US7915085B2
(en)
|
2003-09-18 |
2011-03-29 |
Cree, Inc. |
Molded chip fabrication method
|
US7217583B2
(en)
|
2004-09-21 |
2007-05-15 |
Cree, Inc. |
Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension
|
US20070133204A1
(en)
*
|
2005-12-13 |
2007-06-14 |
Ilight Technologies, Inc. |
Illumination device with hue transformation
|
EP1963743B1
(de)
|
2005-12-21 |
2016-09-07 |
Cree, Inc. |
Beleuchtungsvorrichtung
|
US8969908B2
(en)
|
2006-04-04 |
2015-03-03 |
Cree, Inc. |
Uniform emission LED package
|
US7661840B1
(en)
|
2006-06-21 |
2010-02-16 |
Ilight Technologies, Inc. |
Lighting device with illuminated front panel
|
US7943952B2
(en)
|
2006-07-31 |
2011-05-17 |
Cree, Inc. |
Method of uniform phosphor chip coating and LED package fabricated using method
|
US7820075B2
(en)
*
|
2006-08-10 |
2010-10-26 |
Intematix Corporation |
Phosphor composition with self-adjusting chromaticity
|
US10295147B2
(en)
|
2006-11-09 |
2019-05-21 |
Cree, Inc. |
LED array and method for fabricating same
|
JP2008140704A
(ja)
*
|
2006-12-04 |
2008-06-19 |
Stanley Electric Co Ltd |
Ledバックライト
|
US7686478B1
(en)
|
2007-01-12 |
2010-03-30 |
Ilight Technologies, Inc. |
Bulb for light-emitting diode with color-converting insert
|
US8109656B1
(en)
|
2007-01-12 |
2012-02-07 |
Ilight Technologies, Inc. |
Bulb for light-emitting diode with modified inner cavity
|
US8232564B2
(en)
|
2007-01-22 |
2012-07-31 |
Cree, Inc. |
Wafer level phosphor coating technique for warm light emitting diodes
|
US9159888B2
(en)
|
2007-01-22 |
2015-10-13 |
Cree, Inc. |
Wafer level phosphor coating method and devices fabricated utilizing method
|
US9024349B2
(en)
|
2007-01-22 |
2015-05-05 |
Cree, Inc. |
Wafer level phosphor coating method and devices fabricated utilizing method
|
JP5158472B2
(ja)
*
|
2007-05-24 |
2013-03-06 |
スタンレー電気株式会社 |
半導体発光装置
|
KR101380388B1
(ko)
*
|
2007-06-21 |
2014-04-02 |
서울반도체 주식회사 |
가요성을 구비한 발광 다이오드 및 그 제조 방법
|
US10505083B2
(en)
|
2007-07-11 |
2019-12-10 |
Cree, Inc. |
Coating method utilizing phosphor containment structure and devices fabricated using same
|
US9401461B2
(en)
*
|
2007-07-11 |
2016-07-26 |
Cree, Inc. |
LED chip design for white conversion
|
US7663315B1
(en)
|
2007-07-24 |
2010-02-16 |
Ilight Technologies, Inc. |
Spherical bulb for light-emitting diode with spherical inner cavity
|
JP2009094262A
(ja)
*
|
2007-10-09 |
2009-04-30 |
Toyoda Gosei Co Ltd |
発光装置の製造方法
|
US8946987B2
(en)
|
2007-11-07 |
2015-02-03 |
Industrial Technology Research Institute |
Light emitting device and fabricating method thereof
|
TWI401820B
(zh)
*
|
2007-11-07 |
2013-07-11 |
Ind Tech Res Inst |
發光元件及其製作方法
|
US9041285B2
(en)
|
2007-12-14 |
2015-05-26 |
Cree, Inc. |
Phosphor distribution in LED lamps using centrifugal force
|
US8167674B2
(en)
|
