CN208128619U - 树脂基板以及部件安装树脂基板 - Google Patents
树脂基板以及部件安装树脂基板 Download PDFInfo
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- CN208128619U CN208128619U CN201690001116.XU CN201690001116U CN208128619U CN 208128619 U CN208128619 U CN 208128619U CN 201690001116 U CN201690001116 U CN 201690001116U CN 208128619 U CN208128619 U CN 208128619U
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Abstract
本实用新型提供一种树脂基板(20)以及部件安装树脂基板(10)。本实用新型的树脂基板(20)具备:树脂坯体(21),具有通过加热压制来安装部件(30)的安装区域,其中,所述树脂基板(20)具备:热塑性的树脂坯体(21);孔(23),形成在所述树脂坯体(21)的所述安装区域,并从所述树脂坯体(21)的表面贯通至背面;以及镀覆层(24),配置在所述孔(23)的壁面的至少一部分,由比所述树脂坯体(21)硬的材料构成,所述镀覆层(24)形成为,在所述孔(23)中的比所述镀覆层(24)靠中央侧具有连通所述表面侧和所述背面侧的空间。
Description
技术领域
本实用新型涉及在表面安装部件的、由具有可挠性的材料构成的树脂基板。
背景技术
以往,在各种电子设备大多采用部件安装树脂基板。部件安装树脂基板具备树脂基板和电子部件。电子部件安装在树脂基板。
例如,在专利文献1记载的结构中,在热塑性的柔性基板的表面安装有半导体裸芯片。半导体裸芯片通过超声波接合与柔性基板接合。
在先技术文献
专利文献
专利文献1:日本专利第3909772号说明书
实用新型内容
实用新型要解决的课题
热塑性的柔性基板难以进行例如回流焊接等基于整体加热的接合方法。这是因为,在基于整体加热的接合中,柔性基板有可能会软化或者熔融而变形。另一方面,即使在利用了不是整体加热而是部分的加热、加压并施加与其等同的热、压力的超声波接合的情况下,虽然只是一部分,但是柔性基板仍会变软而容易变形。例如,如果是超声波接合,则由于摩擦热,柔性基板会部分变软而容易变形。
此外,在超声波接合的情况下,由于柔性基板的柔韧性,超声波振动会分散而难以进行可得到足够的接合强度的超声波接合。由此,容易产生接合不良。特别是,在由于部件安装树脂基板的功能性的理由而在柔性基板中的安装电子部件的区域设置有孔的情况下,超声波振动更加容易分散。由此,更容易产生接合不良,可靠性也下降。
因此,本实用新型的目的在于,提供一种即使使用热塑性的材料并且是开了孔的形状也能够更可靠地接合电子部件的树脂基板、以及由该树脂基板和电子部件构成的部件安装树脂基板。
用于解决课题的技术方案
本实用新型涉及具备树脂坯体的树脂基板,该树脂坯体具有通过加热压制来安装部件的安装区域,该树脂基板具有如下特征。树脂基板具备热塑性的树脂坯体、孔以及镀覆层。孔形成在树脂坯体的安装区域,并从树脂坯体的表面贯通至背面。镀覆层配置在孔的壁面的至少一部分,由比树脂坯体硬的材料构成。镀覆层形成为,在孔中的比镀覆层靠中央侧具有连通表面侧和背面侧的空间。
在该结构中,通过镀覆层,孔的刚性提高,可抑制将部件与树脂坯体接合时的树脂坯体的变形以及由孔造成的加热压制时的超声波的分散。
此外,本实用新型的树脂基板优选为如下结构。树脂坯体由具有热塑性的多个树脂层层叠而成。在树脂坯体具备在与层叠方向正交的方向上延伸的导体图案。导体图案与镀覆层物理连接。
在该结构中,通过树脂基板的内部的导体图案,可进一步抑制成为接合不良的上述的主要原因。
此外,本实用新型的树脂基板也可以是如下结构。导体图案配置在层叠方向上的多个位置。配置在层叠方向上的不同的位置的导体图案通过镀覆层电连接。
在该结构中,通过镀覆层,能够将具有物理功能的孔兼用作层间连接导体。
此外,本实用新型的树脂基板中,也可以是如下结构。导体图案配置在层叠方向上的大致相同的位置。俯视树脂坯体,配置在层叠方向上的大致相同的位置的导体图案与部件的安装用连接盘导体重叠。
