CN112708398A - Cooling liquid for cooling integrated chip circuit board - Google Patents
Cooling liquid for cooling integrated chip circuit board Download PDFInfo
- Publication number
- CN112708398A CN112708398A CN202011607543.1A CN202011607543A CN112708398A CN 112708398 A CN112708398 A CN 112708398A CN 202011607543 A CN202011607543 A CN 202011607543A CN 112708398 A CN112708398 A CN 112708398A
- Authority
- CN
- China
- Prior art keywords
- parts
- cooling
- circuit board
- cooling liquid
- chip circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/10—Liquid materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
Abstract
The invention discloses a cooling liquid for cooling an integrated chip circuit board, which consists of the following raw material components in parts by weight: glycerol, 20-25 parts of triethanolamine, perfluorohexanone, tetrafluoroethane, difluorochloromethane, chlorobutanol and benzimidazole; paraffin, dimethyl silicone oil, silicon dioxide, hydroxyl silicone oil and tributyl phosphate. The immersed phase-change cooling medium provided by the invention has the advantages of high electrical insulation performance, low viscosity, lower boiling point, high thermal conductivity, high latent heat of vaporization, good compatibility and stability, incombustibility and capability of inhibiting combustion, and can effectively protect circuits in a computer mainboard, prevent dirt and ensure the safe operation of a computer system. The invention is used by matching with a device for accelerating the flow of the cooling liquid, so that the components such as paraffin, dimethyl silicon oil, silicon dioxide and the like are added to carry out defoaming treatment on the cooling liquid accelerating the flow, and the cooling effect of the invention is further improved.
Description
Technical Field
The invention belongs to the field of cooling liquid, and particularly relates to cooling liquid for cooling an integrated chip circuit board.
Background
With the rapid development of modern electronic power technology, the electronic power integration level is higher and higher, the performance is better and better, and the heat dissipation difficulty is higher and higher. In order to facilitate the management and safe operation of equipment, many electronic and electric devices are arranged in special cases. To ensure proper operation of the equipment, heat must be conducted away from the heat generating components to the environment. At present, the special cases mainly use an air cooling technology, and radiate the equipment by reducing the ambient temperature and performing forced ventilation, so that the situation that the equipment cannot normally run due to thermal overload is reduced. However, the method has the disadvantages of high energy consumption, relatively low efficiency, high space requirement, high noise and the like.
An immersion cooling technique is now developed, in which a heat-conducting liquid is used as a heat-transfer medium, all or part of heating elements are silenced in the heat-conducting liquid, the heating elements directly contact with the liquid and exchange heat to realize heat dissipation, and the liquid immersion cooling technique directly absorbs heat from a heat source, i.e., a core processing unit, a memory module and the like in a special chassis, so that safety factors are eliminated, and energy consumption and space are reduced. The existing immersed cooling liquid is mainly divided into inert liquids such as mineral oil, kerosene and the like for heat conduction, but the mineral oil and the kerosene have poor liquidity and poor heat dissipation effect, and once equipment generates sparks, combustion and explosion easily occur, so that the cooling liquid for cooling the integrated chip circuit board, which has good liquidity and high heat dissipation efficiency, is very important to obtain.
Disclosure of Invention
In order to solve the technical problem, the invention provides a cooling liquid for cooling an integrated chip circuit board, which comprises the following raw material components in parts by weight: 50-100 parts of glycerol, 20-25 parts of triethanolamine, 120 parts of perfluorohexanone, 20-50 parts of tetrafluoroethane, 20-40 parts of difluorochloromethane, 10-20 parts of chlorobutanol and 10-15 parts of benzimidazole; 1-2 parts of paraffin, 15-25 parts of dimethyl silicone oil, 2-5 parts of silicon dioxide, 10-20 parts of hydroxyl silicone oil and 5-20 parts of tributyl phosphate.