2007-12-14 |
2012-05-01 |
Cree, Inc. |
Phosphor distribution in LED lamps using centrifugal force
|
JP2011508450A
(ja)
*
|
2007-12-28 |
2011-03-10 |
スリーエム イノベイティブ プロパティズ カンパニー |
均一な波長の発光を伴う下方変換された光源
|
DE102008029191A1
(de)
*
|
2008-01-31 |
2009-08-06 |
Osram Opto Semiconductors Gmbh |
Beleuchtungseinrichtung zur Hinterleuchtung eines Displays sowie ein Display mit einer solchen Beleuchtungseinrichtung
|
JP2009206246A
(ja)
*
|
2008-02-27 |
2009-09-10 |
Stanley Electric Co Ltd |
半導体発光装置
|
US8637883B2
(en)
|
2008-03-19 |
2014-01-28 |
Cree, Inc. |
Low index spacer layer in LED devices
|
US8877524B2
(en)
|
2008-03-31 |
2014-11-04 |
Cree, Inc. |
Emission tuning methods and devices fabricated utilizing methods
|
US8038497B2
(en)
*
|
2008-05-05 |
2011-10-18 |
Cree, Inc. |
Methods of fabricating light emitting devices by selective deposition of light conversion materials based on measured emission characteristics
|
US8240875B2
(en)
*
|
2008-06-25 |
2012-08-14 |
Cree, Inc. |
Solid state linear array modules for general illumination
|
US8525207B2
(en)
*
|
2008-09-16 |
2013-09-03 |
Osram Sylvania Inc. |
LED package using phosphor containing elements and light source containing same
|
US7858409B2
(en)
*
|
2008-09-18 |
2010-12-28 |
Koninklijke Philips Electronics N.V. |
White point compensated LEDs for LCD displays
|
KR101039957B1
(ko)
|
2008-11-18 |
2011-06-09 |
엘지이노텍 주식회사 |
발광 장치 및 이를 구비한 디스플레이 장치
|
KR101154758B1
(ko)
|
2008-11-18 |
2012-06-08 |
엘지이노텍 주식회사 |
반도체 발광소자 및 이를 구비한 발광소자 패키지
|
US8220971B2
(en)
*
|
2008-11-21 |
2012-07-17 |
Xicato, Inc. |
Light emitting diode module with three part color matching
|
US7897419B2
(en)
*
|
2008-12-23 |
2011-03-01 |
Cree, Inc. |
Color correction for wafer level white LEDs
|
CN101771025A
(zh)
*
|
2008-12-26 |
2010-07-07 |
富准精密工业(深圳)有限公司 |
发光二极管
|
US20100181582A1
(en)
*
|
2009-01-22 |
2010-07-22 |
Intematix Corporation |
Light emitting devices with phosphor wavelength conversion and methods of manufacture thereof
|
JP5518502B2
(ja)
*
|
2009-01-27 |
2014-06-11 |
シチズン電子株式会社 |
発光ダイオードの製造方法
|
JP5294902B2
(ja)
*
|
2009-01-27 |
2013-09-18 |
シチズン電子株式会社 |
表面実装型発光素子の製造方法
|
WO2010086766A1
(en)
*
|
2009-01-28 |
2010-08-05 |
Koninklijke Philips Electronics N.V. |
Illumination system with remote phosphor layer and/or scattering layer
|
JP2010177620A
(ja)
*
|
2009-02-02 |
2010-08-12 |
Showa Denko Kk |
発光装置の製造方法
|
KR101558241B1
(ko)
|
2009-03-30 |
2015-10-07 |
삼성전자 주식회사 |
발광 장치의 제조 방법
|
JP5630966B2
(ja)
*
|
2009-04-27 |
2014-11-26 |
日亜化学工業株式会社 |
発光素子チップ組立体およびその製造方法
|
US8323748B2
(en)
*
|
2009-05-15 |
2012-12-04 |
Achrolux Inc. |
Methods for forming uniform particle layers of phosphor material on a surface
|
US8227269B2
(en)
*
|
2009-05-19 |
2012-07-24 |
Intematix Corporation |
