are arranged in general designs), large refrigerating capacity, small temperature difference and large air quantity, and the air conditioning system of the data center has remarkable particularity, namely, the data center operates continuously all year round and has very large working condition difference; and secondly, the temperature and humidity control precision is high, and the additional energy consumed by the dehumidification, humidification, heating, small temperature difference and large air volume is more than that consumed by a common civil air conditioning system, which is mainly reflected in that the power consumption of the air system is high and a local high-temperature area is generated in a cabinet of a data center part. The IT equipment in the high temperature area can not work normally or even stop working, and the high temperature environment can shorten the service life of the equipment, causing immeasurable economic loss. But the air cooling technology is still the mainstream heat dissipation technology in the field of the current data center because the cost is lower and the installation and deployment are simpler.
In recent years, with the rapid increase of the heat flux density of the data center, the liquid cooling technology has the advantages of outstanding cooling effect, low energy consumption and the like, and gradually becomes one of the key technologies for solving the problem of heat dissipation of the data center in the future. The cooling system of the immersion type liquid cooling server disclosed in the prior art comprises a server case, a case cover, a heat dissipation set piece, a radiator, an oil collecting tank and an oil pump. The system has high heat transfer efficiency, realizes the effects of energy conservation and environmental protection, can effectively cool local flowing of heating elements such as chips and the like, is easy to equalize temperature, and is beneficial to more effectively radiating the heating chips. The oil pump has the disadvantages that the noise is high in the operation process of the oil pump, the energy consumption is increased, the vibration is also a hidden trouble in the safe and stable operation of the system, and the cost is increased due to the selection of the radiator and the refrigerant.
Both direct cooling and submerged cooling systems have the disadvantages of high cost, high vibration or noise, and limited space in the machine room.
Disclosure of Invention
In view of the above problems in the prior art, it is an object of the present invention to provide a data center submerged heat dissipation system.
In order to solve the technical problems, the technical scheme of the invention is as follows:
in a first aspect, the immersed heat dissipation device for the data center comprises a liquid cooling cabinet, cooling liquid and a plurality of oscillating heat pipes, wherein the cooling liquid is filled in the liquid cooling cabinet, evaporation areas of the oscillating heat pipes extend into the liquid cooling cabinet, condensation areas of the oscillating heat pipes are located on the outer side of the liquid cooling cabinet, media are filled in tube bundles of the oscillating heat pipes, the media are organic solvents, a connection area of the oscillating heat pipes and the side wall of the liquid cooling cabinet is a heat insulation area, and the heat insulation area is located between the condensation area and the evaporation area.
The invention utilizes the oscillating heat pipe to radiate the liquid cooling cabinet. The radiating effect of the liquid cooling cabinet is better by fully utilizing the radiating characteristic of the oscillating heat pipe, and external power is not required. The vibration and the noise are small. The installation form of the oscillating heat pipe is flexible and is not limited by the space of a machine room.
Under the condition that the tube is vacuumized, a certain amount of organic solvent is poured as a medium, and the liquid does not fill the inner cavity of the whole oscillating heat pipe bundle. The medium forms a plunger type fluid with gas-liquid phase under the action of the temperature difference of the cold end and the hot end and the surface tension, and the fluid randomly appears in the pipeline.
The heat generated in the liquid cooling cabinet is transferred to the oscillating heat pipe through the cooling liquid, the organic solvent is heated to evaporate in the evaporation area of the oscillating heat pipe, then a plunger type fluid with alternate gas and liquid is formed in the tube bundle of the oscillating heat pipe, the liquid film between the gas-liquid column and the tube wall is continuously evaporated due to heating, so that the vapor bubble expands, and the gas-liquid plunger is pushed to flow to the condensation area for condensation and contraction, so that a larger pressure difference is formed between the cold end and the hot end. Because the gas-liquid plungers are distributed in a staggered mode, strong reciprocating oscillation motion is generated in the pipe, and efficient heat transfer is achieved. The condensation area of the oscillating heat pipe gives off heat, the heat of the condensation area can be taken away through the cooling effect of natural wind, external mechanical work and electric work are not required to be consumed in the whole heat transfer process, and energy consumption equipment such as a fan and a pump is not required.