Preferably, the cooling liquid for cooling the integrated chip circuit board consists of the following raw material components in parts by weight: the material consists of the following raw materials in parts by weight: 50 parts of glycerol, 20 parts of triethanolamine, 100 parts of perfluorohexanone, 20 parts of tetrafluoroethane, 20 parts of difluorochloromethane, 10 parts of chlorobutanol and 10 parts of benzimidazole; 1 part of paraffin, 15 parts of dimethyl silicone oil, 2 parts of silicon dioxide, 10 parts of hydroxyl silicone oil and 5 parts of tributyl phosphate.
Preferably, the cooling liquid for cooling the integrated chip circuit board consists of the following raw material components in parts by weight: the material consists of the following raw materials in parts by weight: 100 parts of glycerol, 25 parts of triethanolamine, 120 parts of perfluorohexanone, 50 parts of tetrafluoroethane, 40 parts of difluorochloromethane, 20 parts of chlorobutanol and 15 parts of benzimidazole; 2 parts of paraffin, 25 parts of dimethyl silicone oil, 5 parts of silicon dioxide, 20 parts of hydroxyl silicone oil and 20 parts of tributyl phosphate.
Preferably, the cooling liquid for cooling the integrated chip circuit board consists of the following raw material components in parts by weight: the material consists of the following raw materials in parts by weight: 75 parts of glycerol, 23 parts of triethanolamine, 110 parts of perfluorohexanone, 35 parts of tetrafluoroethane, 30 parts of difluorochloromethane, 15 parts of chlorobutanol and 13 parts of benzimidazole; 1 part of paraffin, 20 parts of dimethyl silicone oil, 4 parts of silicon dioxide, 15 parts of hydroxyl silicone oil and 23 parts of tributyl phosphate.
The perfluorohexanone is replaced by one of hexafluoropropylene trimer, perfluoroheptane and perfluorooctane.
The preparation method of the cooling liquid for cooling the integrated chip circuit board comprises the following steps: according to the combination ratio, the components are physically mixed at normal temperature and normal pressure until the components are uniformly mixed.
Use of a cooling liquid for cooling an integrated chip circuit board in an electronic device: and immersing the circuit board of the equipment host, the server or the processor in the cooling liquid for cooling the integrated chip circuit board, and flushing the circuit board of the equipment host, the server or the processor by the cooling liquid for cooling the integrated chip circuit board to take away heat of the processor so as to carry out cooling treatment.
The cooling system for the cooling liquid for cooling the integrated chip circuit board comprises a cooling groove, a flow guide structure and a cooling liquid cooling system, wherein the circuit board is placed in the cooling groove; the cooling device further comprises a circulating pump, wherein the circulating pump is used for transferring the cooling liquid for cooling the integrated chip circuit board to a high terrain from a low terrain, and the cooling liquid for cooling the integrated chip circuit board forms a height difference to wash the circuit board. The cooling system also comprises a condensation pipe, and the condensation pipe is connected between the outlet of the circulating pump and the inlet of the cooling tank. The flow guide structure can be a flow guide fan or a flow guide inclined plane so as to enable the cooling liquid for cooling the integrated chip circuit board to flush the circuit board.
Compared with the prior art, the invention has the advantages that: the immersed phase-change cooling medium provided by the invention has the advantages of high electrical insulation performance, low viscosity, lower boiling point, high thermal conductivity, high latent heat of vaporization, good compatibility and stability, incombustibility and capability of inhibiting combustion, and can effectively protect circuits in a computer mainboard, prevent dirt and ensure the safe operation of a computer system. The invention is used by matching with a device for accelerating the flow of the cooling liquid, so that the components such as paraffin, dimethyl silicon oil, silicon dioxide and the like are added to carry out defoaming treatment on the cooling liquid accelerating the flow, and the cooling effect of the invention is further improved.
Drawings
FIG. 1 is a schematic diagram of a cooling system for a cooling fluid used for cooling an IC board according to the present invention;
reference numerals: 1-a cooling tank; 2-a flow guide structure; 3-a circuit board; 4-a circulating pump; 5-a condenser pipe.
