DE602004015191D1 - Kameramodul - Google Patents
KameramodulInfo
- Publication number
- DE602004015191D1 DE602004015191D1 DE602004015191T DE602004015191T DE602004015191D1 DE 602004015191 D1 DE602004015191 D1 DE 602004015191D1 DE 602004015191 T DE602004015191 T DE 602004015191T DE 602004015191 T DE602004015191 T DE 602004015191T DE 602004015191 D1 DE602004015191 D1 DE 602004015191D1
- Authority
- DE
- Germany
- Prior art keywords
- solid
- imaging device
- state imaging
- optical unit
- receiving elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003287 optical effect Effects 0.000 abstract 5
- 238000003384 imaging method Methods 0.000 abstract 4
- 239000006059 cover glass Substances 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L9/00—Disinfection, sterilisation or deodorisation of air
- A61L9/16—Disinfection, sterilisation or deodorisation of air using physical phenomena
- A61L9/22—Ionisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
- G09G2330/02—Details of power systems and of start or stop of display operation
- G09G2330/021—Power management, e.g. power saving
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
- G09G2330/02—Details of power systems and of start or stop of display operation
- G09G2330/028—Generation of voltages supplied to electrode drivers in a matrix display other than LCD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Theoretical Computer Science (AREA)
- Animal Behavior & Ethology (AREA)
- Epidemiology (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Credit Cards Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003130599A JP4510403B2 (ja) | 2003-05-08 | 2003-05-08 | カメラモジュール及びカメラモジュールの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602004015191D1 true DE602004015191D1 (de) | 2008-09-04 |
Family
ID=32985658
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004018852T Expired - Lifetime DE602004018852D1 (de) | 2003-05-08 | 2004-05-04 | Herstellungsverfahren für ein Kameramodul |
DE602004015191T Expired - Lifetime DE602004015191D1 (de) | 2003-05-08 | 2004-05-04 | Kameramodul |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004018852T Expired - Lifetime DE602004018852D1 (de) | 2003-05-08 | 2004-05-04 | Herstellungsverfahren für ein Kameramodul |
Country Status (7)
Country | Link |
---|---|
US (2) | US7570297B2 (de) |
EP (2) | EP1796376B1 (de) |
JP (1) | JP4510403B2 (de) |
KR (1) | KR100614476B1 (de) |
CN (1) | CN1323550C (de) |
AT (1) | ATE402563T1 (de) |
DE (2) | DE602004018852D1 (de) |
Families Citing this family (84)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4510403B2 (ja) * | 2003-05-08 | 2010-07-21 | 富士フイルム株式会社 | カメラモジュール及びカメラモジュールの製造方法 |