In a second aspect, the data center submerged heat sink is applied to data center submerged heat dissipation.
The invention has the beneficial effects that:
(1) the cooling liquid is in direct contact with the heating equipment, so that the heat-transfer cooling device has low convection thermal resistance, high heat transfer coefficient, uniform heat dissipation and good heat dissipation effect, and can quickly take away heat;
(2) the oscillating heat pipe has small thermal resistance, excellent heat transfer performance, simple mechanism, flexible arrangement, no influence of direction, arbitrary bending and no influence of machine room space, and the medium in the heat pipe is organic solvent, so that the working starting temperature is low, and the cooling liquid can be ensured to keep lower temperature;
(3) the heat transfer process of the whole system does not need to consume external mechanical work and electric work, and belongs to self-oscillation heat transfer under thermal drive. Can effectively reduce the energy consumption of the system, and is energy-saving and environment-friendly.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the invention and not to limit the invention.
FIG. 1 is a block diagram of a data center submerged heat sink of the present invention;
FIG. 2 is a front view of an oscillating heat pipe of the present invention;
FIG. 3 is a side view of an oscillating heat pipe of the present invention;
FIG. 4 is a side view of an oscillating heat pipe of the present invention;
the system comprises a machine room 1, a machine room 2, a first liquid cooling cabinet 3, a second liquid cooling cabinet 4, a third liquid cooling cabinet 5, a server 6, an oscillating heat pipe 7, a condensation area 8, a heat insulation area 9 and an evaporation area.
Detailed Description
It is to be understood that the following detailed description is exemplary and is intended to provide further explanation of the invention as claimed. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
In a first aspect, the immersed heat dissipation device for the data center comprises a liquid cooling cabinet, cooling liquid and a plurality of oscillating heat pipes, wherein the cooling liquid is filled in the liquid cooling cabinet, evaporation areas of the oscillating heat pipes extend into the liquid cooling cabinet, condensation areas of the oscillating heat pipes are located on the outer side of the liquid cooling cabinet, media are filled in tube bundles of the oscillating heat pipes, the media are organic solvents, a connection area of the oscillating heat pipes and the side wall of the liquid cooling cabinet is a heat insulation area, and the heat insulation area is located between the condensation area and the evaporation area.
The heat in the cooling liquid is transferred to the outer side of the liquid cooling cabinet by the oscillating heat pipe. The inside of liquid cooling rack is the part that generates heat owing to have equipment such as server, and heating element gives the coolant liquid with heat transfer, and the evaporation zone submergence of heat pipe bundle absorbs the heat of coolant liquid in the coolant liquid, and the organic solvent that has certain pressure in pouring into the heat pipe bundle is as the medium, and the medium evaporates after being heated, forms the alternate plunger type fluid of gas-liquid in the heat pipe bundle, and plunger type fluid transmits the heat to the condensation zone of heat pipe bundle rapidly.
In some embodiments of the invention, the oscillating heat pipe is a serpentine closed loop structure. The oscillating heat pipe is a snake-shaped loop pipe, a medium is pre-filled in the oscillating heat pipe, and the medium can freely flow in the oscillating heat pipe and flows from one end to the other end.
The evaporation zone in the tube bundle of the oscillating heat pipe is heated, the liquid in the tube bundle is subjected to bubble boiling, the whole process is fast, and the inside of the tube is in a vacuum state, so that noise is avoided.
In some embodiments of the invention, the organic solvent is ethanol. The organic solvent has different physical properties. The specific heat capacity and the latent heat of vaporization of organic solvents such as methanol, ethanol, acetone and the like are large, the heat transfer effect of the oscillating heat pipe is good when the oscillating heat pipe is used as a working medium, meanwhile, the dynamic viscosity is small, and the effect of forming a plunger piston during flowing is good. The boiling point of the ethanol is higher than that of the two organic solvents, so that the phenomenon of drying is avoided.