Manufacture of light emitting devices with phosphor wavelength conversion
|
US8597963B2
(en)
*
|
2009-05-19 |
2013-12-03 |
Intematix Corporation |
Manufacture of light emitting devices with phosphor wavelength conversion
|
US8227276B2
(en)
*
|
2009-05-19 |
2012-07-24 |
Intematix Corporation |
Manufacture of light emitting devices with phosphor wavelength conversion
|
KR100963743B1
(ko)
*
|
2009-06-23 |
2010-06-14 |
한국광기술원 |
파장변환물질층을 구비하는 발광 다이오드 및 이의 제조방법
|
US20100328923A1
(en)
*
|
2009-06-25 |
2010-12-30 |
Bridgelux, Inc. |
Multiple layer phosphor bearing film
|
US8384114B2
(en)
|
2009-06-27 |
2013-02-26 |
Cooledge Lighting Inc. |
High efficiency LEDs and LED lamps
|
KR101060762B1
(ko)
|
2009-07-15 |
2011-08-31 |
삼성엘이디 주식회사 |
발광장치의 제조방법
|
US20110031516A1
(en)
*
|
2009-08-07 |
2011-02-10 |
Koninklijke Philips Electronics N.V. |
Led with silicone layer and laminated remote phosphor layer
|
CN102020851B
(zh)
|
2009-09-16 |
2013-10-16 |
大连路明发光科技股份有限公司 |
一种光转换柔性高分子材料及其用途
|
US20110062472A1
(en)
*
|
2009-09-17 |
2011-03-17 |
Koninklijke Philips Electronics N.V. |
Wavelength-converted semiconductor light emitting device
|
JP2011082339A
(ja)
*
|
2009-10-07 |
2011-04-21 |
Nitto Denko Corp |
光半導体封止用キット
|
KR101650375B1
(ko)
*
|
2009-11-17 |
2016-08-24 |
주식회사 탑 엔지니어링 |
양자점 코팅을 이용한 발광 다이오드의 리페어 방법 및 장치
|
JP5310536B2
(ja)
*
|
2009-12-25 |
2013-10-09 |
豊田合成株式会社 |
発光装置の製造方法
|
DE112010004424T5
(de)
*
|
2009-12-26 |
2012-11-08 |
Achrolux Inc. |
Gleichmässige Filmschichtstruktur, die die Wellenlänge emittierten Lichtes umwandelt, und Verfahren zum Bilden derselben
|
US9480133B2
(en)
|
2010-01-04 |
2016-10-25 |
Cooledge Lighting Inc. |
Light-emitting element repair in array-based lighting devices
|
US8653539B2
(en)
|
2010-01-04 |
2014-02-18 |
Cooledge Lighting, Inc. |
Failure mitigation in arrays of light-emitting devices
|
US8587187B2
(en)
|
2010-12-06 |
2013-11-19 |
Byoung GU Cho |
Light diffusion of visible edge lines in a multi-dimensional modular display
|
US8227274B2
(en)
*
|
2010-01-26 |
2012-07-24 |
Lightizer Korea Co. |
Light emitting diode (LED) and method of manufacture
|
JP5340191B2
(ja)
*
|
2010-02-02 |
2013-11-13 |
日東電工株式会社 |
光半導体装置
|
US9631782B2
(en)
*
|
2010-02-04 |
2017-04-25 |
Xicato, Inc. |
LED-based rectangular illumination device
|
TWI494553B
(zh)
*
|
2010-02-05 |
2015-08-01 |
Samsung Electronics Co Ltd |
評估led光學性質之設備及方法以及製造led裝置之方法
|
US8771577B2
(en)
|
2010-02-16 |
2014-07-08 |
Koninklijke Philips N.V. |
Light emitting device with molded wavelength converting layer
|
SG183402A1
(en)
|
2010-02-19 |
2012-09-27 |
Toray Industries |
Phosphor-containing cured silicone, process for production of same, phosphor-containing silicone composition, precursor of the composition, sheet-shaped moldings, led package, light -emitting device, and process for production of led-mounted substrate