US7061106B2 (en) * | 2004-04-28 | 2006-06-13 | Advanced Chip Engineering Technology Inc. | Structure of image sensor module and a method for manufacturing of wafer level package |
CN1969539A (zh) | 2004-05-04 | 2007-05-23 | 德塞拉股份有限公司 | 紧凑透镜塔形组件 |
US20060109366A1 (en) * | 2004-05-04 | 2006-05-25 | Tessera, Inc. | Compact lens turret assembly |
WO2005125181A1 (ja) * | 2004-06-15 | 2005-12-29 | Renesas Technology Corp. | 光学モジュールの製造方法及び組立装置 |
JP2006032886A (ja) | 2004-06-15 | 2006-02-02 | Fuji Photo Film Co Ltd | 固体撮像装置及びその製造方法及びカメラモジュール |
EP1628493A1 (de) * | 2004-08-17 | 2006-02-22 | Dialog Semiconductor GmbH | Handhabungssystem für Kamera |
JP2006100763A (ja) * | 2004-09-06 | 2006-04-13 | Fuji Photo Film Co Ltd | 固体撮像装置の製造方法及び接合装置 |
EP1648181A1 (de) | 2004-10-12 | 2006-04-19 | Dialog Semiconductor GmbH | Einzelbildabspeichervorrichtung |
KR100630705B1 (ko) * | 2004-10-20 | 2006-10-02 | 삼성전자주식회사 | 카메라 모듈 및 그 제조방법 |
JP4562538B2 (ja) * | 2005-01-31 | 2010-10-13 | モレックス インコーポレイテド | モジュール用ソケット |
FR2881847A1 (fr) * | 2005-02-10 | 2006-08-11 | St Microelectronics Sa | Dispositif comportant un module de camera a mise au point automatique et procede de montage correspondant |
DE102005006756A1 (de) * | 2005-02-15 | 2006-08-17 | Robert Bosch Gmbh | Bildaufnahmesystem |
EP1713126A1 (de) * | 2005-04-14 | 2006-10-18 | Shih-Hsien Tseng | Bildaufnahmevorrichtung und deren Herstellungsverfahren |
JP4684771B2 (ja) * | 2005-06-30 | 2011-05-18 | Hoya株式会社 | 像振れ補正装置 |
US7531773B2 (en) | 2005-09-08 | 2009-05-12 | Flextronics Ap, Llc | Auto-focus and zoom module having a lead screw with its rotation results in translation of an optics group |
FR2891088A1 (fr) * | 2005-09-20 | 2007-03-23 | St Microelectronics Sa | Structure de montage d'un objectif mobile au-dessus d'un capteur optique |
KR100658149B1 (ko) | 2005-11-25 | 2006-12-15 | 삼성전기주식회사 | 이미지센서 모듈과 이를 포함하는 카메라 모듈 패키지 |
US20090040360A1 (en) * | 2006-02-24 | 2009-02-12 | Koji Taniguchi | Imaging device and portable terminal device |
KR100770690B1 (ko) * | 2006-03-15 | 2007-10-29 | 삼성전기주식회사 | 카메라모듈 패키지 |
KR100770684B1 (ko) * | 2006-05-18 | 2007-10-29 | 삼성전기주식회사 | 카메라 모듈 패키지 |
KR100823686B1 (ko) | 2006-08-23 | 2008-04-18 | 삼성전기주식회사 | 카메라 모듈 패키지 및 그 조립방법 |
KR100795181B1 (ko) | 2006-08-23 | 2008-01-16 | 삼성전기주식회사 | 카메라 모듈 패키지 및 그 조립방법 |
KR100810284B1 (ko) * | 2006-09-28 | 2008-03-06 | 삼성전자주식회사 | 카메라 모듈과 그 제조 방법 |
JP5154783B2 (ja) * | 2006-11-14 | 2013-02-27 | オリンパス株式会社 | 撮像モジュールの製造方法 |
KR100868052B1 (ko) * | 2006-12-05 | 2008-11-10 | 삼성전기주식회사 | 카메라 모듈 패키지 및 그 조립방법 |
JP2008148222A (ja) * | 2006-12-13 | 2008-06-26 | Matsushita Electric Ind Co Ltd | 固体撮像装置とその製造方法 |
US20080170141A1 (en) * | 2007-01-11 | 2008-07-17 | Samuel Waising Tam | Folded package camera module and method of manufacture |