In some embodiments of the present invention, the oscillating heat pipe has a pipe diameter of 1 to 3 mm. The pipe diameter can realize the coexistence of liquid stopper and bubble in above-mentioned within range, and the size of pipe diameter influences the formation of gas-liquid stopper fluid, so a suitable pipe diameter scope has been selected in this application, can not lead to the flow resistance too big and exert an influence to the oscillation effect when helping realizing the formation of gas-liquid stopper stream.
In some embodiments of the invention, the tube bundle of oscillating heat pipes is a tube bundle of legs or a bundle of curved shapes. The oscillating heat pipe has the advantage of variable shape.
In some embodiments of the present invention, the number of channel bends of the oscillating heat pipe is not particularly limited, but is not preferably less than 15. The oscillating heat pipe is the structure of snakelike return circuit, and the elbow number is too few can influence the heat pipe and start, along with the increase of elbow number, can make heat transfer area increase, and the heat pipe starts more easily, and heat transfer performance is better, and the operation is also more stable, specifically can arrange according to actual conditions.
In some embodiments of the present invention, the ratio of the length (or area) of the evaporation zone to the condensation zone of the oscillating heat pipe is 1: 1.5-2.5; preferably 1: 2.
in some embodiments of the invention, the oscillating heat pipe has a liquid fill ratio of 35-50%. The liquid filling rate is the percentage of the total volume of the working medium in the total volume of the interior of the oscillating heat pipe, and the proper liquid filling rate can improve the heat exchange performance and reduce the heat transfer resistance.
In a second aspect, the data center submerged heat sink is applied to data center submerged heat dissipation.
The invention will be further illustrated by the following examples
Example 1
Three liquid cooling cabinets are arranged in one machine room 1, a plurality of servers 5 are arranged in the liquid cooling cabinets, and the servers 5 are arranged in a layered mode. The three liquid cooling cabinets are respectively a first liquid cooling cabinet 2, a second liquid cooling cabinet 3 and a third liquid cooling cabinet 4, and the oscillating heat pipes arranged on the first liquid cooling cabinet 2 are arranged in an L shape. The evaporation area 9 is positioned in the liquid cooling cabinet, the condensation area 7 is positioned on the outer side of the machine room, and the heat insulation area 8 is positioned in the connection area of the machine room and the liquid cooling cabinet. Fig. 3 shows a side view of the oscillating heat pipe 6 of the first liquid-cooled cabinet 1, the oscillating heat pipe is L-shaped, the evaporation area 9 of the oscillating heat pipe 6 absorbs heat of the liquid-cooled cabinet, then the heat is dissipated to air in the condensation area 7, and the air flows in the condensation area 7 and exchanges heat with the oscillating heat pipe 6.
The oscillating heat pipe 6 of the second liquid cooling cabinet 3 extends into the liquid cooling cabinet from the top of the liquid cooling cabinet, as shown in fig. 2. The tube bundle of the oscillating heat pipe 6 is a straight pipe. The condensation zone 7 and the heat insulation zone 8 of the oscillating heat pipe 6 arranged in the third liquid cooling cabinet 4 are arranged in an L shape, and the oscillating heat pipe 9 in the evaporation zone is in a bent pipe shape, as shown in fig. 4. The oscillating heat pipes 6 of the third liquid-cooling cabinet 4 are arranged in a different manner from the oscillating heat pipes of the first liquid-cooling cabinet 2. The heat insulation area of the third liquid cooling cabinet 4 is distributed in the middle of the third liquid cooling cabinet 4 in a centralized manner, and then the oscillating heat pipes 6 of the evaporation area 9 are arranged in the liquid cooling cabinet in a radial manner.
The height of the first liquid cooling cabinet 2, the second liquid cooling cabinet 3 and the third liquid cooling cabinet 4 is 2m, and the pipe diameter of the oscillating heat pipe 6 is 2 mm. The organic solvent medium in the tube bundle is ethanol, and the liquid filling rate is 40%. The number of channel bends of the oscillating heat pipe is not particularly limited, but is not preferably less than 15.