|
JP5580100B2
(ja)
*
|
2010-04-09 |
2014-08-27 |
株式会社朝日Fr研究所 |
半導体発光装置の製造方法または半導体発光ダイオードの製造方法
|
TWI476959B
(zh)
*
|
2010-04-11 |
2015-03-11 |
Achrolux Inc |
轉移均勻螢光層至一物件上之方法及所製得之發光結構
|
JP5455764B2
(ja)
*
|
2010-04-23 |
2014-03-26 |
シチズンホールディングス株式会社 |
半導体発光装置及びその製造方法
|
US8232117B2
(en)
*
|
2010-04-30 |
2012-07-31 |
Koninklijke Philips Electronics N.V. |
LED wafer with laminated phosphor layer
|
GB2479921A
(en)
*
|
2010-04-30 |
2011-11-02 |
Led Semiconductor Co Ltd |
Encapsulation structure for light emitting diode
|
KR101103396B1
(ko)
*
|
2010-05-04 |
2012-01-05 |
(주)와이솔 |
발광 다이오드 패키지의 제조방법
|
CN102869502B
(zh)
*
|
2010-05-20 |
2014-09-17 |
大连路明发光科技股份有限公司 |
可剥离型光转换发光膜
|
US20110309393A1
(en)
*
|
2010-06-21 |
2011-12-22 |
Micron Technology, Inc. |
Packaged leds with phosphor films, and associated systems and methods
|
EP2589082B1
(de)
|
2010-06-29 |
2018-08-08 |
Cooledge Lighting Inc. |
Elektronische vorrichtungen mit nachgebenden substraten
|
US8941135B2
(en)
|
2010-07-15 |
2015-01-27 |
Nitto Denko Corporation |
Light emissive ceramic laminate and method of making same
|
US10546846B2
(en)
|
2010-07-23 |
2020-01-28 |
Cree, Inc. |
Light transmission control for masking appearance of solid state light sources
|
US8896005B2
(en)
*
|
2010-07-29 |
2014-11-25 |
Cree, Inc. |
Lighting devices that comprise one or more solid state light emitters
|
TW201216526A
(en)
|
2010-08-20 |
2012-04-16 |
Koninkl Philips Electronics Nv |
Lamination process for LEDs
|
US20120051045A1
(en)
|
2010-08-27 |
2012-03-01 |
Xicato, Inc. |
Led Based Illumination Module Color Matched To An Arbitrary Light Source
|
EP2503605B1
(de)
*
|
2010-09-15 |
2016-07-20 |
Lightizer Korea Co., Ltd |
Lichtemittierende diode und verfahren zu ihrer herstellung
|
CN102064240B
(zh)
*
|
2010-09-30 |
2016-01-27 |
福建省万邦光电科技有限公司 |
白光led光源模块的封装工艺
|
WO2012056378A1
(en)
*
|
2010-10-27 |
2012-05-03 |
Koninklijke Philips Electronics N.V. |
Laminate support film for fabrication of light emitting devices and method its fabrication
|
JP5310699B2
(ja)
*
|
2010-10-27 |
2013-10-09 |
パナソニック株式会社 |
樹脂塗布装置および樹脂塗布方法
|
US9000470B2
(en)
*
|
2010-11-22 |
2015-04-07 |
Cree, Inc. |
Light emitter devices
|
KR20120061376A
(ko)
*
|
2010-12-03 |
2012-06-13 |
삼성엘이디 주식회사 |
반도체 발광 소자에 형광체를 도포하는 방법
|
US8841145B2
(en)
|
2010-12-08 |
2014-09-23 |
Bridgelux, Inc. |
System for wafer-level phosphor deposition
|
US8482020B2
(en)
*
|
2010-12-08 |
2013-07-09 |
Bridgelux, Inc. |
System for wafer-level phosphor deposition
|
SG190320A1
(en)
*
|
2010-12-13 |
2013-07-31 |
Toray Industries |
Phosphor sheet, led and light emitting device using same and method for producing led
|
KR101725220B1
(ko)
|
2010-12-22 |
2017-04-10 |
삼성전자 주식회사 |
형광체 도포 방법 및 형광체 도포 장치
|
US9166126B2