Detailed Description
In order that those skilled in the art will better understand the invention and thus more clearly define the scope of the invention as claimed, it is described in detail below with respect to certain specific embodiments thereof. It should be noted that the following description is only a few examples of the present invention, and that certain embodiments of the inventive concepts are contemplated.
A cooling liquid for cooling an integrated chip circuit board comprises the following raw material components in parts by weight: 50-100 parts of glycerol, 20-25 parts of triethanolamine, 120 parts of perfluorohexanone, 20-50 parts of tetrafluoroethane, 20-40 parts of difluorochloromethane, 10-20 parts of chlorobutanol and 10-15 parts of benzimidazole; 1-2 parts of paraffin, 15-25 parts of dimethyl silicone oil, 2-5 parts of silicon dioxide, 10-20 parts of hydroxyl silicone oil and 5-20 parts of tributyl phosphate.
The following will be: the power supply is 600W, and the CPU model is as follows: i 9-9900K/KF. If a common fan is adopted for heat dissipation, the collected CPU temperature is 98 ℃, and the computer is halted.
The first embodiment is as follows: a cooling liquid for cooling an integrated chip circuit board comprises the following raw material components in parts by weight: the material consists of the following raw materials in parts by weight: 50 parts of glycerol, 20 parts of triethanolamine, 100 parts of perfluorohexanone, 20 parts of tetrafluoroethane, 20 parts of difluorochloromethane, 10 parts of chlorobutanol and 10 parts of benzimidazole; 1 part of paraffin, 15 parts of dimethyl silicone oil, 2 parts of silicon dioxide, 10 parts of hydroxyl silicone oil and 5 parts of tributyl phosphate. The cooling liquid for cooling the integrated chip circuit board, which is formed by the embodiment, has better heat conduction coefficient and good defoaming effect. In this example, the power supply is 600W, and the CPU model is: the temperature of a CPU of a computer host of i9-9900K/KF is 56 ℃, the temperature of cooling liquid is 39 ℃, and the computer normally runs for 24 hours.
Example two: a cooling liquid for cooling an integrated chip circuit board comprises the following raw material components in parts by weight: the material consists of the following raw materials in parts by weight: 100 parts of glycerol, 25 parts of triethanolamine, 120 parts of perfluorohexanone, 50 parts of tetrafluoroethane, 40 parts of difluorochloromethane, 20 parts of chlorobutanol and 15 parts of benzimidazole; 2 parts of paraffin, 25 parts of dimethyl silicone oil, 5 parts of silicon dioxide, 20 parts of hydroxyl silicone oil and 20 parts of tributyl phosphate. In this embodiment, the defoaming effect is better than that of the first embodiment, and the sterilization effect is better, and in this embodiment, the fluorine content is higher, so the heat conduction effect is better than that of the first embodiment. In this example, the power supply is 600W, and the CPU model is: the temperature of a CPU of a computer host of i9-9900K/KF is 50 ℃, the temperature of cooling liquid is 37 ℃, and the computer normally runs for 24 hours.
Example three: a cooling liquid for cooling an integrated chip circuit board comprises the following raw material components in parts by weight: the material consists of the following raw materials in parts by weight: 75 parts of glycerol, 23 parts of triethanolamine, 110 parts of perfluorohexanone, 35 parts of tetrafluoroethane, 30 parts of difluorochloromethane, 15 parts of chlorobutanol and 13 parts of benzimidazole; 1 part of paraffin, 20 parts of dimethyl silicone oil, 4 parts of silicon dioxide, 15 parts of hydroxyl silicone oil and 23 parts of tributyl phosphate. In the present embodiment, the defoaming effect, the sterilization effect, and the heat conduction effect are better than those between the first embodiment and the second embodiment. In this example, the power supply is 600W, and the CPU model is: the temperature of a CPU of a computer host of i9-9900K/KF is 53 ℃, the temperature of cooling liquid is 38 ℃, and the computer normally runs for 24 hours.
The perfluorohexanone is replaced by one of hexafluoropropylene trimer, perfluoroheptane and perfluorooctane.