The heat flux density of this example was 1000W/cm2。
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A data center submergence formula heat abstractor which characterized in that: the liquid cooling cabinet comprises a liquid cooling cabinet, cooling liquid and a plurality of oscillating heat pipes, wherein the cooling liquid is filled in the liquid cooling cabinet, evaporation areas of the oscillating heat pipes extend into the liquid cooling cabinet, condensation areas of the oscillating heat pipes are located on the outer side of the liquid cooling cabinet, media are filled in tube bundles of the oscillating heat pipes, the media are organic solvents, connection areas of the oscillating heat pipes and the side wall of the liquid cooling cabinet are heat insulation areas, and the heat insulation areas are located between the condensation areas and the evaporation areas.
2. The data center submerged heat sink of claim 1, wherein: the oscillating heat pipe is of a snake-shaped closed loop structure.
3. The data center submerged heat sink of claim 1, wherein: the organic solvent is ethanol.
4. The data center submerged heat sink of claim 1, wherein: the diameter of the oscillating heat pipe is 1-3 mm.
5. The data center submerged heat sink of claim 1, wherein: the tube bundle of the oscillating heat pipe is a branch tube bundle or a bent-shaped tube bundle.
6. The data center submerged heat sink of claim 1, wherein: the number of channel bends of the oscillating heat pipe is not less than 15.
7. The data center submerged heat sink of claim 1, wherein: the length ratio of the evaporation area to the condensation area of the oscillating heat pipe is 1: 1.5-2.5.
8. The data center submerged heat sink of claim 7, wherein: the length ratio of the evaporation area to the condensation area of the oscillating heat pipe is 1: 2.
9. the data center submerged heat sink of claim 1, wherein: the liquid filling rate of the oscillating heat pipe is 35-50%.
10. Use of a data center submerged heat sink according to any of claims 1-9 for data center submerged heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010663551.1A CN111669952A (en) | 2020-07-10 | 2020-07-10 | Data center submergence formula heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010663551.1A CN111669952A (en) | 2020-07-10 | 2020-07-10 | Data center submergence formula heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111669952A true CN111669952A (en) | 2020-09-15 |
Family
ID=72392148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010663551.1A Pending CN111669952A (en) | 2020-07-10 | 2020-07-10 | Data center submergence formula heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111669952A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112708398A (en) * | 2020-12-30 | 2021-04-27 | 兰洋(宁波)科技有限公司 | Cooling liquid for cooling integrated chip circuit board |
| CN112714597A (en) * | 2020-12-25 | 2021-04-27 | 兰洋(宁波)科技有限公司 | Immersive cooling system for data center |
| CN113099694A (en) * | 2021-04-06 | 2021-07-09 | 龚晶晶 | Terminal equipment for industrial equipment information management based on big data |
| CN114916192A (en) * | 2022-04-18 | 2022-08-16 | 西安华为数字能源技术有限公司 | Capsule heat exchanger, liquid cooling tank and liquid cooling system |
| CN115981434A (en) * | 2023-02-15 | 2023-04-18 | 苏州浪潮智能科技有限公司 | Liquid cooling circulation system and method for server, electronic device and storage medium |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101907414A (en) * | 2010-07-26 | 2010-12-08 | 华北电力大学 | Combined oscillatory flow heat pipe with evaporation and heat exchange connecting section |
| CN108775827A (en) * | 2018-03-29 | 2018-11-09 | 中国科学院广州能源研究所 | Oscillating heat pipe and the method for realizing high charge download cable heat dissipation using oscillating heat pipe |
| CN109195424A (en) * | 2018-11-06 | 2019-01-11 | 北京中热信息科技有限公司 | A kind of heat pipe exchanging type electronic equipment liquid cooling system |
| CN110556347A (en) * | 2019-08-02 | 2019-12-10 | 中国地质大学（武汉） | Liquid metal composite oscillation heat pipe type heat temperature difference power generation and refrigeration radiator |
| CN110581114A (en) * | 2019-09-18 | 2019-12-17 | 山东大学 | Heat pipe, phase change material and immersed liquid cooling combined heat dissipation system |