(en)
*
|
2011-01-31 |
2015-10-20 |
Cree, Inc. |
Conformally coated light emitting devices and methods for providing the same
|
US10147853B2
(en)
|
2011-03-18 |
2018-12-04 |
Cree, Inc. |
Encapsulant with index matched thixotropic agent
|
KR101769356B1
(ko)
*
|
2011-03-25 |
2017-08-18 |
삼성전자주식회사 |
발광소자에 형광체층을 형성하는 방법 및 장치
|
JP2014509089A
(ja)
*
|
2011-03-25 |
2014-04-10 |
コーニンクレッカ フィリップス エヌ ヴェ |
Led上のパターニングされた感uv性シリコーン−蛍光体層
|
JP5680472B2
(ja)
*
|
2011-04-22 |
2015-03-04 |
シチズンホールディングス株式会社 |
半導体発光装置の製造方法
|
EP2718611B1
(de)
*
|
2011-06-10 |
2015-08-12 |
Koninklijke Philips N.V. |
Phosphorverstärkte lichtquelle zur darstellung eines sichtbaren musters und leuchte
|
WO2013005646A1
(ja)
|
2011-07-01 |
2013-01-10 |
シチズンホールディングス株式会社 |
半導体発光素子の製造方法
|
US8669722B2
(en)
|
2011-08-12 |
2014-03-11 |
Tsmc Solid State Lighting Ltd. |
Color temperature adjustment for LED lamps using switches
|
CN107086198B
(zh)
*
|
2011-08-30 |
2020-09-11 |
亮锐控股有限公司 |
将衬底接合到半导体发光器件的方法
|
US20130062639A1
(en)
*
|
2011-09-12 |
2013-03-14 |
SemiLEDs Optoelectronics Co., Ltd. |
Method for fabricating light emitting diode (led) devices having output with selected characteristics
|
US8841146B2
(en)
*
|
2011-09-12 |
2014-09-23 |
SemiLEDs Optoelectronics Co., Ltd. |
Method and system for fabricating light emitting diode (LED) dice with wavelength conversion layers having controlled color characteristics
|
US8579451B2
(en)
|
2011-09-15 |
2013-11-12 |
Osram Sylvania Inc. |
LED lamp
|
US20130069088A1
(en)
*
|
2011-09-20 |
2013-03-21 |
The Regents Of The University Of California |
Light emitting diode with conformal surface electrical contacts with glass encapsulation
|
US20130075769A1
(en)
*
|
2011-09-22 |
2013-03-28 |
Ledengin, Inc. |
Selection of phosphors and leds in a multi-chip emitter for a single white color bin
|
US9349927B2
(en)
|
2011-10-18 |
2016-05-24 |
Nitto Denko Corporation |
Encapsulating sheet and optical semiconductor element device
|
TWI462347B
(zh)
*
|
2011-11-07 |
2014-11-21 |
Lextar Electronics Corp |
光源結構
|
CN103199172B
(zh)
*
|
2012-01-10 |
2015-10-07 |
展晶科技(深圳)有限公司 |
发光二极管封装结构的制造方法
|
US8951842B2
(en)
|
2012-01-12 |
2015-02-10 |
Micron Technology, Inc. |
Semiconductor growth substrates and associated systems and methods for die singulation
|
US9257617B2
(en)
*
|
2012-02-10 |
2016-02-09 |
Koninklijke Philips N.V. |
Wavelength converted light emitting device
|
WO2013150427A1
(en)
*
|
2012-04-05 |
2013-10-10 |
Koninklijke Philips N.V. |
Led thin-film device partial singulation prior to substrate thinning or removal
|
WO2013175338A1
(en)
|
2012-05-23 |
2013-11-28 |
Koninklijke Philips N.V. |
Phosphor coating process for discrete light emitting devices
|
CN103427003B
(zh)
*
|
2012-05-25 |
2016-08-10 |
华夏光股份有限公司 |
半导体发光装置的形成方法
|