Example four: a cooling liquid for cooling an integrated chip circuit board comprises the following raw material components in parts by weight: the material consists of the following raw materials in parts by weight: 75 parts of glycerol, 23 parts of triethanolamine, 110 parts of hexafluoropropylene trimer, 35 parts of tetrafluoroethane, 30 parts of difluorochloromethane, 15 parts of chlorobutanol and 13 parts of benzimidazole; 1 part of paraffin, 20 parts of dimethyl silicone oil, 4 parts of silicon dioxide, 15 parts of hydroxyl silicone oil and 23 parts of tributyl phosphate. Hexafluoropropylene trimer has advanced thermal conductivity properties, so in this example hexafluoropropylene trimer is substituted for perfluorohexanone. In this example, the power supply is 600W, and the CPU model is: the temperature of a CPU of a computer host of i9-9900K/KF is 51 ℃, the temperature of cooling liquid is 37 ℃, and the computer normally runs for 24 hours.
Example five: a cooling liquid for cooling an integrated chip circuit board comprises the following raw material components in parts by weight: the material consists of the following raw materials in parts by weight: 75 parts of glycerol, 23 parts of triethanolamine, 110 parts of perfluoroheptane, 35 parts of tetrafluoroethane, 30 parts of difluorochloromethane, 15 parts of chlorobutanol and 13 parts of benzimidazole; 1 part of paraffin, 20 parts of dimethyl silicone oil, 4 parts of silicon dioxide, 15 parts of hydroxyl silicone oil and 23 parts of tributyl phosphate. Better inertia than perfluoroheptane, high density, low viscosity, excellent insulation effect and excellent heat-conducting cooling effect, therefore, perfluoroheptane is used to replace perfluorohexanone in this embodiment. In this example, the power supply is 600W, and the CPU model is: the temperature of a CPU of a computer host of i9-9900K/KF is 50 ℃, the temperature of cooling liquid is 39 ℃, and the computer normally runs for 24 hours.
Example six: a cooling liquid for cooling an integrated chip circuit board comprises the following raw material components in parts by weight: the material consists of the following raw materials in parts by weight: 75 parts of glycerol, 23 parts of triethanolamine, 110 parts of perfluorooctane, 35 parts of tetrafluoroethane, 30 parts of chlorodifluoromethane, 15 parts of chlorobutanol and 13 parts of benzimidazole; 1 part of paraffin, 20 parts of dimethyl silicone oil, 4 parts of silicon dioxide, 15 parts of hydroxyl silicone oil and 23 parts of tributyl phosphate. Perfluorooctane has stable chemical properties and good heat resistance, and is commonly used as a cooling medium and an insulating fluid in electrical equipment, so that perfluorooctane is used for replacing perfluorohexanone. In this example, the power supply is 600W, and the CPU model is: the temperature of a CPU of a computer host of i9-9900K/KF is 53 ℃, the temperature of cooling liquid is 39 ℃, and the computer normally runs for 24 hours.
The preparation method of the cooling liquid for cooling the integrated chip circuit board comprises the following steps: according to the combination ratio, the components are physically mixed at normal temperature and normal pressure until the components are uniformly mixed.
Use of a cooling liquid for cooling an integrated chip circuit board in an electronic device: and immersing the circuit board of the equipment host, the server or the processor in the cooling liquid for cooling the integrated chip circuit board, and flushing the circuit board of the equipment host, the server or the processor by the cooling liquid for cooling the integrated chip circuit board to take away heat of the processor so as to carry out cooling treatment.