WO2008133943A1 (en) * | 2007-04-24 | 2008-11-06 | Flextronics Ap Llc | Small form factor modules using wafer level optics with bottom cavity and flip chip assembly |
US7825985B2 (en) * | 2007-07-19 | 2010-11-02 | Flextronics Ap, Llc | Camera module back-focal length adjustment method and ultra compact components packaging |
CN100592131C (zh) * | 2007-10-24 | 2010-02-24 | 鸿富锦精密工业(深圳)有限公司 | 摄像模组 |
CN101420526B (zh) * | 2007-10-26 | 2011-06-08 | 鸿富锦精密工业(深圳)有限公司 | 影像感测器承载装置及相机模组 |
DE102007055322B4 (de) * | 2007-11-20 | 2012-09-06 | Continental Automotive Gmbh | Herstellungsverfahren für eine Kamera |
US9350976B2 (en) | 2007-11-26 | 2016-05-24 | First Sensor Mobility Gmbh | Imaging unit of a camera for recording the surroundings with optics uncoupled from a circuit board |
DE102007057172B4 (de) * | 2007-11-26 | 2009-07-02 | Silicon Micro Sensors Gmbh | Stereokamera zur Umgebungserfassung |
US8488046B2 (en) | 2007-12-27 | 2013-07-16 | Digitaloptics Corporation | Configurable tele wide module |
US8031477B2 (en) * | 2008-02-15 | 2011-10-04 | Optoelectronics Co., Ltd. | System and method for coupling a lens to a printed circuit |
JP4667480B2 (ja) * | 2008-03-07 | 2011-04-13 | Okiセミコンダクタ株式会社 | カメラモジュール |
JP5165437B2 (ja) * | 2008-03-27 | 2013-03-21 | シャープ株式会社 | 固体撮像装置、および電子機器 |
TWI459032B (zh) * | 2009-03-09 | 2014-11-01 | 鏡頭模組之組裝方法、組裝設備及檢測方法 | |
TWI464477B (zh) * | 2009-12-22 | 2014-12-11 | Hon Hai Prec Ind Co Ltd | 鏡頭模組及其組裝方法 |
CN102109655B (zh) * | 2009-12-24 | 2013-11-06 | 鸿富锦精密工业(深圳)有限公司 | 镜头模组及其组装方法 |
CN102326382B (zh) * | 2010-03-10 | 2016-04-13 | Smk株式会社 | 摄像机模块 |
EP2553525A1 (de) * | 2010-04-01 | 2013-02-06 | Conti Temic Microelectronic GmbH | Vorrichtung mit optischem modul und trägerplatte |
WO2011120481A1 (de) * | 2010-04-01 | 2011-10-06 | Conti Temic Microelectronic Gmbh | Vorrichtung mit optischem modul und objektivhalter |
KR20110127913A (ko) * | 2010-05-20 | 2011-11-28 | 삼성전자주식회사 | 카메라 모듈 |
US8308379B2 (en) * | 2010-12-01 | 2012-11-13 | Digitaloptics Corporation | Three-pole tilt control system for camera module |
DE102011011527A1 (de) * | 2011-02-17 | 2012-08-23 | Conti Temic Microelectronic Gmbh | Kameramodul |
US10009528B2 (en) | 2011-02-24 | 2018-06-26 | Nan Chang O-Film Optoelectronics Technology Ltd | Autofocus camera module packaging with circuitry-integrated actuator system |
US8545114B2 (en) | 2011-03-11 | 2013-10-01 | Digitaloptics Corporation | Auto focus-zoom actuator or camera module contamination reduction feature with integrated protective membrane |
US8982267B2 (en) | 2011-07-27 | 2015-03-17 | Flextronics Ap, Llc | Camera module with particle trap |
JP5982380B2 (ja) | 2011-08-19 | 2016-08-31 | 富士フイルム株式会社 | 撮像素子モジュール及びその製造方法 |