US9231178B2
(en)
|
2012-06-07 |
2016-01-05 |
Cooledge Lighting, Inc. |
Wafer-level flip chip device packages and related methods
|
US10468565B2
(en)
|
2012-06-11 |
2019-11-05 |
Cree, Inc. |
LED package with multiple element light source and encapsulant having curved and/or planar surfaces
|
US9887327B2
(en)
|
2012-06-11 |
2018-02-06 |
Cree, Inc. |
LED package with encapsulant having curved and planar surfaces
|
US10424702B2
(en)
|
2012-06-11 |
2019-09-24 |
Cree, Inc. |
Compact LED package with reflectivity layer
|
US9818919B2
(en)
*
|
2012-06-11 |
2017-11-14 |
Cree, Inc. |
LED package with multiple element light source and encapsulant having planar surfaces
|
US9082940B2
(en)
*
|
2012-06-29 |
2015-07-14 |
Nitto Denko Corporation |
Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device
|
US8907502B2
(en)
*
|
2012-06-29 |
2014-12-09 |
Nitto Denko Corporation |
Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device
|
KR20200085912A
(ko)
*
|
2012-07-20 |
2020-07-15 |
루미리즈 홀딩 비.브이. |
세라믹 녹색 인광체 및 보호된 적색 인광체 층을 갖는 led
|
JP2014056929A
(ja)
*
|
2012-09-12 |
2014-03-27 |
Sharp Corp |
発光素子モジュールの製造方法および発光素子モジュール基板
|
JP2014096491A
(ja)
|
2012-11-09 |
2014-05-22 |
Nitto Denko Corp |
蛍光体層被覆半導体素子、その製造方法、半導体装置およびその製造方法
|
US8876312B2
(en)
|
2013-03-05 |
2014-11-04 |
Avago Technologies General Ip (Singapore) Pte. Ltd. |
Lighting device and apparatus with spectral converter within a casing
|
US8928219B2
(en)
|
2013-03-05 |
2015-01-06 |
Avago Technologies General Ip (Singapore) Pte. Ltd. |
Lighting device with spectral converter
|
JP2014192326A
(ja)
*
|
2013-03-27 |
2014-10-06 |
Nitto Denko Corp |
光半導体装置の製造方法
|
KR101396589B1
(ko)
*
|
2013-03-29 |
2014-05-20 |
서울반도체 주식회사 |
가요성을 구비한 발광 디바이스
|
WO2014184698A1
(en)
|
2013-05-14 |
2014-11-20 |
Koninklijke Philips N.V. |
Chip scale light emitting device package in molded leadframe
|
US9660154B2
(en)
*
|
2013-05-20 |
2017-05-23 |
Koninklijke Philips N.V. |
Chip scale light emitting device package with dome
|
EP3005427B1
(de)
*
|
2013-06-06 |
2019-01-16 |
Lumileds Holding B.V. |
Herstellungsverfahren für eine mit einer leuchtstofffolie laminierte leuchtdiode
|
WO2014207599A1
(en)
|
2013-06-24 |
2014-12-31 |
Koninklijke Philips N.V. |
Transfer of optical thin films and barrier films from releasable substrates for led manufacture
|
CN103367605B
(zh)
*
|
2013-07-05 |
2015-10-28 |
华南理工大学 |
一种薄膜型led器件及其制造方法
|
CN105393374B
(zh)
|
2013-07-19 |
2019-05-28 |
亮锐控股有限公司 |
具有光学元件并且没有衬底载体的pc led
|
EP3025380B1
(de)
|
2013-07-22 |
2019-12-25 |
Lumileds Holding B.V. |
Flip-chip kantenemittierende led
|
US9461024B2
(en)
|
2013-08-01 |
2016-10-04 |
Cree, Inc. |
Light emitter devices and methods for light emitting diode (LED) chips
|
CN103413870A
(zh)
*
|
2013-08-05 |
2013-11-27 |
晶科电子(广州)有限公司 |