As shown in fig. 1, the cooling system for cooling the cooling liquid for the ic chip circuit board includes a cooling tank 1, a circuit board 3 is disposed in the cooling tank 1, and a flow guide structure 2, wherein the flow guide structure 2 guides the cooling liquid for cooling the ic chip circuit board to the circuit board 3, so that the cooling liquid for cooling the ic chip circuit board washes the circuit board 3 and then takes away heat generated by the circuit board 3; still include circulating pump 4, circulating pump 4 will be used for the coolant liquid of integrated chip circuit board cooling usefulness to transport to high relief from low relief for the coolant liquid of integrated chip circuit board cooling usefulness forms the difference in height in order to wash circuit board 3. And the condenser pipe 5 is connected between the outlet of the circulating pump 4 and the inlet of the cooling tank 1. The flow guiding structure 2 may be a flow guiding fan or a flow guiding inclined plane to wash the circuit board 3 with a cooling liquid for cooling the ic circuit board.
Compared with the prior art, the invention has the advantages that: the immersed phase-change cooling medium provided by the invention has the advantages of high electrical insulation performance, low viscosity, lower boiling point, high thermal conductivity, high latent heat of vaporization, good compatibility and stability, incombustibility and capability of inhibiting combustion, and can effectively protect circuits in a computer mainboard, prevent dirt and ensure the safe operation of a computer system. The invention is used by matching with a device for accelerating the flow of the cooling liquid, so that the components such as paraffin, dimethyl silicon oil, silicon dioxide and the like are added to carry out defoaming treatment on the cooling liquid accelerating the flow, and the cooling effect of the invention is further improved.
The above description is not intended to limit the present invention, and the present invention is not limited to the above examples, and variations, modifications, additions and substitutions which may be made by those skilled in the art within the spirit of the present invention are within the scope of the present invention.
Claims (9)
1. A cooling liquid for cooling an integrated chip circuit board, characterized in that: the material consists of the following raw materials in parts by weight: 50-100 parts of glycerol, 20-25 parts of triethanolamine, 120 parts of perfluorohexanone, 20-50 parts of tetrafluoroethane, 20-40 parts of difluorochloromethane, 10-20 parts of chlorobutanol and 10-15 parts of benzimidazole; 1-2 parts of paraffin, 15-25 parts of dimethyl silicone oil, 2-5 parts of silicon dioxide, 10-20 parts of hydroxyl silicone oil and 5-20 parts of tributyl phosphate.
2. The cooling liquid for cooling an ic chip circuit board according to claim 1, wherein: the material consists of the following raw materials in parts by weight: 50 parts of glycerol, 20 parts of triethanolamine, 100 parts of perfluorohexanone, 20 parts of tetrafluoroethane, 20 parts of difluorochloromethane, 10 parts of chlorobutanol and 10 parts of benzimidazole; 1 part of paraffin, 15 parts of dimethyl silicone oil, 2 parts of silicon dioxide, 10 parts of hydroxyl silicone oil and 5 parts of tributyl phosphate.
3. The cooling liquid for cooling an ic chip circuit board according to claim 1, wherein: the material consists of the following raw materials in parts by weight: 100 parts of glycerol, 25 parts of triethanolamine, 120 parts of perfluorohexanone, 50 parts of tetrafluoroethane, 40 parts of difluorochloromethane, 20 parts of chlorobutanol and 15 parts of benzimidazole; 2 parts of paraffin, 25 parts of dimethyl silicone oil, 5 parts of silicon dioxide, 20 parts of hydroxyl silicone oil and 20 parts of tributyl phosphate.
4. The cooling liquid for cooling an ic chip circuit board according to claim 1, wherein: the material consists of the following raw materials in parts by weight: 75 parts of glycerol, 23 parts of triethanolamine, 110 parts of perfluorohexanone, 35 parts of tetrafluoroethane, 30 parts of difluorochloromethane, 15 parts of chlorobutanol and 13 parts of benzimidazole; 1 part of paraffin, 20 parts of dimethyl silicone oil, 4 parts of silicon dioxide, 15 parts of hydroxyl silicone oil and 23 parts of tributyl phosphate.
5. The cooling liquid for cooling an ic chip circuit board according to claim 1, wherein: the perfluorohexanone is replaced by one of hexafluoropropylene trimer, perfluoroheptane and perfluorooctane.