US9197796B2 (en) * | 2011-11-23 | 2015-11-24 | Lg Innotek Co., Ltd. | Camera module |
US20130258182A1 (en) * | 2012-03-30 | 2013-10-03 | Omnivision Technologies, Inc. | Wafer level camera module with protective tube |
JP5711178B2 (ja) * | 2012-04-06 | 2015-04-30 | オリンパスメディカルシステムズ株式会社 | 撮像装置及びこの撮像装置を用いた内視鏡 |
US9001268B2 (en) | 2012-08-10 | 2015-04-07 | Nan Chang O-Film Optoelectronics Technology Ltd | Auto-focus camera module with flexible printed circuit extension |
KR101500041B1 (ko) * | 2012-12-14 | 2015-03-06 | 엘지이노텍 주식회사 | 카메라 모듈 및 그를 갖는 카메라 장치 |
JP6417396B2 (ja) * | 2013-04-22 | 2018-11-07 | サノフィ−アベンティス・ドイチュラント・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | 注射ペンのためのカメラモジュールを含む補助デバイスの組立て方法および前記補助デバイス |
TWI512961B (zh) * | 2013-08-16 | 2015-12-11 | Azurewave Technologies Inc | 用於降低整體厚度的影像感測模組及其製作方法 |
US9167161B1 (en) | 2013-08-30 | 2015-10-20 | Amazon Technologies, Inc. | Camera module package with a folded substrate and laterally positioned components |
JP6262536B2 (ja) * | 2014-01-08 | 2018-01-17 | 新光電気工業株式会社 | カメラモジュールの製造方法 |
CN105025206B (zh) * | 2014-04-30 | 2018-10-02 | 光宝科技股份有限公司 | 用于增加组装平整度的影像撷取模块及其组装方法 |
CN104219428B (zh) * | 2014-08-21 | 2019-04-26 | 深圳市金立通信设备有限公司 | 一种摄像头安装装置 |
CN104219427A (zh) * | 2014-08-21 | 2014-12-17 | 深圳市金立通信设备有限公司 | 一种摄像头安装方法 |
JP6316979B2 (ja) * | 2014-10-16 | 2018-04-25 | シャープ株式会社 | カメラモジュールの製造方法および製造装置 |
CN107210307B (zh) * | 2015-02-16 | 2021-05-14 | 索尼公司 | 相机模块和电子设备 |
DE102015002534B4 (de) * | 2015-02-28 | 2016-10-06 | Schölly Fiberoptic GmbH | Verfahren zur Fertigung eines Kameramoduls und Kameramodul |
EP3429183A4 (de) * | 2016-03-12 | 2019-12-11 | Ningbo Sunny Opotech Co., Ltd. | Kameramodul und lichtempfindliche bestandteil dafür sowie herstellungsverfahren dafür |
JP2017223739A (ja) * | 2016-06-13 | 2017-12-21 | 富士通株式会社 | 光モジュール及び光モジュール製造方法 |
US10925160B1 (en) | 2016-06-28 | 2021-02-16 | Amazon Technologies, Inc. | Electronic device with a display assembly and silicon circuit board substrate |
US10321028B2 (en) | 2016-07-03 | 2019-06-11 | Ningbo Sunny Opotech Co., Ltd. | Photosensitive assembly and camera module and manufacturing method thereof |
WO2018006673A1 (zh) | 2016-07-03 | 2018-01-11 | 宁波舜宇光电信息有限公司 | 感光组件和摄像模组及其制造方法 |
US20180017741A1 (en) * | 2016-07-15 | 2018-01-18 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device and method of manufacturing the same |
FR3060851B1 (fr) * | 2016-12-20 | 2018-12-07 | 3D Plus | Module optoelectronique 3d d'imagerie |
WO2018210337A1 (zh) * | 2017-05-18 | 2018-11-22 | 宁波舜宇光电信息有限公司 | 摄像模组及其模塑电路板组件和阵列摄像模组以及电子设备 |
JP2019082623A (ja) * | 2017-10-31 | 2019-05-30 | 日本電産三協電子(東莞)有限公司 | 光学ユニット |
TWI657305B (zh) * | 2018-05-04 | 2019-04-21 | 致伸科技股份有限公司 | 攝像模組之組裝方法 |
