JPWO2017038790A1 - 樹脂基板、部品実装樹脂基板、部品実装樹脂基板の製造方法 - Google Patents
樹脂基板、部品実装樹脂基板、部品実装樹脂基板の製造方法 Download PDFInfo
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Abstract
Description
20,20A,20B,20C:樹脂基板
21:樹脂素体
23:孔
24:メッキ層
30:部品
31:端子導体
201,202,203,204:熱可塑性樹脂膜
20C1:部品実装部
20C2:配線部
20C3:外部接続端子部
221:実装用ランド導体
222A,222B,222C,223A,223B,223C,224:内層導体パターン
226:配線導体パターン
227:外部接続端子
228:層間接続導体
310:半田バンプ
320:異方性導電膜
Claims (7)
- 加熱プレスによって部品が実装される実装領域を有する樹脂素体を備えた樹脂基板であって、
熱可塑性の樹脂素体と、
前記樹脂素体の前記実装領域に形成され、実装面から凹む孔と、
前記孔の壁面の少なくとも一部に配置され、前記樹脂素体よりも硬い材料からなるメッキ層と、
を備える樹脂基板。 - 前記樹脂素体は、熱可塑性を有する複数の樹脂層が積層されてなり、
前記樹脂素体には、積層方向に直交する方向に延びる導体パターンを備え、
前記導体パターンは、前記メッキ層に物理的に接続されている、
請求項1に記載の樹脂基板。 - 前記導体パターンは、前記積層方向における複数の位置に配置されており、
前記積層方向の異なる位置に配置された導体パターンは、前記メッキ層によって電気的に接続されている、
請求項2に記載の樹脂基板。 - 前記導体パターンは、前記積層方向における略同じ位置に配置されており、
該積層方向における略同じ位置に配置された導体パターンは、前記樹脂素体を平面視して前記部品の実装用ランド導体に重なっている、
請求項2に記載の樹脂基板。 - 前記樹脂素体は、厚みの異なる複数の領域を備え、
厚みの大きな領域に、前記孔が設けられ、前記部品が実装されている、
請求項1乃至請求項4のいずれかに記載の樹脂基板。 - 樹脂基板と、前記樹脂基板に実装された部品と、を備えた部品実装樹脂基板であって、
前記樹脂基板は、
熱可塑性の樹脂素体と、
前記樹脂素体における前記部品の実装領域に形成された、前記部品の実装面から凹む孔と、
前記孔の壁面の少なくとも一部に配置され、前記樹脂素体よりも硬い材料からなるメッキ層と、
を備え、
前記部品は、超音波接合部を介して前記樹脂基板に実装されている、部品実装樹脂基板。 - 熱可塑性を有する複数の樹脂層を積層して樹脂素体を形成する工程と、
前記樹脂素体に孔を形成する工程と、
前記孔の壁面の少なくとも一部に、前記樹脂基板よりも硬い材料からなるメッキ層を形成する工程と、
前記樹脂素体を平面視して、前記孔に重なるように、加熱プレスによって部品を前記樹脂素体に接合する工程と、
を有する、部品実装樹脂基板の製造方法。
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JP2000068328A (ja) * | 1998-08-21 | 2000-03-03 | Olympus Optical Co Ltd | フリップチップ実装用配線基板 |
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US10741462B2 (en) | 2020-08-11 |
JP6890575B2 (ja) | 2021-06-18 |
WO2017038790A1 (ja) | 2017-03-09 |
US20180182681A1 (en) | 2018-06-28 |
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