ATE537564T1 - Lumineszente lichtquelle, verfahren zu ihrer herstellung und licht emittierende vorrichtung - Google Patents
Lumineszente lichtquelle, verfahren zu ihrer herstellung und licht emittierende vorrichtungInfo
- Publication number
- ATE537564T1 ATE537564T1 AT05793565T AT05793565T ATE537564T1 AT E537564 T1 ATE537564 T1 AT E537564T1 AT 05793565 T AT05793565 T AT 05793565T AT 05793565 T AT05793565 T AT 05793565T AT E537564 T1 ATE537564 T1 AT E537564T1
- Authority
- AT
- Austria
- Prior art keywords
- light
- light source
- emitting element
- luminescent
- emitting device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S6/00—Lighting devices intended to be free-standing
- F21S6/002—Table lamps, e.g. for ambient lighting
- F21S6/003—Table lamps, e.g. for ambient lighting for task lighting, e.g. for reading or desk work, e.g. angle poise lamps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H10W72/07251—
-
- H10W72/20—
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004299312 | 2004-10-13 | ||
| PCT/JP2005/018996 WO2006041178A2 (en) | 2004-10-13 | 2005-10-11 | Luminescent light source, method for manufacturing the same, and light-emitting apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE537564T1 true ATE537564T1 (de) | 2011-12-15 |
Family
ID=35954088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT05793565T ATE537564T1 (de) | 2004-10-13 | 2005-10-11 | Lumineszente lichtquelle, verfahren zu ihrer herstellung und licht emittierende vorrichtung |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20070228947A1 (de) |
| EP (1) | EP1803164B1 (de) |
| JP (1) | JP2008516414A (de) |
| KR (1) | KR20070102481A (de) |
| CN (1) | CN100544042C (de) |
| AT (1) | ATE537564T1 (de) |
| TW (1) | TW200629601A (de) |
| WO (1) | WO2006041178A2 (de) |
Families Citing this family (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI297784B (en) * | 2005-09-22 | 2008-06-11 | Lite On Technology Corp | Optical module having a lens formed without contacting a reflector and method of manufacturing the same |
| US20070247851A1 (en) * | 2006-04-21 | 2007-10-25 | Villard Russel G | Light Emitting Diode Lighting Package With Improved Heat Sink |
| CN100472828C (zh) * | 2006-04-28 | 2009-03-25 | 佰鸿工业股份有限公司 | 白光发光二极管的制作方法 |
| US8062925B2 (en) * | 2006-05-16 | 2011-11-22 | Koninklijke Philips Electronics N.V. | Process for preparing a semiconductor light-emitting device for mounting |
| EP2059954B1 (de) * | 2006-08-29 | 2016-10-19 | Panasonic Intellectual Property Management Co., Ltd. | Halbleiter-elektrolumineszenz-, phosphor-gewandelte-lichtquelle und herstellungsverfahren dafür |
| KR101283129B1 (ko) * | 2007-04-03 | 2013-07-05 | 엘지이노텍 주식회사 | 도광판, 면 광원 장치 및 이를 갖는 표시 장치 |
| DE102007043183A1 (de) * | 2007-09-11 | 2009-04-09 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines solchen |
| US8558438B2 (en) * | 2008-03-01 | 2013-10-15 | Goldeneye, Inc. | Fixtures for large area directional and isotropic solid state lighting panels |
| KR100972979B1 (ko) * | 2008-03-17 | 2010-07-29 | 삼성엘이디 주식회사 | 엘이디 패키지 및 그 제조방법 |
| JP5688289B2 (ja) | 2008-05-09 | 2015-03-25 | インヴェンサス・コーポレイション | チップサイズ両面接続パッケージの製造方法 |
| DE102008030253B4 (de) * | 2008-06-25 | 2020-02-20 | Osram Opto Semiconductors Gmbh | Konversionselement und Leuchtmittel |
| JP5245614B2 (ja) | 2008-07-29 | 2013-07-24 | 豊田合成株式会社 | 発光装置 |
| DE112010000839T5 (de) * | 2009-02-19 | 2012-09-20 | Sharp Kabushiki Kaisha | Licht emittierende einrichtung, planare lichtquelle und anzeigeeinrichtung |
| JP5487204B2 (ja) * | 2009-05-15 | 2014-05-07 | 株式会社小糸製作所 | 発光モジュール、発光モジュールの製造方法、および灯具ユニット |
| US8203161B2 (en) * | 2009-11-23 | 2012-06-19 | Koninklijke Philips Electronics N.V. | Wavelength converted semiconductor light emitting device |