JP2020004901A (ja) * | 2018-06-29 | 2020-01-09 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置および撮像装置の製造方法 |
JP2020150207A (ja) | 2019-03-15 | 2020-09-17 | キヤノン株式会社 | 電子部品およびその製造方法、機器 |
KR20210021172A (ko) | 2019-08-14 | 2021-02-25 | 삼성전자주식회사 | 이미지 센서 칩을 포함하는 반도체 패키지 |
AT522995B1 (de) * | 2019-10-07 | 2021-05-15 | Vexcel Imaging Gmbh | Sensoranordnung |
KR102380310B1 (ko) * | 2020-08-26 | 2022-03-30 | 삼성전기주식회사 | 카메라 모듈 |
KR102560901B1 (ko) * | 2020-11-16 | 2023-07-28 | (주)파트론 | 온도 센서 모듈 |
AT525579B1 (de) | 2022-03-09 | 2023-05-15 | Vexcel Imaging Gmbh | Verfahren und Kamera zur Korrektur eines geometrischen Abbildungsfehlers in einer Bildaufnahme |
Family Cites Families (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4942539A (en) * | 1988-12-21 | 1990-07-17 | Gmf Robotics Corporation | Method and system for automatically determining the position and orientation of an object in 3-D space |
JPH05102448A (ja) | 1991-10-04 | 1993-04-23 | Sony Corp | 固体撮像素子 |
JPH05136384A (ja) * | 1991-11-13 | 1993-06-01 | Toshiba Corp | 固体撮像モジユール |
JPH06113214A (ja) * | 1992-09-28 | 1994-04-22 | Olympus Optical Co Ltd | 固体撮像装置 |
JPH07202152A (ja) * | 1993-12-28 | 1995-08-04 | Olympus Optical Co Ltd | 固体撮像装置 |
KR960015001A (ko) * | 1994-10-07 | 1996-05-22 | 가나이 쓰토무 | 반도체 기판의 제조방법과 피검사체상의 패턴결함을 검사하기 위한 방법 및 장치 |
US6148097A (en) * | 1995-06-07 | 2000-11-14 | Asahi Kogaku Kogyo Kabushiki Kaisha | Optical member inspecting apparatus and method of inspection thereof |
JPH08243078A (ja) * | 1995-03-07 | 1996-09-24 | Fuji Photo Optical Co Ltd | 電子内視鏡の撮像素子組付け体 |
EP0773673A4 (de) * | 1995-05-31 | 2001-05-23 | Sony Corp | Bildaufnahmevorrichtung, methode zu deren herstellung, bildaufnahmeadapter, vorrichtung und methode zur signal- sowie informationsverarbeitung |
JP3498775B2 (ja) * | 1995-05-31 | 2004-02-16 | ソニー株式会社 | 撮像装置 |
US5903662A (en) * | 1995-06-30 | 1999-05-11 | Dci Systems, Inc. | Automated system for placement of components |
JP3594439B2 (ja) * | 1997-02-20 | 2004-12-02 | 松下電器産業株式会社 | カメラ |
JP2956651B2 (ja) * | 1997-05-20 | 1999-10-04 | 日本電気株式会社 | 微細パターン検査装置および検査方法 |
JP3836235B2 (ja) * | 1997-12-25 | 2006-10-25 | 松下電器産業株式会社 | 固体撮像装置及びその製造方法 |
JP4562820B2 (ja) * | 1998-03-02 | 2010-10-13 | 富士フイルム株式会社 | 固体撮像素子の取付方法 |
US6762796B1 (en) * | 1998-08-10 | 2004-07-13 | Olympus Optical Co., Ltd. | Image pickup module having integrated lens and semiconductor chip |
US6215578B1 (en) * | 1998-09-17 | 2001-04-10 | Vanguard International Semiconductor Corporation | Electronically switchable off-axis illumination blade for stepper illumination system |
CN1164085C (zh) * | 1999-08-19 | 2004-08-25 | 三菱电机株式会社 | 摄象装置和摄象机 |
JP4849703B2 (ja) * | 1999-09-03 | 2012-01-11 | ソニー株式会社 | 光学モジュール |