在该结构中,包括部件的安装用连接盘导体的部分在内,能够提高接合时的刚性。
此外,本实用新型的树脂基板优选为如下结构。树脂坯体具备厚度不同的多个区域。在厚度大的区域设置孔,并在该部分安装有部件。
在该结构中,在树脂基板中具备容易变形的部分和不易变形的部分,在不易变形的部分安装有部件。因此,更加不易产生将部件安装到树脂基板时的接合不良,且作为树脂基板还能够具备容易变形(弯曲)的部分。
此外,本实用新型涉及具备树脂基板和安装在树脂基板的部件的部件安装树脂基板,其具有如下特征。
树脂基板具备热塑性的树脂坯体、孔以及镀覆层。孔形成在树脂坯体中的部件的安装区域,并从树脂坯体的表面贯通至背面。镀覆层配置于孔的壁面的至少一部分,由比树脂坯体硬的材料构成。部件经由超声波接合部安装在树脂基板。镀覆层形成为,在孔中的比镀覆层靠中央侧具有连通表面侧和背面侧的空间。
在该结构中,通过镀覆层,孔的刚性提高,可抑制将部件与树脂坯体接合时的树脂坯体的变形以及由孔造成的超声波的分散。
此外,本实用新型涉及部件安装树脂基板的制造方法,其具有如下特征。该制造方法具有层叠具有热塑性的多个树脂层而形成树脂坯体的工序。该制造方法具有在树脂坯体形成孔的工序。该制造方法具有在孔的壁面的至少一部分形成由比树脂坯体硬的材料覆盖的镀覆层的工序。该制造方法具有通过加热压制将部件与树脂坯体接合而使得在俯视树脂坯体时与孔重叠的工序。
在该制造方法中,由于孔被镀覆层加强,所以即使在开孔后通过加热压制时的超声波接合对部件进行接合,孔也不易变形,且超声波不易由于孔而分散,部件被可靠地安装到树脂基板。
实用新型效果
根据本实用新型,即使使用热塑性的材料且是开了孔的形状,也能够更可靠地将部件与树脂基板进行接合。
附图说明
图1是本实用新型的第一实施方式涉及的部件安装树脂基板的分解立体图。
图2是本实用新型的第一实施方式涉及的部件安装树脂基板的外观立体图。
图3是示出本实用新型的第一实施方式涉及的部件安装树脂基板的构造的剖视图。
图4(A)是示出本实用新型的第一实施方式涉及的树脂基板的制造过程中的构造的外观立体图。
图4(B)是示出本实用新型的第一实施方式涉及的树脂基板的制造过程中的构造的外观立体图。
图5(A)是示出本实用新型的第一实施方式涉及的树脂基板的制造过程中的构造的外观立体图。
图5(B)是示出本实用新型的第一实施方式涉及的树脂基板的制造过程中的构造的外观立体图。
图6是示出本实用新型的第一实施方式涉及的部件安装树脂基板的制造方法的流程图。
图7是示出本实用新型的第二实施方式涉及的部件安装树脂基板的结构的剖视图。
图8是示出本实用新型的第三实施方式涉及的部件安装树脂基板的结构的剖视图。
图9是示出本实用新型的第四实施方式涉及的部件安装树脂基板的结构的剖视图。
图10是示出本实用新型的另一个接合方式的剖视图。
具体实施方式
参照附图对本实用新型的第一实施方式涉及的树脂基板、部件安装树脂基板以及部件安装树脂基板的制造方法进行说明。图1是本实用新型的第一实施方式涉及的部件安装树脂基板的分解立体图。图2是本实用新型的第一实施方式涉及的部件安装树脂基板的外观立体图。图3是示出本实用新型的第一实施方式涉及的部件安装树脂基板的构造的剖视图。图4 (A)、图4(B)图5(A)、图5(B)是示出本实用新型的第一实施方式涉及的树脂基板的制造过程中的构造的外观立体图。图6是示出本实用新型的第一实施方式涉及的部件安装树脂基板的制造方法的流程图。
如图1所示,部件安装树脂基板10具备树脂基板20和部件30。树脂基板20具备树脂坯体21、多个安装用连接盘导体221、内层导体图案222、223、设置在树脂坯体21的孔23、以及镀覆层24。
树脂坯体21由具有热塑性的材料构成。例如,树脂坯体21以液晶聚合物为主材料。
多个安装用连接盘导体221形成在树脂坯体21的表面(安装面)。多个安装用连接盘导体221为矩形的导体图案。多个安装用连接盘导体 221由与安装到树脂坯体21的部件30的端子导体31的配置图案相应的配置图案形成。
在树脂坯体21设置有从表面贯通到背面的孔23。俯视树脂坯体21,孔23配置在被多个安装用连接盘导体221包围的区域内,即,配置于在部件30被安装到树脂基板20(树脂坯体21)的状态下被部件30覆盖的区域(对应于本实用新型的“安装区域”。)内。孔23实现导光通路、通气通路、散热通路等物理功能,作为主功能,并不是取得导通。