| JP5882910B2 (ja) * | 2010-01-19 | 2016-03-09 | エルジー イノテック カンパニー リミテッド | パッケージおよびその製造方法 |
| JP5684511B2 (ja) * | 2010-08-11 | 2015-03-11 | 三菱樹脂株式会社 | 金属箔積層体、led搭載用基板及び光源装置 |
| GB2484712A (en) * | 2010-10-21 | 2012-04-25 | Optovate Ltd | Illumination Apparatus |
| US20120153311A1 (en) * | 2010-12-17 | 2012-06-21 | Intematix Corporation | Low-cost solid-state based light emitting devices with photoluminescent wavelength conversion and their method of manufacture |
| JP5661552B2 (ja) * | 2010-12-24 | 2015-01-28 | シチズンホールディングス株式会社 | 半導体発光装置及びその製造方法 |
| KR101748334B1 (ko) * | 2011-01-17 | 2017-06-16 | 삼성전자 주식회사 | 백색 발광 소자의 제조 방법 및 제조 장치 |
| JP5562888B2 (ja) * | 2011-03-24 | 2014-07-30 | 株式会社東芝 | 半導体発光装置および半導体発光装置の製造方法 |
| JP6066253B2 (ja) * | 2011-09-26 | 2017-01-25 | 東芝ライテック株式会社 | 発光装置の製造方法 |
| US9222640B2 (en) * | 2011-10-18 | 2015-12-29 | Tsmc Solid State Lighting Ltd. | Coated diffuser cap for LED illumination device |
| CN103748405B (zh) * | 2011-12-16 | 2017-09-05 | 松下知识产权经营株式会社 | 发光模块以及使用该发光模块的照明用光源和照明装置 |
| CN103198888B (zh) | 2012-01-05 | 2016-04-20 | 日立金属株式会社 | 差动信号传输用电缆 |
| US9034672B2 (en) * | 2012-06-19 | 2015-05-19 | Epistar Corporation | Method for manufacturing light-emitting devices |
| WO2014167455A2 (en) * | 2013-04-11 | 2014-10-16 | Koninklijke Philips N.V. | Top emitting semiconductor light emitting device |
| JP2016533030A (ja) * | 2013-07-24 | 2016-10-20 | クーレッジ ライティング インコーポレイテッド | 波長変換材料を組み込む発光ダイおよび関連方法 |
| WO2015033700A1 (ja) * | 2013-09-05 | 2015-03-12 | シャープ株式会社 | 発光装置用基板、発光装置、および発光装置用基板の製造方法 |
| CN104733594B (zh) * | 2013-12-24 | 2017-09-19 | 展晶科技(深圳)有限公司 | Led封装体 |
| DE102014108362B4 (de) * | 2014-06-13 | 2022-05-25 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung mehrerer optoelektronischer Bauelemente und optoelektronisches Bauelement |
| TWM488746U (zh) | 2014-07-14 | 2014-10-21 | 新世紀光電股份有限公司 | 發光模組 |
| KR102451208B1 (ko) * | 2015-02-04 | 2022-10-06 | 메르크 파텐트 게엠베하 | 전기 광학 스위칭 엘리먼트 및 디스플레이 디바이스 |
| RU2623506C2 (ru) * | 2015-08-20 | 2017-06-27 | Наталья Олеговна Стёркина | Способ создания светового потока и карнизный протяжённый светильник для его осуществления |
| US10199545B2 (en) * | 2015-09-30 | 2019-02-05 | Dai Nippon Printing Co., Ltd. | Substrate for light emitting element and module |
| KR20170056826A (ko) * | 2015-11-16 | 2017-05-24 | (주)라이타이저코리아 | 삼차원 형광층 제조 방법 |
| CN106449940B (zh) * | 2016-10-31 | 2019-12-20 | 广东晶科电子股份有限公司 | 一种led封装器件及其制备方法 |
| US10181447B2 (en) | 2017-04-21 | 2019-01-15 | Invensas Corporation | 3D-interconnect |
| JP7037046B2 (ja) | 2018-01-31 | 2022-03-16 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| CN111317427A (zh) * | 2018-12-13 | 2020-06-23 | 全景科技有限公司 | 医疗内视镜照明机构及其制程 |
| JP7449271B2 (ja) * | 2019-02-21 | 2024-03-13 | デンカ株式会社 | 蛍光体基板、発光基板、照明装置、蛍光体基板の製造方法及び発光基板の製造方法 |
| JP7256372B2 (ja) * | 2019-03-14 | 2023-04-12 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| US11742253B2 (en) * | 2020-05-08 | 2023-08-29 | Qualcomm Incorporated | Selective mold placement on integrated circuit (IC) packages and methods of fabricating |
| US12040284B2 (en) | 2021-11-12 | 2024-07-16 | Invensas Llc | 3D-interconnect with electromagnetic interference (“EMI”) shield and/or antenna |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001298216A (ja) * | 2000-04-12 | 2001-10-26 | Matsushita Electric Ind Co Ltd | 表面実装型の半導体発光装置 |
| JP5110744B2 (ja) * | 2000-12-21 | 2012-12-26 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | 発光装置及びその製造方法 |
| JP4081985B2 (ja) * | 2001-03-02 | 2008-04-30 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
| US6455878B1 (en) * | 2001-05-15 | 2002-09-24 | Lumileds Lighting U.S., Llc | Semiconductor LED flip-chip having low refractive index underfill |