US6483101B1 (en) * | 1999-12-08 | 2002-11-19 | Amkor Technology, Inc. | Molded image sensor package having lens holder |
JP3651577B2 (ja) * | 2000-02-23 | 2005-05-25 | 三菱電機株式会社 | 撮像装置 |
JP4004705B2 (ja) * | 2000-02-29 | 2007-11-07 | 松下電器産業株式会社 | 撮像装置と撮像装置組立方法 |
WO2001065839A1 (fr) * | 2000-03-02 | 2001-09-07 | Olympus Optical Co., Ltd. | Petit module de prise d'images |
JP2001245217A (ja) * | 2000-03-02 | 2001-09-07 | Olympus Optical Co Ltd | 小型撮像モジュール |
JP3607160B2 (ja) * | 2000-04-07 | 2005-01-05 | 三菱電機株式会社 | 撮像装置 |
JP4405062B2 (ja) * | 2000-06-16 | 2010-01-27 | 株式会社ルネサステクノロジ | 固体撮像装置 |
JP3887162B2 (ja) * | 2000-10-19 | 2007-02-28 | 富士通株式会社 | 撮像用半導体装置 |
JP4740405B2 (ja) * | 2000-11-09 | 2011-08-03 | 東京エレクトロン株式会社 | 位置合わせ方法及びプログラム記録媒体 |
JP3540281B2 (ja) * | 2001-02-02 | 2004-07-07 | シャープ株式会社 | 撮像装置 |
JP3490694B2 (ja) * | 2001-03-28 | 2004-01-26 | 三菱電機株式会社 | 撮像装置及びその製造方法 |
JP3613193B2 (ja) * | 2001-03-30 | 2005-01-26 | 三菱電機株式会社 | 撮像装置 |
JP4698874B2 (ja) * | 2001-04-24 | 2011-06-08 | ローム株式会社 | イメージセンサモジュール、およびイメージセンサモジュールの製造方法 |
JP2003032525A (ja) * | 2001-05-09 | 2003-01-31 | Seiko Precision Inc | 固体撮像装置 |
JP2003060948A (ja) * | 2001-06-05 | 2003-02-28 | Seiko Precision Inc | 固体撮像装置 |
JP4000507B2 (ja) * | 2001-10-04 | 2007-10-31 | ソニー株式会社 | 固体撮像装置の製造方法 |
JP2003116067A (ja) * | 2001-10-09 | 2003-04-18 | Mitsubishi Electric Corp | 固体撮像装置の製造方法 |
JP2003244560A (ja) * | 2002-02-21 | 2003-08-29 | Seiko Precision Inc | 固体撮像装置 |
JP2003274294A (ja) * | 2002-03-14 | 2003-09-26 | Mitsubishi Electric Corp | 固体撮像装置 |
JP2003289474A (ja) * | 2002-03-27 | 2003-10-10 | Canon Inc | 画像処理装置、撮像装置、画像処理方法、プログラム、及びコンピュータ読み取り可能な記憶媒体 |
US7074638B2 (en) | 2002-04-22 | 2006-07-11 | Fuji Photo Film Co., Ltd. | Solid-state imaging device and method of manufacturing said solid-state imaging device |
AU2003263519A1 (en) * | 2002-09-30 | 2004-04-19 | Koninklijke Philips Electronics N.V. | Method for assembling a camera module |
JP2004312666A (ja) * | 2003-03-25 | 2004-11-04 | Fuji Photo Film Co Ltd | 固体撮像装置及び固体撮像装置の製造方法 |
JP4510403B2 (ja) * | 2003-05-08 | 2010-07-21 | 富士フイルム株式会社 | カメラモジュール及びカメラモジュールの製造方法 |
US20050036057A1 (en) * | 2003-07-24 | 2005-02-17 | Matsushita Electric Industrial Co., Ltd. | Image pickup device integrated with lens, method and apparatus for manufacturing the same |
JP2005158780A (ja) * | 2003-11-20 | 2005-06-16 | Hitachi Ltd | パターン欠陥検査方法及びその装置 |
KR100539259B1 (ko) * | 2004-04-26 | 2005-12-27 | 삼성전자주식회사 | 자동으로 정렬되는 렌즈를 포함하는 이미지 센서 모듈, 그제조방법 및 렌즈의 자동 초점 조절방법 |
JP4245577B2 (ja) * | 2005-03-22 | 2009-03-25 | シャープ株式会社 | レンズ位置制御装置及び撮像モジュール |
US7639861B2 (en) * | 2005-09-14 | 2009-12-29 | Cognex Technology And Investment Corporation | Method and apparatus for backlighting a wafer during alignment |
