DE602004011421D1 - Verdrahtungssubstrat und Elektronikbauteil-Verpackungsstruktur - Google Patents

Verdrahtungssubstrat und Elektronikbauteil-Verpackungsstruktur

Info

Publication number
DE602004011421D1
DE602004011421D1 DE602004011421T DE602004011421T DE602004011421D1 DE 602004011421 D1 DE602004011421 D1 DE 602004011421D1 DE 602004011421 T DE602004011421 T DE 602004011421T DE 602004011421 T DE602004011421 T DE 602004011421T DE 602004011421 D1 DE602004011421 D1 DE 602004011421D1
Authority
DE
Germany
Prior art keywords
electronic component
wiring substrate
packaging structure
component packaging
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004011421T
Other languages
English (en)
Other versions
DE602004011421T2 (de
Inventor
Kei Murayama
Masahiro Sunohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Publication of DE602004011421D1 publication Critical patent/DE602004011421D1/de
Application granted granted Critical
Publication of DE602004011421T2 publication Critical patent/DE602004011421T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25F—COMBINATION OR MULTI-PURPOSE TOOLS NOT OTHERWISE PROVIDED FOR; DETAILS OR COMPONENTS OF PORTABLE POWER-DRIVEN TOOLS NOT PARTICULARLY RELATED TO THE OPERATIONS PERFORMED AND NOT OTHERWISE PROVIDED FOR
    • B25F1/00—Combination or multi-purpose hand tools
    • B25F1/003—Combination or multi-purpose hand tools of pliers'-, scissors'- or wrench-type with at least one movable jaw
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25F—COMBINATION OR MULTI-PURPOSE TOOLS NOT OTHERWISE PROVIDED FOR; DETAILS OR COMPONENTS OF PORTABLE POWER-DRIVEN TOOLS NOT PARTICULARLY RELATED TO THE OPERATIONS PERFORMED AND NOT OTHERWISE PROVIDED FOR
    • B25F1/00—Combination or multi-purpose hand tools
    • B25F1/02—Combination or multi-purpose hand tools with interchangeable or adjustable tool elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26B—HAND-HELD CUTTING TOOLS NOT OTHERWISE PROVIDED FOR
    • B26B13/00—Hand shears; Scissors
    • B26B13/22—Hand shears; Scissors combined with auxiliary implements, e.g. with cigar cutter, with manicure instrument
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/81201—Compression bonding
    • H01L2224/81205—Ultrasonic bonding
    • H01L2224/81206—Direction of oscillation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE602004011421T 2003-04-24 2004-04-16 Verdrahtungssubstrat und Elektronikbauteil-Verpackungsstruktur Expired - Lifetime DE602004011421T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003120499A JP4170137B2 (ja) 2003-04-24 2003-04-24 配線基板及び電子部品実装構造
JP2003120499 2003-04-24

Publications (2)

Publication Number Publication Date
DE602004011421D1 true DE602004011421D1 (de) 2008-03-13
DE602004011421T2 DE602004011421T2 (de) 2008-05-21

Family

ID=32959676

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004011421T Expired - Lifetime DE602004011421T2 (de) 2003-04-24 2004-04-16 Verdrahtungssubstrat und Elektronikbauteil-Verpackungsstruktur

Country Status (7)

Country Link
US (2) US7183647B2 (de)
EP (1) EP1471574B1 (de)
JP (1) JP4170137B2 (de)
KR (1) KR20040092411A (de)
CN (1) CN1541053A (de)
DE (1) DE602004011421T2 (de)
TW (1) TWI337056B (de)