在孔23的壁面形成有镀覆层24。镀覆层24由比热塑性的树脂坯体21的材料硬的材料构成。例如,镀覆层24由金属镀层构成。另外,镀覆层24只要形成在孔23的壁面的至少一部分即可,但是优选形成在孔23 的壁面的整个面。
部件30例如由半导体芯片等构成,在壳体的一个面具备多个端子导体31。在端子导体31形成有焊料凸块310等。
如图2、图3所示,部件30以端子导体31经由焊料凸块310与安装用连接盘导体221接合的状态安装在树脂基板20。部件30相对于树脂基板20通过超声波接合进行安装。
在此,构成树脂基板20的树脂坯体21具有热塑性,因此在通过超声波接合将部件30安装到树脂基板20时,树脂坯体21会由于摩擦热而软化。此外,容易产生在现有的课题中也示出的那样的超声波振动容易分散等对接合的不良影响。特别是,在存在未进行镀覆的孔的情况下,树脂坯体21更容易变形,因此更容易产生超声波振动容易分散等对接合的不良影响。
然而,在本实施方式的树脂基板20中,通过在设置于树脂坯体21的孔23形成有镀覆层24,从而即使由超声波接合造成的热以及振动施加于树脂坯体21,形成在孔23的镀覆层24也会进行加强,树脂坯体21不易变形。此外,能够通过镀覆层24抑制由孔23造成的超声波振动的分散。因此,能够抑制将部件30安装到树脂基板20时的接合不良。
由这样的结构构成的部件安装树脂基板10通过图6所示的工序经过图4(A)、图4(B)、图5(A)、图5(B)所示的构造的过程进行制造。
首先,如图4(A)所示,准备多个热塑性树脂膜(对应于本实用新型的“树脂层”。)201、202、203、204,并在所需位置形成导体图案(S101)。例如,在热塑性树脂膜201的表面形成安装用连接盘导体221。另外,虽然在本实施方式中示出了使用4层热塑性树脂膜形成树脂基板20的方式,但是层数也可以是其它的层数。
接着,如图4(B)所示,通过将多个热塑性树脂膜201、202、203、 204层叠并进行加热压制,从而形成在给定位置形成了导体图案的树脂坯体21(S102)。
接着,如图5(A)所示,形成从树脂坯体21的表面贯通到背面的孔 23(S103)。孔23例如通过向树脂坯体21照射激光等而形成。
接着,如图5(B)所示,对孔23的壁面的至少一部分形成镀覆层24 (S104)。镀覆层24通过非电解镀覆、电解镀覆等已知的镀覆方法来形成。
接着,对树脂基板20安装部件30。此时,部件30通过超声波接合(超声波焊接)安装到树脂基板20(S105)。
通过使用这样的制造方法,从而能够在被部件30覆盖的部分形成孔 23,同时抑制由孔23造成的超声波接合时的部件30与树脂基板20的接合不良。
接着,参照图对本实用新型的第二实施方式涉及的树脂基板、部件安装树脂基板进行说明。图7是示出本实用新型的第二实施方式涉及的部件安装树脂基板的结构的剖视图。
相对于第一实施方式涉及的部件安装树脂基板10,本实施方式涉及的部件安装树脂基板10A的树脂基板20A的结构不同。其它的结构与第一实施方式涉及的部件安装树脂基板10相同。
相对于树脂基板20,树脂基板20A还具备内层导体图案222A、223A。内层导体图案222A、223A为在与树脂基板20A(树脂坯体21)的厚度方向(多个树脂膜的层叠方向)正交的方向上延伸的形状。内层导体图案 222A、223A配置在树脂基板20A的厚度方向上的不同的位置。
内层导体图案222A、223A相对于镀覆层24进行连接。通过设为这样的结构,从而内层导体图案222A和内层导体图案223A通过镀覆层24 电连接。即,镀覆层24作为层间连接导体而发挥功能。
即使是这样的结构,也能够得到与第一实施方式相同的作用效果。
此外,内层导体图案222A、223A延伸的方向与镀覆层24延伸的方向正交。因此,内层导体图案222A、223A作为将镀覆层24固定到树脂坯体21时的锚固构件而发挥功能。由此,能够抑制由超声波接合时的树脂坯体21的软化以及具有孔23造成的影响,能够进一步抑制部件30与树脂基板20A的接合不良。
接着,参照图对本实用新型的第三实施方式涉及的树脂基板以及部件安装树脂基板进行说明。图8是示出本实用新型的第三实施方式涉及的部件安装树脂基板的结构的剖视图。