6. The cooling liquid for cooling an ic chip circuit board according to claim 1, wherein: the preparation method of the cooling liquid for cooling the integrated chip circuit board comprises the following steps: according to the combination ratio, the components are physically mixed at normal temperature and normal pressure until the components are uniformly mixed.
7. Use of a cooling liquid for cooling an ic board according to any of claims 1-6 in an electronic device, wherein: and immersing the circuit board of the equipment host, the server or the processor in the cooling liquid for cooling the integrated chip circuit board, and flushing the circuit board of the equipment host, the server or the processor by the cooling liquid for cooling the integrated chip circuit board to take away heat of the processor so as to carry out cooling treatment.
8. The cooling system for a cooling liquid for an ic board according to claim 7, wherein: the cooling device comprises a cooling tank (1), wherein the circuit board is placed in the cooling tank (1), and the cooling device also comprises a flow guide structure (2), wherein the flow guide structure (2) guides cooling liquid for cooling the integrated chip circuit board to the circuit board (3), so that the cooling liquid for cooling the integrated chip circuit board washes the circuit board (3) and then takes away heat generated by the circuit board; the integrated chip circuit board cooling device is characterized by further comprising a circulating pump (4), wherein the circulating pump (4) is used for transferring the cooling liquid for cooling the integrated chip circuit board to a high terrain from a low terrain, and the cooling liquid for cooling the integrated chip circuit board forms a height difference to wash the circuit board (3).
9. The cooling system for a cooling liquid for an ic board according to claim 8, wherein: the cooling device also comprises a condensation pipe (5), wherein the condensation pipe (5) is connected between an outlet of the circulating pump (4) and an inlet of the cooling tank (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011607543.1A CN112708398A (en) | 2020-12-30 | 2020-12-30 | Cooling liquid for cooling integrated chip circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011607543.1A CN112708398A (en) | 2020-12-30 | 2020-12-30 | Cooling liquid for cooling integrated chip circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112708398A true CN112708398A (en) | 2021-04-27 |
Family
ID=75547164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011607543.1A Pending CN112708398A (en) | 2020-12-30 | 2020-12-30 | Cooling liquid for cooling integrated chip circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112708398A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130139998A1 (en) * | 2010-08-23 | 2013-06-06 | Fujitsu Limited | Cooling system, electronic equipment, and method for cooling heating element |
| CN108509004A (en) * | 2018-05-30 | 2018-09-07 | 广东合新材料研究院有限公司 | A kind of active heat-pipe radiating apparatus |
| CN109088126A (en) * | 2018-08-09 | 2018-12-25 | 中南大学 | Large capacity battery core battery and energy storage device |
| CN110162157A (en) * | 2019-03-29 | 2019-08-23 | 联想(北京)有限公司 | Cooling system |
| CN110572992A (en) * | 2019-09-18 | 2019-12-13 | 山东大学 | Immersed self-turbulent flow cooling system with four-corner tangential circles |
| CN110709373A (en) * | 2017-06-07 | 2020-01-17 | 3M创新有限公司 | Fluid for immersion cooling |
| CN111669952A (en) * | 2020-07-10 | 2020-09-15 | 山东省科学院能源研究所 | Data center submergence formula heat abstractor |
| CN111726971A (en) * | 2020-07-15 | 2020-09-29 | 浙江工业大学 | Immersed liquid phase-change cooling medium and application thereof in cooling system of electronic equipment |
| CN111777996A (en) * | 2020-07-16 | 2020-10-16 | 杭州师范大学 | Organic silicon cooling liquid containing phase change component and preparation method and application thereof |
-
2020
- 2020-12-30 CN CN202011607543.1A patent/CN112708398A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130139998A1 (en) * | 2010-08-23 | 2013-06-06 | Fujitsu Limited | Cooling system, electronic equipment, and method for cooling heating element |