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JP4170137B2 (ja) * 2003-04-24 2008-10-22 新光電気工業株式会社 配線基板及び電子部品実装構造
JP4636850B2 (ja) * 2004-10-29 2011-02-23 富士通株式会社 電子部品の実装方法
WO2007026455A1 (ja) * 2005-08-29 2007-03-08 Murata Manufacturing Co., Ltd. セラミック電子部品及びその製造方法
JP4639147B2 (ja) * 2005-12-14 2011-02-23 インターナショナル・ビジネス・マシーンズ・コーポレーション 誘電体積層基板
US8134081B2 (en) * 2006-01-13 2012-03-13 Panasonic Corporation Three-dimensional circuit board and its manufacturing method
JP2008227309A (ja) 2007-03-14 2008-09-25 Shinko Electric Ind Co Ltd 配線基板およびその製造方法
KR101044203B1 (ko) * 2009-11-18 2011-06-29 삼성전기주식회사 전자기 밴드갭 구조물 및 이를 포함하는 인쇄회로기판
US8237272B2 (en) * 2010-02-16 2012-08-07 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive pillar structure for semiconductor substrate and method of manufacture
KR20120080923A (ko) * 2011-01-10 2012-07-18 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
JP5860256B2 (ja) * 2011-09-26 2016-02-16 京セラサーキットソリューションズ株式会社 配線基板
US9426914B2 (en) * 2012-05-17 2016-08-23 Intel Corporation Film insert molding for device manufacture
KR101483874B1 (ko) * 2013-07-29 2015-01-16 삼성전기주식회사 인쇄회로기판
CN206879237U (zh) * 2014-09-26 2018-01-12 株式会社村田制作所 层叠模块用基板以及层叠模块
CN106449575B (zh) * 2015-08-07 2020-07-24 晶宏半导体股份有限公司 半导体装置的凸块结构
CN207074656U (zh) * 2015-08-10 2018-03-06 株式会社村田制作所 多层基板、部件安装基板
CN208128619U (zh) * 2015-09-01 2018-11-20 株式会社村田制作所 树脂基板以及部件安装树脂基板
WO2017065028A1 (ja) * 2015-10-15 2017-04-20 株式会社村田製作所 樹脂基板、部品実装樹脂基板、および、部品実装樹脂基板の製造方法
JP2017076698A (ja) * 2015-10-15 2017-04-20 日本特殊陶業株式会社 配線基板およびその製造方法
CN207458915U (zh) * 2015-11-10 2018-06-05 株式会社村田制作所 多层基板、部件安装基板
US20190098766A1 (en) * 2016-03-11 2019-03-28 Honda Motor Co., Ltd. Electronic circuit board and ultrasonic bonding method
KR20170107823A (ko) * 2016-03-16 2017-09-26 삼성전자주식회사 스트레스를 분산시킬 수 있는 반도체 장치
JP7260220B2 (ja) * 2019-02-26 2023-04-18 日清紡マイクロデバイス株式会社 半導体装置
DE102019215471B4 (de) * 2019-10-09 2022-05-25 Vitesco Technologies GmbH Elektronisches Bauteil mit einer Kontaktieranordnung und Verfahren zur Herstellung eines elektronischen Bauteils
US10741483B1 (en) * 2020-01-28 2020-08-11 Advanced Semiconductor Engineering, Inc. Substrate structure and method for manufacturing the same
CN115023052A (zh) * 2022-06-29 2022-09-06 生益电子股份有限公司 一种印制电路板以及制备方法、微型发光显示装置

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Also Published As

Publication number Publication date
EP1471574A3 (de) 2006-07-12
US20070114673A1 (en) 2007-05-24
US20040212087A1 (en) 2004-10-28
JP2004327721A (ja) 2004-11-18
TW200501862A (en) 2005-01-01
TWI337056B (en) 2011-02-01
DE602004011421T2 (de) 2008-05-21
JP4170137B2 (ja) 2008-10-22
EP1471574B1 (de) 2008-01-23
US7557450B2 (en) 2009-07-07
US7183647B2 (en) 2007-02-27
CN1541053A (zh) 2004-10-27
EP1471574A2 (de) 2004-10-27
KR20040092411A (ko) 2004-11-03

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