相对于第一实施方式涉及的部件安装树脂基板10,本实施方式涉及的部件安装树脂基板10B的树脂基板20B的结构不同。其它的结构与第一实施方式涉及的部件安装树脂基板10相同。
相对于树脂基板20,树脂基板20B还具备内层导体图案222B、223B、 224。内层导体图案222B、223B、224为在与树脂基板20B(树脂坯体21) 的厚度方向(多个树脂膜的层叠方向)正交的方向上延伸的形状。
内层导体图案224相对于镀覆层24物理连接。俯视树脂基板20B(树脂坯体21),内层导体图案224与安装用连接盘导体221重叠。
通过设为这样的结构,从而内层导体图案224作为将镀覆层24固定到树脂坯体21时的锚固构件而发挥功能。由此,能够进一步提高孔23的刚性。此外,因为内层导体图案224作为部件30的安装区域中的基座而发挥功能,所以能够抑制安装区域中的树脂坯体21的变形。因此,能够进一步抑制部件30与树脂基板20B的接合不良。
另外,内层导体图案224优选与树脂基板20B的背面相比更靠近表面 (安装面),越靠近,越能够得到接合不良的抑制效果。
接着,参照图对本实用新型的第四实施方式涉及的树脂基板以及部件安装树脂基板进行说明。图9是示出本实用新型的第四实施方式涉及的部件安装树脂基板的结构的剖视图。
相对于第一实施方式涉及的部件安装树脂基板10,本实施方式涉及的部件安装树脂基板10C的树脂基板20C的结构不同。其它的结构与第一实施方式涉及的部件安装树脂基板10相同。
树脂基板20C具备部件安装部20C1、布线部20C2以及外部连接端子部20C3。部件安装部20C1经由布线部20C2与外部连接端子部20C3连接。部件安装部20C1、布线部20C2以及外部连接端子部20C3一体形成。部件安装部20C1的树脂坯体比布线部20C2的树脂坯体厚。外部连接端子部20C3的树脂坯体比布线部20C2的树脂坯体厚。另外,外部连接端子部 20C3的树脂坯体也可以是与布线部20C2的树脂坯体相同的厚度。
在部件安装部20C1的表面形成有安装用连接盘导体221。在部件安装部20C1的树脂坯体形成有从表面贯通到背面的孔23。在孔23的壁面形成有镀覆层24。即,部件安装部20C1具备上述的实施方式所示的树脂基板的构造。在部件安装部20C1形成有内层导体图案222C、223C和布线导体图案226的延伸的方向上的一端侧的一部分。部件30以端子导体 31与安装用连接盘导体221接合的状态安装在部件安装部20C1。
在布线部20C2形成有布线导体图案226的延伸的方向上的中央部。在外部连接端子部20C3形成有布线导体图案226的延伸的方向上的另一端侧的一部分。在外部连接端子部20C3的表面形成有外部连接端子227。外部连接端子部20C3通过层间连接导体228与布线导体图案226连接。
通过这样的结构,通过布线导体图案226将相对于形成在部件安装部 20C1的电路部、部件30的引绕的导体图案(省略了图示。)布线至外部连接端子部20C3,并在外部连接端子部20C3处经由层间连接导体228与外部连接端子227连接。
而且,通过设为这样的结构,从而部件30安装在厚度大且不易变形的部件安装部20C1。因此,能够进一步抑制部件30与树脂基板20C接合时的接合不良。此外,作为部件安装树脂基板10C,因为布线部20C2容易变形,所以能够使该布线部20C2弯曲而配置到其它部件。由此,能够在实现多种多样的配置方式的同时抑制部件30剥离,提高可靠性。
另外,虽然在上述的说明中示出了由焊料凸块和导体图案(电极等) 形成超声波接合部的方式,但是即使是由导体图案彼此形成超声波接合部的方式,也能够应用上述的结构。
此外,如图10所示,也可以使用各向异性导电膜将端子导体与安装用连接盘导体进行接合。图10是示出本实用新型的另一个接合方式的剖视图。
相对于第一实施方式涉及的部件安装树脂基板10,图10所示的部件安装树脂基板10D的不同点在于,焊料凸块310变更为各向异性导电膜 320。部件安装树脂基板10D的其它结构与部件安装树脂基板10相同,省略相同的部位的说明。