| CN110709373A (en) * | 2017-06-07 | 2020-01-17 | 3M创新有限公司 | Fluid for immersion cooling |
| US20200178414A1 (en) * | 2017-06-07 | 2020-06-04 | 3M Innovative Properties Company | Fluids for immersion cooling |
| CN108509004A (en) * | 2018-05-30 | 2018-09-07 | 广东合新材料研究院有限公司 | A kind of active heat-pipe radiating apparatus |
| CN109088126A (en) * | 2018-08-09 | 2018-12-25 | 中南大学 | Large capacity battery core battery and energy storage device |
| CN110162157A (en) * | 2019-03-29 | 2019-08-23 | 联想(北京)有限公司 | Cooling system |
| CN110572992A (en) * | 2019-09-18 | 2019-12-13 | 山东大学 | Immersed self-turbulent flow cooling system with four-corner tangential circles |
| CN111669952A (en) * | 2020-07-10 | 2020-09-15 | 山东省科学院能源研究所 | Data center submergence formula heat abstractor |
| CN111726971A (en) * | 2020-07-15 | 2020-09-29 | 浙江工业大学 | Immersed liquid phase-change cooling medium and application thereof in cooling system of electronic equipment |
| CN111777996A (en) * | 2020-07-16 | 2020-10-16 | 杭州师范大学 | Organic silicon cooling liquid containing phase change component and preparation method and application thereof |
Non-Patent Citations (4)
| Title |
|---|
| 李波: "《汽车发动机构造与检修》", 31 January 2019, 华南理工大学出版社 * |
| 薜广波: "《实用消毒学》", 30 June 1986, 人民军医出版社 * |
| 钱苗根: "《材料表面技术及其应用手册》", 30 November 1998, 机械工业出版社 * |
| 马永祥: "《化学与生活》", 30 November 2017, 山东人民出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Capozzoli et al. | Cooling systems in data centers: state of art and emerging technologies | |
| US10888032B2 (en) | Apparatus for liquid immersion cooling, system for liquid immersion cooling, and method of cooling electronic device | |
| JP5590128B2 (en) | Cooling device, electronic device having cooling device, and cooling method of heating element | |
| JP2019501439A (en) | Computer apparatus comprising a cooled power supply unit | |
| US20220418156A1 (en) | Cold plate and system for cooling electronic devices | |
| CN104571420B (en) | Immersion liquid-cooled suit business device, the immersion liquid cooling method for server | |
| CN106714505A (en) | Heat radiation system of server | |
| WO2022267932A1 (en) | Composition, liquid cooling agent and applications thereof, and immersion cooling system | |
| An et al. | 3D numerical analysis of two-phase immersion cooling for electronic components | |
| CN111324189A (en) | Heat dissipation device and server using same | |
| CN103616940A (en) | Blade server | |
| CN111343837A (en) | Immersed phase-change cooling medium and application thereof in cooling system of electronic equipment | |
| CN112708398A (en) | Cooling liquid for cooling integrated chip circuit board | |
| CN114731771A (en) | Radiator for liquid cooling | |
| CN115066157A (en) | Liquid cooling heat dissipation system and data center | |
| CN113717698B (en) | Composition, fluoroolefin oligomer liquid coolant, preparation method of fluoroolefin oligomer liquid coolant and immersed cooling system | |
| RU2437140C1 (en) | Passive cooling system of radioactive elements in detachable module | |
| KR20230134510A (en) | Thermal conductive microtubes to evenly distribute heat flux in the cooling system | |
| Raniwala | Bringing 2-Phase Immersion Cooling to Hyperscale Cloud | |
| Kulkarni et al. | Compact liquid enhanced air cooling thermal solution for high power processors in existing air-cooled platforms | |
| Guo et al. | Advanced Single-phase Passive Immersion Cooling Solution with Natural Convection for Outdoor Edge Servers | |
| CN115572579B (en) | Liquid-cooled perfluoro compound composition and application thereof in submerged cooling | |
| CN114231259B (en) | Immersed single-phase liquid coolant, application thereof, liquid cooling method and immersed single-phase liquid cooling system | |
| CN113969144B (en) | Composition and application thereof in liquid coolant and liquid cooling system | |
| TWI833311B (en) | Immersion cooling unit and electronic apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210427 |