| US6878973B2 (en) * | 2001-08-23 | 2005-04-12 | Lumileds Lighting U.S., Llc | Reduction of contamination of light emitting devices |
| KR100923804B1 (ko) * | 2001-09-03 | 2009-10-27 | 파나소닉 주식회사 | 반도체발광소자, 발광장치 및 반도체발광소자의 제조방법 |
| JP3768864B2 (ja) * | 2001-11-26 | 2006-04-19 | シチズン電子株式会社 | 表面実装型発光ダイオード及びその製造方法 |
| JP4139634B2 (ja) * | 2002-06-28 | 2008-08-27 | 松下電器産業株式会社 | Led照明装置およびその製造方法 |
-
2005
- 2005-10-11 TW TW094135325A patent/TW200629601A/zh unknown
- 2005-10-11 KR KR1020077008037A patent/KR20070102481A/ko not_active Ceased
- 2005-10-11 EP EP05793565A patent/EP1803164B1/de not_active Expired - Lifetime
- 2005-10-11 AT AT05793565T patent/ATE537564T1/de active
- 2005-10-11 US US11/575,379 patent/US20070228947A1/en not_active Abandoned
- 2005-10-11 WO PCT/JP2005/018996 patent/WO2006041178A2/en not_active Ceased
- 2005-10-11 CN CNB2005800351308A patent/CN100544042C/zh not_active Expired - Fee Related
- 2005-10-11 JP JP2007511126A patent/JP2008516414A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006041178A2 (en) | 2006-04-20 |
| TW200629601A (en) | 2006-08-16 |
| US20070228947A1 (en) | 2007-10-04 |
| KR20070102481A (ko) | 2007-10-18 |
| EP1803164B1 (de) | 2011-12-14 |
| EP1803164A2 (de) | 2007-07-04 |
| JP2008516414A (ja) | 2008-05-15 |
| WO2006041178A3 (en) | 2006-06-01 |
| CN101044632A (zh) | 2007-09-26 |
| CN100544042C (zh) | 2009-09-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE537564T1 (de) | Lumineszente lichtquelle, verfahren zu ihrer herstellung und licht emittierende vorrichtung | |
| TW200746469A (en) | Single block light-emitting device and driving method thereof | |
| TW200511608A (en) | High power AllnGaN based multi-chip light emitting diode | |
| TW200637033A (en) | Light-emitting device, light-emitting module, display unit, lighting unit and method for manufacturing light-emitting device | |
| TW200501449A (en) | Semiconductor light emitting device and method for manufacturing the same | |
| TW200514281A (en) | Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device | |
| TW200721557A (en) | Light-emitting module, and display unit and lighting unit using the same | |
| ATE550789T1 (de) | Hochleistungs-leuchtdioden mit hoher leuchtdichte und verfahren zu ihrer herstellung | |
| WO2004071141A3 (en) | Metal base wiring board for retaining light emitting elements, light emitting source, lighting apparatus, and display apparatus | |
| WO2005043586A3 (en) | Led array with photodetector | |
| TW200729559A (en) | High luminance light emitting diode and liquid crystal display device using the same | |
| ATE403366T1 (de) | Leuchtelement mit mindestens einem substrat und einer lichtemittierenden beschichtung | |
| TW200509419A (en) | White-light emitting device, and phosphor and method of its manufacture | |
| TW200502353A (en) | Organic polymer light-emitting element material having gold complex structure and organic polymer light-emitting element | |
| TW200624546A (en) | Phosphor mixture of orange/red ZnSe0.5S0.5:Cu,Cl and green BaSrGa4S7:Eu for white phosphor-converted led | |
| ATE524836T1 (de) | Herstellungsverfahren einer halbleiter- dünnschicht aus gainn | |
| TW200640031A (en) | Multi-wavelength white light light-emitting diode | |
| EP1475835A3 (de) | Farbmischende Leuchtdiode | |
| CN102392961A (zh) | Led和oled复合面发光器件 | |
| CN209045600U (zh) | 一种微发光二极管 | |
| US20170351018A1 (en) | Light emitting arrangement for illuminated surfaces | |
| KR20110109460A (ko) | 발광 모듈 및 이를 이용한 라이트 유닛 | |
| EP1915437A4 (de) | Roter leuchtstoff, verfahren zu seiner herstellung sowie davon gebrauch machende leuchtdiode | |
| CN209087797U (zh) | 一种转移基板及基板卷 | |
| KR20080092001A (ko) | 조명용 발광 다이오드 모듈 |