如图10所示,部件30的端子导体31与树脂基板20的安装用连接盘导体221通过各向异性导电膜320进行接合。作为具体的制造方法,配置各向异性导电膜320,使得覆盖端子导体31或安装用连接盘导体221。将部件30配置在树脂基板20,使得各向异性导电膜320与端子导体31和安装用连接盘导体221抵接。在该状态下,通过对各向异性导电膜320进行加热压制,从而实现端子导体31与安装用连接盘导体221的接合,即,实现部件30与树脂基板20的接合。
像这样,即使是使用了各向异性导电膜的方式,也能够实现上述的各实施方式的作用效果。另外,各向异性导电膜也能够应用于第二实施方式、第三实施方式、第四实施方式。
附图标记说明
10、10A、10B、10C、10D:部件安装树脂基板;
20、20A、20B、20C:树脂基板;
21:树脂坯体;
23:孔;
24:镀覆层;
30:部件;
31:端子导体;
201、202、203、204:热塑性树脂膜;
20C1:部件安装部;
20C2:布线部;
20C3:外部连接端子部;
221:安装用连接盘导体;
222A、222B、222C、223A、223B、223C、224:内层导体图案;
226:布线导体图案;
227:外部连接端子;
228:层间连接导体;
310:焊料凸块;
320:各向异性导电膜。
Claims (6)
1.一种树脂基板,具备:树脂坯体,具有通过加热压制来安装部件的安装区域,其中,
所述树脂基板具备:
热塑性的树脂坯体;
孔,形成在所述树脂坯体的所述安装区域,并从所述树脂坯体的表面贯通至背面;以及
镀覆层,配置在所述孔的壁面的至少一部分,由比所述树脂坯体硬的材料构成,
所述镀覆层形成为,在所述孔中的比所述镀覆层靠中央侧具有连通所述表面侧和所述背面侧的空间。
2.根据权利要求1所述的树脂基板,其中,
所述树脂坯体由具有热塑性的多个树脂层层叠而成,
在所述树脂坯体具备在与层叠方向正交的方向上延伸的导体图案,
所述导体图案与所述镀覆层物理连接。
3.根据权利要求2所述的树脂基板,其中,
所述导体图案配置在所述层叠方向上的多个位置,
配置在所述层叠方向上的不同的位置的导体图案通过所述镀覆层电连接。
4.根据权利要求2所述的树脂基板,其中,
所述导体图案配置在所述层叠方向上的大致相同的位置,
俯视所述树脂坯体,配置在该层叠方向上的大致相同的位置的导体图案与所述部件的安装用连接盘导体重叠。
5.根据权利要求1至4中的任一项所述的树脂基板,其中,
所述树脂坯体具备厚度不同的多个区域,
在厚度大的区域设置所述孔,并安装有所述部件。
6.一种部件安装树脂基板,具备:
树脂基板;以及
部件,安装在所述树脂基板,其中,
所述树脂基板具备:
热塑性的树脂坯体;
孔,形成在所述树脂坯体中的所述部件的安装区域,并从所述树脂坯体的表面贯通至背面;以及
镀覆层,配置在所述孔的壁面的至少一部分,由比所述树脂坯体硬的材料构成,
所述部件经由超声波接合部安装在所述树脂基板,
所述镀覆层形成为,在所述孔中的比所述镀覆层靠中央侧具有连通所述表面侧和所述背面侧的空间。
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JPH05152692A (ja) | 1991-11-25 | 1993-06-18 | Nitto Denko Corp | フレキシブルプリント基板 |
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JP2000068328A (ja) * | 1998-08-21 | 2000-03-03 | Olympus Optical Co Ltd | フリップチップ実装用配線基板 |
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JP3855947B2 (ja) | 2003-03-10 | 2006-12-13 | 株式会社村田製作所 | 電子部品装置およびその製造方法 |
JP4170137B2 (ja) | 2003-04-24 | 2008-10-22 | 新光電気工業株式会社 | 配線基板及び電子部品実装構造 |
JP2006114664A (ja) | 2004-10-14 | 2006-04-27 | Denso Corp | 電子部品およびその製造方法 |
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