一种白光led光源的制作方法
|
USD758976S1
(en)
|
2013-08-08 |
2016-06-14 |
Cree, Inc. |
LED package
|
JP6209949B2
(ja)
*
|
2013-11-13 |
2017-10-11 |
日亜化学工業株式会社 |
発光装置及び発光装置の製造方法
|
US11024781B2
(en)
*
|
2014-01-07 |
2021-06-01 |
Lumileds Llc |
Glueless light emitting device with phosphor converter
|
WO2015110875A1
(en)
|
2014-01-21 |
2015-07-30 |
Koninklijke Philips N.V. |
Hybrid chip-on-board led module with patterned encapsulation
|
KR102145208B1
(ko)
|
2014-06-10 |
2020-08-19 |
삼성전자주식회사 |
발광소자 패키지 제조방법
|
USD790486S1
(en)
|
2014-09-30 |
2017-06-27 |
Cree, Inc. |
LED package with truncated encapsulant
|
US20160126430A1
(en)
*
|
2014-11-03 |
2016-05-05 |
Avago Technologies General Ip (Singapore) Pte. Ltd |
Light-emitting device with hardened encapsulant islands
|
CA2967190C
(en)
|
2014-11-18 |
2022-09-20 |
Industries Yifei Wang Inc. |
Led module, methods of manufacturing same and luminaire integrating same
|
EP3663843B1
(de)
|
2014-12-03 |
2022-02-23 |
Samsung Electronics Co., Ltd. |
Weisslichtemittierende vorrichtung und anzeigevorrichtung damit
|
USD777122S1
(en)
|
2015-02-27 |
2017-01-24 |
Cree, Inc. |
LED package
|
USD783547S1
(en)
|
2015-06-04 |
2017-04-11 |
Cree, Inc. |
LED package
|
US10193031B2
(en)
*
|
2016-03-11 |
2019-01-29 |
Rohinni, LLC |
Method for applying phosphor to light emitting diodes and apparatus thereof
|
JP2017194581A
(ja)
*
|
2016-04-21 |
2017-10-26 |
加藤 陽弘 |
粘着性蛍光シート及びこれを用いた発光装置
|
DE102016109054A1
(de)
*
|
2016-05-17 |
2017-11-23 |
Osram Opto Semiconductors Gmbh |
Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung und optoelektronische Leuchtvorrichtung
|
CN107403855B
(zh)
*
|
2016-05-18 |
2019-07-09 |
光宝光电(常州)有限公司 |
多色温发光二极管封装结构及其制造方法
|
WO2018183341A1
(en)
|
2017-03-27 |
2018-10-04 |
Firouzeh Sabri |
Light weight flexible temperature sensor kit
|
WO2018219460A1
(en)
*
|
2017-06-01 |
2018-12-06 |
Osram Opto Semiconductors Gmbh |
Method for producing an optoelectronic device
|
KR20200142685A
(ko)
|
2019-06-13 |
2020-12-23 |
삼성전자주식회사 |
마이크로 led 전사 방법 및 이에 의해 제조된 디스플레이 모듈
|
US11594665B2
(en)
*
|
2019-08-02 |
2023-02-28 |
Nichia Corporation |
Light-emitting unit and surface-emission light source
|
DE102021105601A1
(de)
|
2020-07-03 |
2022-01-05 |
Hoya Corporation |
Beleuchtungsvorrichtung
|
WO2022039300A1
(ko)
*
|
2020-08-20 |
2022-02-24 |
엘지전자 주식회사 |
디스플레이 장치의 제조에 사용되는 전사 기판, 디스플레이 장치 및 디스플레이 장치의 제조 방법
|
US11682752B2
(en)
|
2021-03-31 |
2023-06-20 |
Lumileds Llc |
Light-emitting device with nano-structured light extraction layer
|
KR102351000B1
(ko)
*
|
2021-06-10 |
2022-01-14 |
주식회사 바이더엠 |
퀀텀닷필름을 이용한 파장제어 기능이 구비된 led모듈
|
US20230165126A1
(en)
|
2021-11-19 |
2023-05-25 |
Osram Opto Semiconductors Gmbh |
Curable self-adhesive wavelength converting film and light emitting device comprising the same
|