| CN212519805U (en) * | 2020-07-10 | 2021-02-09 | 山东省科学院能源研究所 | Data center submergence formula heat abstractor |
-
2020
- 2020-07-10 CN CN202010663551.1A patent/CN111669952A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101907414A (en) * | 2010-07-26 | 2010-12-08 | 华北电力大学 | Combined oscillatory flow heat pipe with evaporation and heat exchange connecting section |
| CN108775827A (en) * | 2018-03-29 | 2018-11-09 | 中国科学院广州能源研究所 | Oscillating heat pipe and the method for realizing high charge download cable heat dissipation using oscillating heat pipe |
| CN109195424A (en) * | 2018-11-06 | 2019-01-11 | 北京中热信息科技有限公司 | A kind of heat pipe exchanging type electronic equipment liquid cooling system |
| CN110556347A (en) * | 2019-08-02 | 2019-12-10 | 中国地质大学（武汉） | Liquid metal composite oscillation heat pipe type heat temperature difference power generation and refrigeration radiator |
| CN110581114A (en) * | 2019-09-18 | 2019-12-17 | 山东大学 | Heat pipe, phase change material and immersed liquid cooling combined heat dissipation system |
| CN212519805U (en) * | 2020-07-10 | 2021-02-09 | 山东省科学院能源研究所 | Data center submergence formula heat abstractor |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112714597A (en) * | 2020-12-25 | 2021-04-27 | 兰洋(宁波)科技有限公司 | Immersive cooling system for data center |
| CN112708398A (en) * | 2020-12-30 | 2021-04-27 | 兰洋(宁波)科技有限公司 | Cooling liquid for cooling integrated chip circuit board |
| CN113099694A (en) * | 2021-04-06 | 2021-07-09 | 龚晶晶 | Terminal equipment for industrial equipment information management based on big data |
| CN114916192A (en) * | 2022-04-18 | 2022-08-16 | 西安华为数字能源技术有限公司 | Capsule heat exchanger, liquid cooling tank and liquid cooling system |
| CN115981434A (en) * | 2023-02-15 | 2023-04-18 | 苏州浪潮智能科技有限公司 | Liquid cooling circulation system and method for server, electronic device and storage medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111669952A (en) | Data center submergence formula heat abstractor | |
| Yuan et al. | Phase change cooling in data centers: A review | |
| CN207652877U (en) | The cooling system of liquid cooling server | |
| Xiahou et al. | Novel heat pipe radiator for vertical CPU cooling and its experimental study | |
| CN101886836B (en) | Machine room heat removal device for evaporation cooling type heat-pipe heat exchange | |
| CN108882654B (en) | Phase change cooling system, cooling system and converter cabinet cooling system | |
| CN102222993B (en) | Hydraulic pump driven heat pipe cooling device for natural cooling | |
| CN106855741A (en) | A kind of heat abstractor and system for blade server chip | |
| CN111988965B (en) | High-heating electronic equipment immersion type phase change cooling cabinet | |
| Li et al. | Thermal characteristics of a flat plate pulsating heat pipe module for onsite cooling of high power server CPUs | |
| CN111465299A (en) | Liquid cooling system combining data center immersion type and indirect contact type | |
| Han et al. | Study on influence of operating parameters of data center air conditioning system based on the concept of on-demand cooling | |
| CN212519805U (en) | Data center submergence formula heat abstractor | |
| Zhang et al. | Energy saving potential analysis of two-phase immersion cooling system with multi-mode condenser | |
| CN202216595U (en) | Liquid pump driving heat pipe cooling device for natural cooling | |
| CN112584676B (en) | Semi-immersed solution evaporation radiator | |
| CN101296600A (en) | Radiating assembly and electronic device using the same | |
| CN112105231B (en) | Pulsating heat pipe type blade server thermal management system | |
| CN211090398U (en) | Liquid immersion type server cabinet and cooling system thereof | |
| CN101022717A (en) | Liquid self-loop composite heat pipe radiating device used for electronic equipment | |
| US11317536B2 (en) | High-efficiency phase-change condenser of a supercomputer | |
| CN106132176A (en) | Rack complete cabinet tube-fin type heat dissipation system | |
| CN201661616U (en) | Cooling structure for plate-type sliding bearing | |
| CN218103982U (en) | Heat radiator | |
| CN220674233U (en) | Liquid cooling system for data center |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |