JP6066253B2 - 発光装置の製造方法 - Google Patents
発光装置の製造方法 Download PDFInfo
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01—ELECTRIC ELEMENTS
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
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- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
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- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
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- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
図1は、第1の実施形態により製造される発光装置の一例を示す断面図、図2はその要部を拡大して示す図で、(a)は断面図、(b)は平面図である。
図6は、第2の実施形態により製造される発光装置の一例を示す断面図、図7はその要部を拡大して示す断面図である。なお、本実施形態においては、重複する説明を避けるため、第1の実施形態と共通する点については説明を省略または簡略化し、相違点を中心に説明する。
ただし、静電噴霧では、対象物(LEDチップ)の上方から下方に拡がるように噴霧されるため、その側面まで均一な膜を形成することはやや難しい。したがって、上記第2の実施形態のように、LEDチップの側面にまで蛍光体層を形成する必要がある場合には、静電塗布を用いることが好ましい。第1の実施形態のように、LEDチップの上面とそれに続く角部に蛍光体層を形成する場合には、静電塗布及び静電噴霧のいずれの方法であってもよい。
Ag配線層を設けたセラミックス基板上に、波長450〜460nmの青色光を発する青色LEDチップ(575μm×325μm×170μm、電極パッドφ70μm)を複数個、シリコーン系接着剤で接着するとともに、ワイヤーボンディングにより青色LEDチップとセラミック基板上のAg配線層とを電気的に接合した。
LEDチップ3として、青色LEDチップ(200μm×200μm×170μm、電極パッドφ70μm)を用いた以外は実施例1と同様にして、発光装置を製造したところ、実施例1と同様、セラミックス基板上のLEDチップの上面及びそれに続く角部(電極パッド上を除く)に均一な厚さの蛍光体層を形成することができた。また、得られた発光装置を発光させたところ、色ムラのない光が得られ、ブルーリング現象も観察されなかった。
LEDチップ3として、青色LEDチップ(800μm×800μm×170μm、電極パッドφ150μm)を用い、このLEDチップをセラミックス基板1上にAuSnフリップチップ接合するとともに、図3に示す静電塗布装置(噴霧ノズル先端径:1.6mm)30を用いて、セラミックス基板上のLEDチップの上面、側面およびそれらの角部に、実施例1と同様に調製した蛍光体含有分散液を塗布し硬化させたところ、LEDチップ上面、側面および角部に略均一な厚さの蛍光体層を有する発光装置が製造された。得られた発光装置を発光させたところ、色ムラのない光が得られ、ブルーリング現象も観察されなかった。
Claims (4)
- 基板上に発光素子を搭載する第一工程と;
前記発光素子から放射される光により励起されて発光するミクロンオーダの蛍光体粒子を液状透明樹脂に分散させ、この分散液を静電塗布または静電噴霧することにより、前記発光素子の上面に前記蛍光体粒子を含む層を形成する第二工程と;
を具備し、
前記発光素子は絶縁性の素子基板上に半導体発光層を形成したLEDであり、LEDが実装された基板とノズルの間にパルス電圧をかけ、その静電力でノズル先端の液材を微小液滴として引き出し、電界によって基板に引き寄せ、かつ、ノズル先端の基板に対する位置を水平方向に相対的に移動させる又はその角度を相対的に変化させることによりLEDに塗布すると共に、
前記LEDの半導体発光層上には1対の素子電極が形成されており、前記蛍光体粒子を含む層を、1対の素子電極形成部を除くLED上面とそれに続く半導体発光層の側面を含む角部のみに選択的に形成することを特徴とする発光装置の製造方法。 - 前記第一工程において、前記発光素子は前記基板上にフェイスアップで搭載されることを特徴とする請求項1記載の発光装置の製造方法。
- 前記第二工程において、前記分散液に前記蛍光体粒子とともにサブミクロンオーダの熱伝導性フィラーをさらに分散させることを特徴とする請求項1又は2項記載の発光装置の製造方法。
- 前記第二工程は、第1の蛍光体粒子を分散させた第1の分散液を静電塗布または静電噴霧する工程と、第2の蛍光体粒子を分散させた第2の分散液を静電塗布または静電噴霧する工程とを有することを特徴とする請求項1乃至3のいずれか1項記載の発光装置の製造方法。
Priority Applications (4)
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JP2011208949A JP6066253B2 (ja) | 2011-09-26 | 2011-09-26 | 発光装置の製造方法 |
EP12180282.1A EP2573828A3 (en) | 2011-09-26 | 2012-08-13 | Manufacturing method for light-emitting device and the light-emitting device |
US13/598,233 US20130076230A1 (en) | 2011-09-26 | 2012-08-29 | Manufacturing method of light-emitting device and the light-emitting device |
CN2012103144759A CN103022322A (zh) | 2011-09-26 | 2012-08-30 | 发光装置的制造方法 |
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JP2014192502A (ja) * | 2013-03-28 | 2014-10-06 | Toyoda Gosei Co Ltd | 発光装置の製造方法 |
DE102013103416A1 (de) * | 2013-04-05 | 2014-10-23 | Osram Opto Semiconductors Gmbh | Elektromagnetische Strahlung emittierende Baugruppe und Verfahren zum Herstellen einer elektromagnetische Strahlung emittierenden Baugruppe |
JP6307703B2 (ja) * | 2013-05-31 | 2018-04-11 | パナソニックIpマネジメント株式会社 | 波長変換素子、波長変換素子を備えた発光装置、発光装置を備えた車両、および波長変換素子の製造方法 |
JP6011487B2 (ja) * | 2013-08-09 | 2016-10-19 | 豊田合成株式会社 | Ledランプの製造方法及び封止材の枡型装置 |
JP6229412B2 (ja) * | 2013-09-30 | 2017-11-15 | 日亜化学工業株式会社 | 発光装置の製造方法 |
CN104576889B (zh) * | 2013-10-17 | 2018-10-26 | 刘艳 | 在led芯片上形成荧光层的方法 |
US10120266B2 (en) | 2014-01-06 | 2018-11-06 | Lumileds Llc | Thin LED flash for camera |
DE102015214360A1 (de) * | 2015-04-29 | 2016-11-03 | Tridonic Jennersdorf Gmbh | Verfahren zum Herstellen eines LED-Moduls |
CN106711313B (zh) * | 2016-12-29 | 2019-05-14 | 浙江瑞丰光电有限公司 | 一种荧光片的封装方法及一种led封装器件 |
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JP3378465B2 (ja) | 1997-05-16 | 2003-02-17 | 株式会社東芝 | 発光装置 |
US7470547B2 (en) * | 2003-07-31 | 2008-12-30 | Biodot, Inc. | Methods and systems for dispensing sub-microfluidic drops |
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2011
- 2011-09-26 JP JP2011208949A patent/JP6066253B2/ja not_active Expired - Fee Related
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2012
- 2012-08-13 EP EP12180282.1A patent/EP2573828A3/en not_active Withdrawn
- 2012-08-29 US US13/598,233 patent/US20130076230A1/en not_active Abandoned
- 2012-08-30 CN CN2012103144759A patent/CN103022322A/zh active Pending
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CN103022322A (zh) | 2013-04-03 |
EP2573828A2 (en) | 2013-03-27 |
EP2573828A3 (en) | 2014-12-31 |
US20130076230A1 (en) | 2013-03-28 |
JP2013069980A (ja) | 2013-04-18 |
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