JP4781430B2 (ja) * | 2006-05-09 | 2011-09-28 | 東京エレクトロン株式会社 | 撮像位置補正方法及び基板撮像装置 |
-
2003
- 2003-05-08 JP JP2003130599A patent/JP4510403B2/ja not_active Expired - Fee Related
-
2004
- 2004-05-04 DE DE602004018852T patent/DE602004018852D1/de not_active Expired - Lifetime
- 2004-05-04 DE DE602004015191T patent/DE602004015191D1/de not_active Expired - Lifetime
- 2004-05-04 EP EP07002705A patent/EP1796376B1/de not_active Expired - Fee Related
- 2004-05-04 EP EP04252587A patent/EP1475960B1/de not_active Expired - Lifetime
- 2004-05-04 AT AT04252587T patent/ATE402563T1/de not_active IP Right Cessation
- 2004-05-06 US US10/839,231 patent/US7570297B2/en not_active Expired - Fee Related
- 2004-05-07 KR KR1020040032333A patent/KR100614476B1/ko active IP Right Grant
- 2004-05-08 CN CNB200410042264XA patent/CN1323550C/zh not_active Expired - Fee Related
-
2007
- 2007-08-23 US US11/843,821 patent/US20080049127A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20080049127A1 (en) | 2008-02-28 |
US7570297B2 (en) | 2009-08-04 |
EP1475960A3 (de) | 2005-02-02 |
KR20040095732A (ko) | 2004-11-15 |
DE602004018852D1 (de) | 2009-02-12 |
EP1796376A1 (de) | 2007-06-13 |
CN1551619A (zh) | 2004-12-01 |
EP1796376B1 (de) | 2008-12-31 |
EP1475960A2 (de) | 2004-11-10 |
US20040223072A1 (en) | 2004-11-11 |
CN1323550C (zh) | 2007-06-27 |
KR100614476B1 (ko) | 2006-08-22 |
ATE402563T1 (de) | 2008-08-15 |
JP2004335794A (ja) | 2004-11-25 |
EP1475960B1 (de) | 2008-07-23 |
JP4510403B2 (ja) | 2010-07-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE402563T1 (de) | Kameramodul | |
JP4694602B2 (ja) | 固体撮像装置およびそれを備えた電子機器 | |
EP1239519A3 (de) | Bildaufnahmemodul und Bildaufnahmevorrichtung | |
JP2007523568A5 (de) | ||
EP1465411A3 (de) | Kompaktes Kameramodul | |
WO2002069618A3 (de) | Digitale kamera mit einem empfindlichen sensor | |
WO2001091193A3 (en) | Integrated ic chip package for electronic image sensor die | |
EP1708278A3 (de) | Optisches Anordnungsmodul, Linsenhalter und Verfahren zur Herstellung | |
TW202018651A (zh) | 計量錶輔助模組 | |
KR20030034127A (ko) | 사진촬영 기계 혹은 카메라용 소형 촬영장치 | |
KR20200121855A (ko) | 전자 장치 및 카메라 어셈블리 | |
JPH09232548A (ja) | 固体撮像装置 | |
JP2005210628A (ja) | 撮像装置用半導体搭載用基板と撮像装置 | |
TWM583956U (zh) | 相機模組 | |
TW202011101A (zh) | 攝像裝置 | |
JP2006135741A (ja) | 固体撮像装置及びこれを備えた電子機器 | |
JP2004055574A (ja) | カメラモジュール | |
JP3503467B2 (ja) | カメラ | |
JP2004020603A5 (de) | ||
TWI735070B (zh) | 底座、攝像頭模組及電子裝置 | |
JPH01305789A (ja) | ホワイトバランス装置 | |
JP4492085B2 (ja) | 撮像装置及び携帯端末 | |
TWI670802B (zh) | 晶片封裝結構及相機裝置 | |
CN214845769U (zh) | 光电传感器及测距装置 | |
JP4403770B2 (ja) | 撮像装置及び撮像装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |